EEWORLDEEWORLDEEWORLD

Part Number

Search

MAPLAD15KP22CTR

Description
Trans Voltage Suppressor Diode, 15000W, 22V V(RWM), Bidirectional, 1 Element, Silicon, PLASTIC PACKAGE-1
CategoryDiscrete semiconductor    diode   
File Size215KB,5 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

MAPLAD15KP22CTR Overview

Trans Voltage Suppressor Diode, 15000W, 22V V(RWM), Bidirectional, 1 Element, Silicon, PLASTIC PACKAGE-1

MAPLAD15KP22CTR Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionPLASTIC PACKAGE-1
Contacts1
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum breakdown voltage29.8 V
Minimum breakdown voltage24.4 V
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 codeS-PSSO-G1
JESD-609 codee0
Humidity sensitivity level1
Maximum non-repetitive peak reverse power dissipation15000 W
Number of components1
Number of terminals1
Package body materialPLASTIC/EPOXY
Package shapeSQUARE
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityBIDIRECTIONAL
Maximum power dissipation2.5 W
Certification statusNot Qualified
Maximum repetitive peak reverse voltage22 V
surface mountYES
technologyAVALANCHE
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1
PLAD15KP5.0 thru PLAD15KP400CA, e3
15,000 W SURFACE MOUNT TRANSIENT
VOLTAGE SUPPRESSOR
SCOTTSDALE DIVISION
DESCRIPTION
These Microsemi 15 kW Transient Voltage Suppressors (TVSs)
are designed for applications requiring protection of voltage-
sensitive electronic devices that may be damaged by harsh or
severe voltage transients including lightning per IEC61000-4-5 and
classes with various source impedances described herein. This
series is available in 5.0 to 400 volt standoff voltages (V
WM
) in both
unidirectional and bidirectional offered in one surface mount
device. Microsemi also offers numerous other TVS products to
meet higher and lower power demands and special applications.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
FEATURES
Available in both Unidirectional and Bidirectional
construction (Bidirectional with C or CA suffix)
Low profile surface mount
Available in tape-and-reel or waffle pack
Selections for 5.0 to 400 volts standoff voltages (V
WM
)
Suppresses transients up to 15,000 watts @ 10/1000 µs
(see Figure 1)
Fast response
Optional 100%
screening for avionics grade
is
available by adding MA prefix to part number for added
100% temperature cycle -55
o
C to +125
o
C (10X) as well
as surge (3X) and 24 hours HTRB with post test V
Z
&
I
R
(in the operating direction for unidirectional or both
directions for bidirectional)
Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, and JANTXV are also available
by adding MQ, MX, or MV prefixes respectively to part
numbers.
Moisture classification is Level 1 with no dry pack
required per IPC/JEDEC J-STD-020B
RoHS compliant devices available by adding “e3” suffix
APPLICATIONS / BENEFITS
Protection from switching transients and induced RF
Protection from ESD, and EFT per IEC 61000-4-2
and IEC 61000-4-4
Secondary lightning protection per IEC61000-4-5 with
42 Ohms source impedance:
Class 1,2,3,4: PLAD15KP5.0A to 400A or CA
Class 5: PLAD15KP5.0A to 400A or CA
Secondary lightning protection per IEC61000-4-5 with
12 Ohms source impedance:
Class 1,2,3,4: PLAD15KP5.0A to 400A or CA
Secondary lightning protection per IEC61000-4-5 with
2 Ohms source impedance:
Class 2,3: PLAD15KP5.0A to 400A or CA
Class 4: PLAD15KP5.0 to 54A or CA
Pin injection protection per RTCA/DO-160D for
Waveform 4 (6.4/69 µs):
Level 4: PLAD15KP5.0A to 400A or CA
Level 5: PLAD15KP5.0A to 100A or CA
Pin injection protection per RTCA/DO-160D for
Waveform 5A (40/120 µs):
Level 4: PLAD15KP5.0A to 28A or CA
MAXIMUM RATINGS
Operating and Storage temperature: -55
º
C to +150
º
C
Peak Pulse Power dissipation at 25
º
C: 15,000 watts at
10/1000
μs
(also see Figures 1 and 2)
Impulse repetition rate (duty factor): 0.05%
t
clamping
(0 volts to V
(BR)
min.): < 100 ps theoretical for
unidirectional and < 5 ns for bidirectional
Thermal resistance: 0.2 C/W junction to case or 50
º
C/W
junction to ambient when mounted on FR4 PC board with
recommended mounting pad (see last page)
Steady-State Power dissipation: 50 watts at T
C
= 100
o
C
with good heat sink, or 2.5 watts at T
A
= 25
º
C if mounted on
FR4 PC board as described for thermal resistance
Forward Surge Voltage: 3.5 V maximum @ 500 Amps 8.3
ms half-sine wave (unidirectional devices only)
Solder temperatures: 260
º
C for 10 s (maximum)
Copyright
©
2007
10-12-2007 REV G
MECHANICAL AND PACKAGING
CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
TERMINALS: Tin-Lead or RoHS Compliant
annealed matte-Tin plating readily solderable per
MIL-STD-750, method 2026
MARKING: Body marked with part number
POLARITY: For unidirectional devices, the cathode
is on the metal backside (package bottom)
WEIGHT: 1 gram (approximate)
TAPE & Reel: Standard per EIA-481-B (add “TR”
suffix to part number)
See package dimensions on last page
PLAD15KP5.0- 400CA, e3
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
Temperature control program
Temperature control program...
用心思考 MCU
Wireless systems are not upgradeable (6) – what are we worried about?
[b][u][size=16px][color=#033660]Myth 5: Wireless systems are not upgradeable[/color][/size][/u][/b] [size=16px]Upgrading a wireless network only becomes a problem if you choose the wrong technology. [...
小瑞 RF/Wirelessly
[Silicon Labs Development Kit Review] + First Project & GPIO Control LED
Start with a simple application, build a GPIO control project, and get familiar with the SSv5 project creation process, simulation, program download, etc. Use the user LED lights and user buttons on t...
anger0925 Development Kits Review Area
[LPC54102] JLINK debugging encountered problems
A few days ago, the official routine compilation passed, and there were no problems in IAR and KEIL. However, I encountered a problem when I used jlink to connect the board for debugging today. My boa...
muxb NXP MCU
Common problems and solutions when using mobile phones ~ very practical ~ ~
With the improvement of people's living standards and the need for communication tools, most people choose to use mobile phones as their most commonly used communication tools. With more tools, there ...
eenginet RF/Wirelessly
Exchange the ADI DSP BF518 development board for an original TI 9B96 development board, even an unpacked one will do.
Exchange the ADI DSP BF518 development board for an original TI 9B96 development board, even an unpacked one will do. If you are interested, please contact QQ: 307799870 The board has a USB programmin...
sblpp Buy&Sell

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1218  561  1330  2878  1493  25  12  27  58  31 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号