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Datasheet> All Categories > storage> storage> EDI8F32512V15MZC
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EDI8F32512V15MZC

Description
512Kx32 Static RAM CMOS, High Speed Module
Categorystorage    storage   
File Size255KB，6 Pages
ManufacturerWhite Electronic Designs Corporation
Websitehttp://www.wedc.com/
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EDI8F32512V15MZC Overview

512Kx32 Static RAM CMOS, High Speed Module

EDI8F32512V15MZC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWhite Electronic Designs Corporation
package instructionZIP-72
Reach Compliance Codeunknow
Maximum access time15 ns
JESD-30 codeR-XZMA-T72
memory density16777216 bi
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals72
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX32
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formTHROUGH-HOLE
Terminal locationZIG-ZAG
Maximum time at peak reflow temperatureNOT SPECIFIED

EDI8F32512V15MZC Preview

White Electronic Designs
512Kx32 Static RAM CMOS, High Speed Module
FEATURES
n
n
EDI8F32512V
DESCRIPTION
512Kx32 bit CMOS Static RAM
Random Access Memory
n
n
n
n
Access Times: 15, 20, and 25ns
Individual Byte Selects
Fully Static, No Clocks
TTL Compatible I/O
72 Pin ZIP, No. 173
72 lead SIMM, No. 174 (Gold Option)
Common Data Inputs and Outputs
The EDI8F32512V is a high speed 16 Mb Static RAM
module organized as 512K words by 32 bits. This module is
constructed from four 512Kx8 Static RAMs in SOJ packages
on an epoxy laminate (FR4) board.
Four chip enables (E0#-E3#) are used to independently
enable the four bytes. Reading or writing can be executed on
individual bytes or any combination of multiple bytes through
proper use of selects.
The EDI8F32512V is offered in 72 pin ZIP and 72 lead SIMM
packages, which enable 16 Mb of memory to be placed in
less than 1.3 square inches of board space.
All inputs and outputs are TTL compatible and operate from a
single 3.3V supply. Fully asynchronous circuitry requires no
clocks or refreshing for operation and provides equal access
and cycle times for ease of use.
Pins PD0- PD3, are used to identify module memory density in
applications where alternate modules can be interchanged.
n
High Density Package
n
n
n
n
Single +3.3V (±10%) Supply Operation
* This product is subject to change without notice.
FIG. 1
Pin Configurations and Block Diagram
½½
½½½
½½½
½½½
½½½
½½½
½½½
½
½½
½½
½½
½½
½½½
½½½
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½½½
½½
½½½
½½½
½½½
½½½½
½
½½
½
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½½½½½
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½½½½½
½
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½½
½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½
½½
½½
½½
½½
½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½
½½
½½½½
½
½½½
½½½½
½½½½
½½½½
½½½½½
½½½½½
½½½
½½½
½½½
½½½½½
½½½½½
½½½½½
½½½½½
½
½½
½
½½½½
½½½½
½½½½
½½½½
½½½
½½½½½
½½½½½
½½½½½
½½½½½
½½½
½½½
½½½
½
½½
½
½½½
½½½½½
½½½½½
½½½½½
½½½½½
½½½½
½½
Pin Names
A0-A18
E0#-E3#
W#
G#
DQ0-DQ31
V
CC
V
SS
NC
½½½½½½
½½
½½
½½½½½
½½½½½
½½½
½½½½½
½½½½½
½½½
½½½½½
½½½½½
½½½
½½½½½
½½½½½
½½½
½½½½½½½½½½½½½½½½½
½½½½½½½½½½½½½½½½½½½½
Address Inputs
Chip Enables
Write Enable
Output Enable
Common Data
Input/Output
Power (+3.3V±10%)
Ground
No Connectiona
½½½½½½½½
½½½½½½½½½
½½½½½½½½½½
½½½½½½½½½
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
Aug, 2002
Rev. 8A
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
ABSOLUTE MAXIMUM RATINGS*
Voltage on any pin relative to V
SS
Operating Temperature TA (Ambient)
Commercial
Storage Temperature, Plastic
Power Dissipation
Output Current
-0.5V to 4.6V
0°C to +70°C
-55°C to +125°C
2.5 Watts
20 mA
EDI8F32512V
RECOMMENDED DC OPERATING
CONDITIONS
Parameter
Supply Voltage
Supply Voltage
Input High Voltage
Input Low Voltage
Sym
V
CC
V
SS
V
IH
V
IL
Min
3.0
0
2.2
-0.3
Typ
3.3
0
--
--
Max
3.6
0
V
CC
+0.3
0.8
Units
V
V
V
V
*Stress greater than those listed under "Absolute Maximum Ratings" may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions greater than those indicated in the
operational sections of this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect reliability.
AC TEST CONDITIONS
Input Pulse Levels
Input Rise and Fall Times
Input and Output Timing Levels
Output Load
(Note: For t
EHQZ
,t
GHQZ
and t
WLQZ
, CL = 5pF)
V
SS
to 3.0V
5ns
1.5V
1TTL, CL = 30pF
DC ELECTRICAL CHARACTERISTICS
Parameter
Operating Power Supply Current
Standby (TTL) Power Supply Current
Full Standby Power Supply Current
CMOS
Input Leakage Current
Output Leakage Current
Output High Voltage
Output Low Voltage
*Typical: TA = 25°C, V
CC
= 5.0V
Sym
I
CC
1
I
CC
2
I
CC
3
I
LI
I
LO
V
OH
V
OL
Conditions
W#, E# = V
IL
, II/O = 0mA, Min Cycle
E# > V
IH
, V
IN
> V
IL
or V
IN
> V
IH
E# > V
CC
-0.2V
V
IN
> V
CC
=0.2V or V
IN
> 0.2V
V
IN
= 0V to V
CC
V I/O = 0V TO V
CC
I
OH
= -4.0mA
I
OL
= 8.0mA
Min
Typ*
Max
800
240
40
±20
±20
--
0.4
Units
mA
mA
mA
µA
µA
V
V
--
--
2.4
--
--
--
--
--
TRUTH TABLE
E#
H
L
L
L
W#
X
H
L
H
G#
X
L
X
H
Mode
Standby
Read
Write
Output
Deselect
Output
HIGH Z
D
OUT
D
IN
HIGH Z
Power
I
CC
2/I
CC
3
I
CC
1
I
CC
1
I
CC
1
Parameter
Address Lines
Data Lines
Chip Enable Line
Write Line
CAPACITANCE
(f=1.0MHz, V
IN
=V
CC
or V
SS
)
Sym
CI
CD/Q
CC
CN
Max
45
20
20
45
Unit
pF
pF
pF
pF
These parameters are sampled, not 100% tested.
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
Aug, 2002
Rev. 8A
2
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
AC CHARACTERISTICS READ CYCLE
Parameter
Read Cycle Time
Address Access Time
Chip Enable Access
Chip Enable to Output in Low Z (1)
Chip Disable to Output in High Z (1)
Output Hold from Address Change
Output Enable to Output Valid
Output Enable to Output in Low Z (1)
Output Disable to Output in High (1)
Notes: 1. Parameter guaranteed, but not tested.
EDI8F32512V
Symbol
JEDEC
t
AVAV
t
AVQV
t
ELQV
t
ELQX
t
EHQZ
t
AVQX
t
GLQV
t
GLQX
t
GHQZ
Alt.
t
RC
t
AA
t
ACS
t
CLZ
t
CHZ
t
OH
t
OE
t
OLZ
t
OHZ
Min
15
15ns
Max
15
15
3
7
3
7
0
7
0
3
3
Min
20
20ns
Max
20
20
3
10
3
8
0
8
Min
25
25ns
Max
25
25
12
10
10
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
FIG. 2
READ CYCLE 1 - W# HIGH, G#, E# LOW
½
½½½½
½
½½½½½½½½½
½½½½½½½½½
½
½½½½
½
½½½½
½½½½½½
½
½½½½½½½½½½½½½½½½
½½½½½½
FIG. 3
READ CYCLE 2 - W# HIGH
½
½½½½
½
½
½½½½
½½
½
½½½½
½
½½½½
½½
½
½½½½
½
½½½½
½
½½½½
½
½½½½½½½½½½½½½½½½
½
½½½½
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
Aug, 2002
Rev. 8A
3
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
AC CHARACTERISTICS WRITE CYCLE
Parameter
Write Cycle Time
Chip Enable to End of Write
Address Setup Time
Address Valid to End of Write
Write Pulse Width
Write Recovery Time
Data Hold Time
Write to Output in High Z (1)
Data to Write Time
Output Active from End of Write (1)
Notes: 1. Parameter guaranteed, but not tested.
EDI8F32512V
Symbol
JEDEC
t
AVAV
t
ELWH
t
WLEH
t
AVWL
t
AVEL
t
AVWH
t
AHEH
t
WLWH
t
ELEH
t
WHAX
t
EHAX
t
WHDX
t
EHDX
t
WLQZ
t
DVWH
t
DVEH
t
WHQX
Alt.
t
WC
t
CW
t
CW
t
AS
t
AS
t
AW
t
AW
t
WP
t
WP
t
WR
t
WR
t
DH
t
DH
t
WHZ
t
DW
t
DW
t
WLZ
Min
15
10
10
0
0
10
10
10
10
0
0
0
0
0
7
7
3
15ns
Max
Min
20
15
15
0
0
15
15
15
15
0
0
0
0
0
9
9
3
20ns
Max
Min
25
20
20
0
0
15
15
15
15
0
0
0
0
0
10
10
3
25ns
Max
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
6
8
12
FIG. 4
WRITE CYCLE 1 - W# CONTROLLED
½
½½½½
½
½½
½
½½½½
½
½½½½
½
½½½½
½
½½½½
½½
½
½
½½½½
½
½½½½
½
½½½½
½½½½½½½½½½
½
½½½½
½
½½½½½½½½½½½½½½½½½½½
½
½½½½
½½½½½½
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
Aug, 2002
Rev. 8A
4
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
FIG. 5
WRITE CYCLE 2 - E# CONTROLLED
EDI8F32512V
½
½½½½
½
½
½½½½
½
½½½½
½½
½
½½½½
½
½½½½
½
½½½½
½½
½
½½½½
½
½½½½
½
½
½½½½½½½½½½½½½½½½½½½
½½½½½½½½½½
½½½½½½
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
Aug, 2002
Rev. 8A
5
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
More (Only the first 5 pages are displayed. Please Download Datasheet to view the full content.) >

EDI8F32512V15MZC Related Products

EDI8F32512V15MZC EDI8F32512V EDI8F32512V20MZC EDI8F32512V25MZC EDI8F32512V25MMC EDI8F32512V15MMC EDI8F32512V20MMC
Description 512Kx32 Static RAM CMOS, High Speed Module 512Kx32 Static RAM CMOS, High Speed Module 512Kx32 Static RAM CMOS, High Speed Module 512Kx32 Static RAM CMOS, High Speed Module 512Kx32 Static RAM CMOS, High Speed Module 512Kx32 Static RAM CMOS, High Speed Module 512Kx32 Static RAM CMOS, High Speed Module
Is it Rohs certified? incompatible - incompatible incompatible incompatible incompatible incompatible
Maker White Electronic Designs Corporation - White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation
package instruction ZIP-72 - ZIP-72 ZIP-72 SIMM-72 SIMM-72 SIMM-72
Reach Compliance Code unknow - unknow unknow unknown unknow unknow
Maximum access time 15 ns - 20 ns 25 ns 25 ns 15 ns 20 ns
JESD-30 code R-XZMA-T72 - R-XZMA-T72 R-XZMA-T72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72
memory density 16777216 bi - 16777216 bi 16777216 bi 16777216 bit 16777216 bi 16777216 bi
Memory IC Type SRAM MODULE - SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE
memory width 32 - 32 32 32 32 32
Number of functions 1 - 1 1 1 1 1
Number of terminals 72 - 72 72 72 72 72
word count 524288 words - 524288 words 524288 words 524288 words 524288 words 524288 words
character code 512000 - 512000 512000 512000 512000 512000
Operating mode ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C - 70 °C 70 °C 70 °C 70 °C 70 °C
organize 512KX32 - 512KX32 512KX32 512KX32 512KX32 512KX32
Package body material UNSPECIFIED - UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY - MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL - PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 3.6 V - 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V - 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount NO - NO NO NO NO NO
technology CMOS - CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL - COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form THROUGH-HOLE - THROUGH-HOLE THROUGH-HOLE NO LEAD NO LEAD NO LEAD
Terminal location ZIG-ZAG - ZIG-ZAG ZIG-ZAG SINGLE SINGLE SINGLE
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED

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