Features
PL
IA
NT
Applications
n
HDMI 1.4
n
Digital Visual Interface (DVI)
n
USB 3.0 / USB OTG
n
Memory protection
n
SIM card ports
n
RoHS compliant*
n
ESD protection >25 kV
n
Low capacitance <0.5 pF
n
Low leakage current <50 nA
*R
oH
S
C
OM
LE
AD
F
RE
E
ChipGuard
®
MLC Series - ESD Protectors
Device Symbol
General Information
The ChipGuard
®
MLC Series has been specifically designed to protect sensitive
electronic components from electrostatic discharge damage. The MLC family has been
designed to protect equipment to IEC61000-4-2, Level 4 (±8 kV Contact / ±15 kV Air
Discharge) ESD specifications targeted for high speed USB 3.0/USB OTG, HDMI 1.4,
DVI or IEEE1394 applications.
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
V
Electrical Characteristics @ 25 °C (unless otherwise noted)
Parameter
Typical Continuous Operating Voltage
Typical Clamping Voltage (Note 1)
Symbol
VDC
VC
CO
IL
VT
RT
3.3LG
3.3
*R
& oHS
AE C
C OM
AP P
PR LI
OV AN
ED T
The ChipGuard
®
MLC Series has been manufactured to provide low 0.5 pF capacitance
and leakage currents less than 5 nA with excellent clamp qualities, making the family
almost transparent under normal working conditions.
C *
AP Ro
PR HS
OV C
ED OM
(S PL
el IAN
ec T
t M
od
el
05LG
5
12LG
12
Maximum Capacitance @ 1 VRMS 1 MHz
Maximum Leakage Current @ Max. VDC
Typical Trigger Voltage (Note 2)
Maximum Response Time
CG0402MLC-
24LG
3.3LGA
24
3.3
25
0.5
5
250
1
05LGA
5
12LGA
12
24LGA
24
Unit
V
V
s)
pF
nA
V
ns
ESD Protection:
Per IEC 61000-4-2 Level 4
Min. Contact Discharge
Min. Air Discharge
Min. Air Discharge
Operating Temperature
Storage Temperature
Parameter
Typical Continuous Operating Voltage
Typical Clamping Voltage (Note 1)
Maximum Capacitance @ 1 VRMS 1 MHz
Maximum Leakage Current @ Max. VDC
Typical Trigger Voltage (Note 2)
Maximum Response Time
ESD Protection:
Per IEC 61000-4-2 Level 4
Min. Contact Discharge
Min. Air Discharge
Min. Air Discharge
AE
TOPR
TSTG
-40 to +85
±8
±15 (Note 3)
±25
-55 to +150
CG0603MLC-
3.3LEA
24LE
24
3.3
0.5
kV
kV
kV
-40 to +125
˚C
˚C
Unit
V
V
pF
nA
V
ns
kV
kV
kV
˚C
˚C
Symbol
VDC
VC
CO
IL
VT
RT
3.3LE
3.3
25
5
250
05LE
5
25
5
250
12LE
12
25
5
250
05LEA
5
12LEA
12
24LEA
24
1
±8
±15 (Note 3)
±25
-55 to +150
Operating Temperature
Storage Temperature
TOPR
TSTG
-40 to +85
-40 to +125
Notes: 1. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement 30 ns after initiation of pulse.
2. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement at maximum pulse voltage.
3. IEC 61000-4-2 ESD Performance will meet minimum 1000 reps without degradation in performance.
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
W
A
L
ChipGuard
®
MLC Series - ESD Protectors
Product Dimensions
A
L
W
A
W
Recommended Pad Layout
C
B
D
A
B
L
DIMENSIONS:
MM
(INCHES)
A
C
D
B
Dimension
L
W
B
A
CG0402
Series
1.00 ± 0.15
(0.04 ± 0.006)
0.50 ± 0.10
(0.02 ± 0.004)
0.36 ± 0.05
(0.014 ± 0.002)
0.25 ± 0.15
(0.10 ± 0.006)
C
B
CG0603
Series
D
1.60
B
± 0.20
(0.064 ± 0.008)
0.80 ± 0.20
(0.032 ± 0.008)
0.45 ± 0.10
(0.018 ± 0.004)
0.30 ± 0.20
(0.012 ± 0.008)
Dim.
A
B
C
D
CG0402
Series
0.51
(0.020)
0.61
(0.024)
0.51
(0.020)
1.70
(0.067)
CG0603
Series
0.76
(0.030)
1.02
(0.040)
0.50
(0.020)
2.54
(0.100)
A
B
Solder Reflow Recommendations
300
250
200
150
100
50
0
110 sec. (min.)
30-70
sec.
Time (seconds)
120 sec. (min.)
Preheat Stages 1-3
Soldering
Cooling
A
B
Stage 1 Preheat
Stage 2 Preheat
Stage 3 Preheat
Main Heating
Ambient to Preheating
Temperature
140 °C to 160 °C
200 °C
210 °C
220 °C
230 °C
240 °C
250 °C to 255 °C
200 °C to 100 °C
Preheat to 200 °C
30 s to 60 s
60 s to 120 s
60 s to 70 s
55 s to 65 s
50 s to 60 s
40 s to 50 s
30 s to 40 s
5s
20 s to 40 s
Temperature (ϒ
C)
C
D
E
Cooling
1 °C/s to 4 °C/s
•
•
•
•
This product can be damaged by rapid heating, cooling or localized heating.
Heat shocks should be avoided. Preheating and gradual cooling recommended.
Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.
A solder gun under 30 watts is recommended.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
ChipGuard
®
MLC Series - ESD Protectors
Packaging Dimensions
13.0 ± 1.0
(0.52 ± 0.04)
8.00 ± 0.30
(0.32 ± 0.012)
4.00 ± 0.10
(0.16 ± 0.004)
C
1.50 ± 0.10
(0.06 ± 0.004)
2.0 ± 0.50
(0.08 ± 0.02)
62.0 ± 1.50
(2.48 ± 0.06)
13.0 ± 0.50
(0.52 ± 0.02)
L
TOP
TAPE
W
G
D
3.50 ± 0.05
(0.14 ± 0.002)
21.0 ± 0.80
(0.84 ± 0.032)
180.8 ± 2.0
(7.12 ± 0.08)
NOTES: TAPE MATERIAL IS PAPER.
0.48 ± 0.03
TAPE THICKNESS IS
(0.019 ± 0.0012)
COVER TAPE ADHESION IS 40 ± 15 GRAMS.
DIMENSIONS:
MM
(INCHES)
9.0 ± 0.50
(0.36 ± 0.02)
Dimension
C
D
L
W
G
CG0402
Series
1.75 ± 0.05
(0.04 ± 0.002)
2.00 ± 0.02
(0.08 ± 0.0008)
1.12 ± 0.03
(0.045 ± 0.0012)
0.62 ± 0.03
(0.025 ± 0.0012)
2.0 ± 0.05
(0.08 ± 0.002)
CG0603
Series
1.75 ± 0.10
(0.04 ± 0.004)
2.00 ± 0.05
(0.08 ± 0.002)
1.80 ± 0.20
(0.072 ± 0.008)
0.90 ± 0.20
(0.036 ± 0.008)
4.0 ± 0.05
(0.16 ± 0.002)
How to Order
CG 0n0n MLC - n.n x x x
ChipGuard
®
Product Designator
Package Option
0402 = 0402 Package
0603 = 0603 Package
Multilayer Series Designator
Operating Voltage**
3.3 = 3.3 V
05 = 5 V
12 = 12 V
24 = 24 V
Low Leakage Current Option
L = Low Leakage Current
Blank = Standard Product
Tape & Reel Packaging
E = 5,000 pcs. per reel (0603 Package)
G = 10,000 pcs. per reel (0402 Package)
Operating Temperature Option
A = Higher +125 °C Operating Temperature
Blank = Standard Product
** Only models lower than 10 volts require
decimal point.
Asia-Pacific:
Tel: +886-2 2562-4117 • Email: asiacus@bourns.com
EMEA:
Tel: +36 88 520 390 • Email: eurocus@bourns.com
The Americas:
Tel: +1-951 781-5500 • Email: americus@bourns.com
www.bourns.com
REV. T 01/17
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Embedded System
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