EEWORLDEEWORLDEEWORLD

Part Number

Search

84817-501021

Description
High Speed / Modular Connectors M1000 SIG HDR STR P/F STD 5R
CategoryThe connector   
File Size135KB,18 Pages
ManufacturerFCI [First Components International]
Download Datasheet Parametric View All

84817-501021 Overview

High Speed / Modular Connectors M1000 SIG HDR STR P/F STD 5R

84817-501021 Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerFCI [First Components International]
Product CategoryHigh Speed / Modular Connectors
RoHSN
ProductHeaders
Number of Positions30 Position
Number of Rows5 Row
Pitch2 mm
Termination StyleThrough Hole
Housing MaterialLiquid Crystal Polymer (LCP)
Mounting AngleStraight
Contact MaterialCopper Alloy
Factory Pack Quantity384
NUMBER
TYPE
GS-12-110
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
Metral™ 1000 Series – 5 Row
Metral™ 2000 Series – 5 Row
1 of 18
AUTHORIZED BY
DATE
K
10 JUN 14
S ALOSIUS
STATUS
UNRESTRICTED
TABLE OF CONTENTS
1.
2.
3.
OBJECTIVE............................................................................................................................................... 3
SCOPE ...................................................................................................................................................... 3
GENERAL ................................................................................................................................................. 3
3.1.
Usage ................................................................................................................................................. 3
3.2.
Visual ................................................................................................................................................. 4
3.3.
Banned/Restricted Substances ......................................................................................................... 4
3.4.
Manufacturing Processability ............................................................................................................. 4
APPLICABLE DOCUMENTS ................................................................................................................... 4
4.1.
Standards and Specifications ............................................................................................................ 4
4.2.
FCI Documents .................................................................................................................................. 5
4.2.1.
Process Specifications ................................................................................................................... 5
4.2.2.
Standards and Test Specifications ................................................................................................ 5
4.3.
Lab Reports - Supporting Data .......................................................................................................... 5
REQUIREMENTS ...................................................................................................................................... 5
5.1.
Qualification ....................................................................................................................................... 5
5.2.
Material .............................................................................................................................................. 6
5.2.1.
Metallic Parts .................................................................................................................................. 6
5.2.2.
Plastic Parts ................................................................................................................................... 6
5.3.
Finish ................................................................................................................................................. 6
ELECTRICAL CHARACTERISTICS ........................................................................................................ 7
6.1.
Low Level Contact Resistance .......................................................................................................... 7
6.2.
Insulation Resistance......................................................................................................................... 7
6.3.
Dielectric Withstanding Voltage ......................................................................................................... 7
6.4.
Current Rating.................................................................................................................................... 7
6.5.
Capacitance ....................................................................................................................................... 8
6.6.
Inductance ......................................................................................................................................... 8
6.7.
Propagation Delay ............................................................................................................................. 8
6.8.
Characteristic Impedance .................................................................................................................. 8
6.9.
Crosstalk ............................................................................................................................................ 9
MECHANICAL CHARACTERISTICS ..................................................................................................... 10
7.1.
Mating/Unmating Force ................................................................................................................... 10
7.2.
Header Signal Compliant Pin Insertion/Retention Force ................................................................. 10
7.3.
Receptacle Signal Compliant Contact Insertion/Retention Force ................................................... 10
7.4.
PCB Hole Deformation Radius ........................................................................................................ 10
7.5.
PCB Hole Wall Damage .................................................................................................................. 10
ENVIRONMENTAL CONDITIONS.......................................................................................................... 11
8.1.
Thermal Shock ................................................................................................................................. 11
8.2.
Humidity ........................................................................................................................................... 11
8.3.
High Temperature Life ..................................................................................................................... 11
8.4.
Mixed Flowing Gas (4-Gas) ............................................................................................................. 12
8.5.
Vibration Sinusoidal ......................................................................................................................... 12
8.6.
Mechanical Shock ............................................................................................................................ 12
GS-01-001
4.
5.
6.
7.
8.
Copyright FCI
Form E-3334
Rev F
PDS: Rev :K
STATUS:Released
Printed: Jun 16, 2014
How to generate bin and hex files in IAR and MDK
Inside IAR --- Generate bin file: (1) In options-linker -output-other, select-raw-binary in output, select Include all in module-local, and leave the rest as default; (2) In options-linker -Extra Outp...
zhaojun_xf NXP MCU
Analysis on the current status of China's power semiconductor development
Since I wrote a blog post last month titled "Power Semiconductors Welcome a Good Year for Development", some netizens have asked me what the current status of power semiconductors in China is and what...
天天谈芯 Power technology
UDS on CAN
Can anyone share the UDS specification document? I can't find it online, thank you! -ISO14229 -ISO15765...
sandiage Automotive Electronics
Ask about the strange problem of ZLG7290 double edge trigger
Platform 2440 5.0 BSP I use the ZLG7290 keyboard driver chip. If a key is pressed, a low level will be issued on its INT pin, and a high level will be issued if no key is pressed. Now I use double edg...
ldrxxx Embedded System
Programming of SDS011 PM2.5 detector on 51 MCU
I've been learning about 51 single-chip microcomputers recently. I bought a SDS011 PM2.5 detector and wanted to program it to detect PM2.5 at home. However, I couldn't program it (category). I would l...
飞你莫属 51mcu
How to implement firewall settings to block MAC addresses, requiring to block certain MAC addresses of intranet PCs in certain time periods
How to program a firewall setting that blocks MAC addresses, and requires blocking certain MAC addresses of intranet PCs in certain time periods. For example, from 8 am to 2 pm on Wednesday, block the...
大唐梦 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 650  2304  2359  1430  163  14  47  48  29  4 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号