|
SN74AUC32244ZKER |
SN74AUC32244GKER |
| Description |
32-Bit Buffer/Driver with 3-State Outputs 96-LFBGA -40 to 85 |
32-Bit Buffer/Driver with 3-State Outputs 96-LFBGA -40 to 85 |
| Brand Name |
Texas Instruments |
Texas Instruments |
| Is it Rohs certified? |
conform to |
incompatible |
| Parts packaging code |
BGA |
BGA |
| package instruction |
LFBGA, BGA96,6X16,32 |
LFBGA, BGA96,6X16,32 |
| Contacts |
96 |
96 |
| Reach Compliance Code |
compli |
_compli |
| Factory Lead Time |
1 week |
1 week |
| Control type |
ENABLE LOW |
ENABLE LOW |
| Counting direction |
UNIDIRECTIONAL |
UNIDIRECTIONAL |
| series |
AUC |
AUC |
| JESD-30 code |
R-PBGA-B96 |
R-PBGA-B96 |
| JESD-609 code |
e1 |
e0 |
| length |
13.5 mm |
13.5 mm |
| Load capacitance (CL) |
15 pF |
15 pF |
| Logic integrated circuit type |
BUS DRIVER |
BUS DRIVER |
| MaximumI(ol) |
0.009 A |
0.009 A |
| Humidity sensitivity level |
3 |
2 |
| Number of digits |
4 |
4 |
| Number of functions |
8 |
8 |
| Number of ports |
2 |
2 |
| Number of terminals |
96 |
96 |
| Maximum operating temperature |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
| Output characteristics |
3-STATE |
3-STATE |
| Output polarity |
TRUE |
TRUE |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
LFBGA |
LFBGA |
| Encapsulate equivalent code |
BGA96,6X16,32 |
BGA96,6X16,32 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
| Package form |
GRID ARRAY, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
| method of packing |
TR |
TR |
| Peak Reflow Temperature (Celsius) |
260 |
235 |
| power supply |
1.2/2.5 V |
1.2/2.5 V |
| Maximum supply current (ICC) |
0.04 mA |
0.04 mA |
| Prop。Delay @ Nom-Su |
2.8 ns |
2.8 ns |
| propagation delay (tpd) |
2.8 ns |
2.8 ns |
| Certification status |
Not Qualified |
Not Qualified |
| Maximum seat height |
1.4 mm |
1.4 mm |
| Maximum supply voltage (Vsup) |
2.7 V |
2.7 V |
| Minimum supply voltage (Vsup) |
0.8 V |
0.8 V |
| Nominal supply voltage (Vsup) |
1.2 V |
1.2 V |
| surface mount |
YES |
YES |
| technology |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Lead (Sn/Pb) |
| Terminal form |
BALL |
BALL |
| Terminal pitch |
0.8 mm |
0.8 mm |
| Terminal location |
BOTTOM |
BOTTOM |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
| translate |
N/A |
N/A |
| width |
5.5 mm |
5.5 mm |