PCS3I8504A
General Purpose Peak EMI
Reduction IC
Functional Description
PCS3I8504A is a versatile, 3.3 V Timing−Safe™ Peak EMI
reduction IC. PCS3I8504A accepts an input clock either from a
fundamental Crystal or from an external reference (AC or DC coupled
to XIN/CLKIN) and locks on to it delivering a 1x modulated clock
output. PCS3I8504A has a SSON pin for enabling and disabling
Spread Spectrum function.
PCS3I8504A has an SSEXTR pin to select different deviations
depending upon the value of an external resistor connected between
SSEXTR and GND. Modulation Rate (MR) control selects one of the
two different Modulation Rates.
PCS3I8504A operates from a 3.3 V supply, and is available in an
8−pin, WDFN(2 mm x 2 mm) package.
General Features
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MARKING
DIAGRAMS
1
WDFN8
CASE 511AQ
1
DBMG
G
DB = Specific Device Code
M = Date Code
G
= Pb−Free Device
(Note: Microdot may be in either location)
•
1x, LVCMOS Peak EMI Reduction
•
Input frequency:
•
•
•
•
•
•
•
♦
15 MHz
−
50 MHz
Output frequency:
♦
15 MHz
−
50 MHz
Analog Deviation Selection
ModRate selection option
Spread Spectrum Enable/Disable
Supply Voltage: 3.3 V
$
0.3 V
8−pin, WDFN 2 mm x 2 mm (TDFN) Package
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
PIN CONFIGURATION
XIN/CLKIN 1
XOUT 2
SSON 3
GND 4
8
7
6
5
VDD
SSEXTR
MR
ModOUT
PCS3I8504A
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
Application
•
PCS3I8504A is targeted for consumer electronics application like
DPF, MFP.
©
Semiconductor Components Industries, LLC, 2013
August, 2013
−
Rev. 0
1
Publication Order Number:
PCS3I8504A/D
PCS3I8504A
SSON
MR
VDD
XIN/CLKIN
XOUT
Crystal
Oscillator
ModOUT
PLL
GND
SSEXTR
Figure 1. Block Diagram
Table 1. PIN DESCRIPTION
Pin#
1
2
3
4
5
6
7
8
Pin Name
XIN / CLKIN
XOUT
SSON
GND
ModOUT
MR
SSEXTR
V
DD
Type
I
O
I
P
O
I
I
P
Description
Crystal connection or External reference clock input.
Crystal connection. If using an external reference, this pin should be left open.
Spread Spectrum ON/OFF. Spread Spectrum function enabled when HIGH, disabled when
LOW. Has an internal pull−up resistor.
Ground
Modulated clock output
Modulation Rate Select. When LOW selects Low Modulation Rate. Selects High Modulation
Rate when pulled HIGH. Has an internal pull−up resistor.
Analog Deviation Selection through external resistor to GND.
3.3 V supply Voltage.
Table 2. OPERATING CONDITIONS
Symbol
V
DD
T
A
C
L
C
IN
Supply Voltage
Operating Temperature
Load Capacitance
Input Capacitance
Industrial
Parameter
Min
3
−40
Max
3.6
85
10
7
Unit
V
°C
pF
pF
Table 3. ABSOLUTE MAXIMUM RATING
Symbol
V
DD
, V
IN
T
STG
T
s
Parameter
Voltage on any input pin with respect to Ground
Storage Temperature
Max. Soldering Temperature (10 sec)
Rating
−0.5
to +4.6
−65
to +125
260
Unit
V
°C
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may
affect device reliability.
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2
PCS3I8504A
Table 3. ABSOLUTE MAXIMUM RATING
Symbol
T
J
T
DV
Junction Temperature
Static Discharge Voltage (As per JEDEC STD22− A114−B)
Parameter
Rating
150
1500
Unit
°C
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may
affect device reliability.
Table 4. DC ELECTRICAL CHARACTERISTICS
Symbol
VDD
V
IL
V
IH
I
IL
I
IH
V
OL
V
OH
I
CC
I
DD
Z
o
Parameter
Supply Voltage
Input LOW Voltage
Input HIGH Voltage
Input LOW Current
Input HIGH Current
Output LOW Voltage
Output HIGH Voltage
Static Supply Current
Dynamic Supply Current
Output Impedance
V
IN
= 0 V
V
IN
= V
DD
I
OL
= 8 mA
I
OH
=
−8
mA
XIN / CLKIN pulled low
Unloaded Output
30
2.4
50
20
2.0
25
25
0.4
Test Conditions
Min
3.0
Typ
3.3
Max
3.6
0.8
Unit
V
V
V
mA
mA
V
V
mA
mA
W
Table 5. SWITCHING CHARACTERISTICS
Parameter
Input Frequency* / ModOUT
Duty Cycle (Notes 1 and 2)
Output Rise Time (Notes 1 and 2)
Output Fall Time (Notes 1 and 2)
Cycle−to−Cycle Jitter (Note 2)
PLL Lock Time (Note 2)
Measured at V
DD
/ 2
Measured between 20% to 80%
Measured between 80% to 20%
Unloaded output with SSEXTR OPEN @ 27 MHz
Stable power supply, valid clock presented on XIN / CLKIN
$150
Test Conditions
Min
15
45
50
Typ
Max
50
55
1.8
1.6
$250
3
Unit
MHz
%
ns
ns
ps
ms
*Functionality with Crystal is guaranteed by design and characterization. Not tested in production.
1. All parameters are specified with10 pF loaded outputs.
2. Parameter is guaranteed by design and characterization. Not tested in production.
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3
PCS3I8504A
TYPICAL CRYSTAL SPECIFICATIONS
FUNDAMENTAL AT CUT PARALLEL RESONANT CRYSTAL
Nominal frequency
Frequency tolerance
Operating temperature range
Storage temperature
Load capacitance (C
P
)
Shunt capacitance
ESR
NOTE:
27 MHz
$50
ppm or better at 25°C
−25°C
to +85°C
−40°C
to +85°C
18 pF
7 pF maximum
25
W
C
L
is the Load Capacitance and Rx is used to prevent oscillations at overtone frequency of the Fundamental frequency.
PCS3I8504A
R
XIN/CLKIN
Crystal
XOUT
Rx
C
L
C
L
C
L
= 2 * (C
P
– C
S
),
Where C
P
= Load capacitance of crystal from crystal vendor datasheet
C
S
= Stray capacitance due to C
IN
, PCB, Trace etc.
Figure 2. Typical Crystal Interface Circuit
SWITCHING WAVEFORMS
t
1
t
2
V
DD
/2
OUTPUT
V
DD
/2
V
DD
/2
Figure 3. Duty Cycle Timing
80%
20%
OUTPUT
t
3
80%
20%
t
4
Figure 4. Output Rise/Fall Time
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4
PCS3I8504A
Noise Reduction Filter
R
C
L
is the load capacitance
for proper XTAL operation
V
DD
PCS3I8504A
1 XIN/CLKIN
VDD
8
C
C
L
2 XOUT
SSEXTR
7
External Deviation Control
VDD
3 SSON
SSON
Control
MR
6
MR Control
4 GND
ModOUT
5
R1
Analog Deviation Control
SSEXTR can be Pulled HIGH
to turn OFF Deviation
C
L
V
DD
NOTE:
SSON (Pin#3) MR (Pin#6): Connect to V
DD
or GND
Refer to Pin Description table for Functionality details
Figure 5. Application Schematic
2.5
2.0
DEVIATION ($%)
1.5
1.0
0.5
0.0
MR = 0
2.5
2.0
DEVIATION ($%)
1.5
1.0
0.5
0.0
0
MR = 1
0
50
100
150
200
250
300
50 100 150 200 250 300 350 400 450 500 550 600 650
RESISTANCE (kW)
RESISTANCE (kW)
Figure 6. Deviation vs SSEXTR Resistance
Chart at 27 MHz
NOTE:
Figure 7. Deviation vs SSEXTR Resistance
Chart at 27 MHz
Device to Device variation of Deviation is
$10%
(Commercial Temperature Range) and
$25%
(Industrial Temperature Range)
ORDERING INFORMATION
Part Number
PCS3I8504AG−08CR
Top
Marking
DB
Temperature
−40°C
to +85°C
Package Type
8−Pin (2 mm x 2 mm) WDFN(TDFN)
(Pb−Free)
Shipping
†
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*A “microdot” placed at the end of last row of marking or just below the last row toward the center of package indicates Pb−Free.
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5
Microcontroller MCU
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