TVS Diode Arrays
(SPA
®
Diodes)
Low Capacitance ESD Protection - SP3003 Series
SP3003 Series 0.65pF Diode Array
Description
RoHS
Pb
GREEN
The SP3003 has ultra low capacitance rail-to-rail diodes with
an additional zener diode fabricated in a proprietary silicon
avalanche technology to protect each I/O pin providing a
high level of protection for electronic equipment that may
experience destructive electrostatic discharges (ESD). These
robust diodes can safely absorb repetitive ESD strikes at the
maximum level specified in the IEC 61000-4-2 international
standard (Level 4, ±8kV contact discharge) without
performance degradation. Their very low loading capacitance
also makes them ideal for protecting high speed signal pins
such as HDMI, DVI, USB2.0, and IEEE 1394.
Pinout
SP3003-02X/J
SP3003-04X/J
(AEC-Q101 qualified)
Features
SP3003-02UTG
NC
GND
V
CC
I/O 1
I/O 1
GND
I/O 4
V
CC
I/O 3
• ESD protection of ±8kV
contact discharge,
±15kV air discharge, (IEC
61000-4-2)
• EFT protection,
IEC 61000-4-4, 40A
(5/50ns)
• Lightning Protection, IEC
61000-4-5, 2nd edition
2.5A (8/20µs)
• Low capacitance of
0.65pF (TYP) per I/O
Applications
• LCD/ PDP TVs
• Low leakage current of
0.5μA (MAX) at 5V
• Complete line of small
packaging helps save
board space (SC70,
SOT553, SOT563,
MSOP10,
µ
DFN-6L
)
• AEC-Q101 qualified
(µDFN package)
• RoHS compliant and lead-
free
I/O 2
I/O 2
SP3003-04A
I/O 1
I/O 2
V
CC
I/O 3
I/O 4
NC
NC
GND
NC
NC
I/O 1
I/O 2
I/O 3
I/O 4
GND
SP3003-08A
I/O 8
I/O 7
NC
I/O 6
I/O 5
Functional Block Diagram
SP3003-04J/XTG
6
5
4
10
SP3003-04ATG
9
8
7
• Set Top Boxes
• Mobile Phones
• Notebooks
• Computer Peripherals
6
SP3003-02UTG
• DVD Players
• Desktops
• MP3/ PMP
• Digital Cameras
Application Example
DVI/ HDMI Port
D2+
GND
D2-
D1+
GND
1
2
3
1
2
3
4
5
SP3003-02J/XTG
5
4
10
SP3003-08ATG
9
8
7
6
*Package is shown as transparent
Vcc/NC
1
2
3
1
2
3
4
5
D1-
D0+
GND
D0-
CLK+
GND
CLK-
IC
Additional Information
Vcc/NC
Datasheet
Life Support Note:
Resources
Samples
GND
GND
Signal GND
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
A single, 4 channel SP3003-04 device can be used to
protect four (4) of the data lines in a HDMI/DVI interface
so two (2) SP3003-04 devices provide protection for all
eight (8) TMDS lines.
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 02/23/17
TVS Diode Arrays
(SPA
®
Diodes)
Low Capacitance ESD Protection - SP3003 Series
Absolute Maximum Ratings
Symbol
I
PP
T
OP
T
STOR
Parameter
Peak Current (t
p
=8/20μs)
Operating Temperature
Storage Temperature
Value
2.5
–40 to 125
–55 to 150
Units
A
°C
°C
Thermal Information
Parameter
Storage Temperature Range
Maximum Junction Temperature
Maximum Lead Temperature
(Soldering 20-40s)
Rating
–55 to 150
150
260
Units
°C
°C
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Electrical Characteristics
(T
OP
=25ºC)
Parameter
Reverse Standoff Voltage
Reverse Leakage Current
Clamp Voltage
1
Symbol
V
RWM
I
LEAK
V
C
Test Conditions
I
R
≤ 1µA
V
R
=5V
I
PP
=1A, t
p
=8/20µs, Fwd
I
PP
=2A, t
p
=8/20µs, Fwd
IEC61000-4-2 (Contact)
IEC61000-4-2 (Air)
Reverse Bias=0V
Reverse Bias=1.65V
Reverse Bias=0V
±8
±15
0.7
0.55
0.8
0.65
0.35
0.95
0.8
10.0
11.8
Min
Typ
Max
6
0.5
12.0
15.0
Units
V
µA
V
V
kV
kV
pF
pF
pF
ESD Withstand Voltage
1
V
ESD
Diode Capacitance
1
Diode Capacitance
1
C
I/O-GND
C
I/O-I/O
Note: 1. Parameter is guaranteed by design and/or device characterization.
Insertion Loss (S21) I/O to GND
1
0
-1
Capacitance vs. Bias Voltage
1.00
0.95
0.90
I/O Capacitance (pF)
Insertion Loss [dB]
-2
-3
-4
-5
-6
-7
-8
-9
-10
1.E+06
1.E+07
1.E+08
1.E+09
1.E+10
0.85
0.80
0.75
0.70
0.65
0.60
0.55
0.50
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
V
CC
= 5V
V
CC
= 3.3V
V
CC
= Float
Frequency [Hz]
I/O DC Bias (V)
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 02/23/17
TVS Diode Arrays
(SPA
®
Diodes)
Low Capacitance ESD Protection - SP3003 Series
Capacitance vs. Frequency
1.4E-12
Product Characteristics
Lead Plating
Lead Material
Lead Coplanarity
Substitute
Material
Body Material
Flammability
Matte Tin (SC70-x, MSOP-10) Pre-Plated
Frame (SOT5x3,
µ
DFN-6)
Copper Alloy
0.0004 inches (0.102mm)
Silicon
Molded Epoxy
UL 94 V-0
1.2E-12
Capacitance [F]
1E-12
8E-13
6E-13
4E-13
2E-13
0
1.E+06
1.E+07
1.E+08
1.E+09
Frequency [Hz]
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Soldering Parameters
Reflow Condition
- Temperature Min (T
s(min)
)
Pre Heat
- Temperature Max (T
s(max)
)
- Time (min to max) (t
s
)
Average ramp up rate (Liquidus) Temp
(T
L
) to peak
T
S(max)
to T
L
- Ramp-up Rate
Reflow
- Temperature (T
L
) (Liquidus)
- Temperature (t
L
)
Pb – Free assembly
Temperature
T
P
T
L
T
S(max)
Preheat
Ramp-up
t
P
Critical Zone
T
L
to T
P
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260
+0/-5
°C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
t
L
Ramp-do
Ramp-down
T
S(min)
t
S
time to peak temperature
25
Time
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 02/23/17
TVS Diode Arrays
(SPA
®
Diodes)
Low Capacitance ESD Protection - SP3003 Series
Package Dimensions — SC70-5
e
6
5
e
4
E
1
B
D
A2 A
2
3
HE
Package
Recommended Solder Pad Layout
Pins
JEDEC
Millimeters
Min
A
A1
A2
B
c
D
E
L
SC70-5
5
MO-203
Inches
Min
0.031
0.000
0.028
0.006
0.003
0.073
0.045
0.079
0.010
Max
0.043
0.004
0.039
0.012
0.010
0.089
0.053
0.094
0.018
Max
1.10
0.10
1.00
0.30
0.25
2.25
1.35
2.40
0.46
not used
0.80
0.00
0.70
0.15
0.08
1.85
1.15
2.00
0.26
A1
C
e
HE
L
0.65 BSC
0.026 BSC
Package Dimensions — SC70-6
e
6
5
e
4
E
1
B
D
A2 A
2
3
HE
Package
Recommended Solder Pad Layout
Pins
JEDEC
Millimeters
Min
A
A1
A2
B
c
D
E
L
SC70-6
6
MO-203
Inches
Min
0.031
0.000
0.028
0.006
0.003
0.073
0.045
0.079
0.010
Max
0.043
0.004
0.039
0.012
0.010
0.089
0.053
0.094
0.018
Max
1.10
0.10
1.00
0.30
0.25
2.25
1.35
2.40
0.46
0.80
0.00
0.70
0.15
0.08
1.85
1.15
2.00
0.26
A1
C
e
HE
L
0.65 BSC
0.026 BSC
Package Dimensions — SOT553
D
6
5
4
3
A
L
Recommended
Solder Pad Layout
Package
Pins
Millimeters
Min
A
0.50
0.17
0.08
1.50
1.10
0.10
1.50
B
c
D
E
e
L
HE
SOT 553
5
Inches
Min
0.020
0.007
0.003
0.059
0.043
0.004
0.059
Max
0.024
0.011
0.007
0.067
0.051
0.012
0.067
Max
0.60
0.27
0.18
1.70
1.30
0.30
1.70
(not used)
E
2
e
HE
c
B
0.50 BSC
0.020 BSC
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 02/23/17
TVS Diode Arrays
(SPA
®
Diodes)
Low Capacitance ESD Protection - SP3003 Series
Package Dimensions — SOT563
D
6
5
2
e
B
4
3
A
L
Package
Recommended
Solder Pad Layout
Pins
Millimeters
Min
A
0.50
0.17
0.08
1.50
1.10
0.10
1.50
B
c
D
E
e
L
HE
SOT 563
6
Inches
Min
0.020
0.007
0.003
0.059
0.043
0.004
0.059
Max
0.024
0.011
0.007
0.067
0.051
0.012
0.067
Max
0.60
0.27
0.18
1.70
1.30
0.30
1.70
E
HE
c
0.50 BSC
0.020 BSC
Package Dimensions — MSOP10
Package
JEDEC
Pins
Millimeters
Min
A
A1
B
Recommended Solder
Layout
Pad
Recommanded Solder Pad
Layout
c
D
E
E1
e
HE
-
0.00
0.17
0.08
2.90
4.67
2.90
0.40
Max
1.10
0.15
0.27
0.23
3.10
5.10
3.10
0.80
Min
-
0.000
0.007
0.003
0.114
0.184
0.114
0.016
MSOP10
MO-187
10
Inches
Max
0.043
0.006
0.011
0.009
0.122
0.200
0.122
0.031
0.50 BSC
0.020 BSC
Package Dimensions —µDFN-6L
Package
Recommended
Solder Pad Layout
0.4
0.12
0.42
0.11
µ
DFN-6L
MO-229
6
Millimeters
Min
Max
0.55
0.05
0.45
0.25
1.65
-
1.05
-
0.50REF
0.33
0.43
Min
0.018
0.000
0.014
0.006
0.062
-
0.038
-
0.020REF
0.013
0.017
Inches
Max
0.022
0.002
0.018
0.010
0.065
-
0.042
-
JEDEC
Pins
0.62
0.55
0.48
A
A1
A3
b
b1
D
D2
E
E2
e
L
0.45
0.00
0.35
0.15
1.55
-
0.95
-
0.35
0.5
0.55
0.05
0.25
0.4
0.125REF
0.005REF
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 02/23/17
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