DATASHEET
ISL3159E
±15kV ESD Protected, +125°C, 40Mbps, 5V, PROFIBUS, Full Fail-Safe,
RS-485/RS-422 Transceiver
The
ISL3159E
is a ±15kV IEC61000 ESD protected, 5V
powered, single transceiver that meets both the RS-485 and
RS-422 standards for balanced communication. It also
features the larger output voltage and higher data rate (up to
40Mbps) required by high speed PROFIBUS applications, and
is offered in industrial and extended Industrial (-40°C to
+125°C) temperature ranges. The low bus currents
(+220µA/-150µA) present a 1/5 unit load to the RS-485 bus.
This allows up to 160 transceivers on the network without
violating the RS-485 specification’s load limit and without
using repeaters.
This transceiver requires a 5V ±10% tolerance supply, and
delivers at least a 2.1V differential output voltage over this
supply range. This translates into better noise immunity (data
integrity), longer reach, or the ability to drive up to six 120Ω
terminations in “star” or other nonstandard bus topologies, at
the exceptional 40Mbps data rate.
SCSI applications benefit from the ISL3159E’s low receiver
and transmitter part-to-part skews. The ISL3159E is perfect for
high speed parallel applications requiring simultaneous
capture of large numbers of bits. The low bit-to-bit skew eases
the timing constraints on the data latching signal.
Receiver (Rx) inputs feature a “full fail-safe” design, which
ensures a logic high Rx output if Rx inputs are floating,
shorted, or terminated but undriven. Rx outputs feature high
drive levels (typically >30mA at V
OL
= 1V) to ease the design of
optically isolated interfaces.
Hot plug circuitry ensures that the Tx and Rx outputs remain in
a high impedance state while the power supply stabilizes.
Driver (Tx) outputs are short-circuit protected, even for voltages
exceeding the power supply voltage. Additionally, on-chip
thermal shutdown circuitry disables the Tx outputs to prevent
damage if power dissipation becomes excessive.
FN6364
Rev.3.00
Aug 28, 2017
Features
• IEC61000 ESD protection on RS-485 I/O pins . . . . . . ±15kV
- Class 3 HBM ESD level on all other pins . . . . . . . . . . . >9kV
• Large differential V
OUT
. . . . . . . . . . . . . . . . . . . 2.8V into 54Ω
Better noise immunity, or drive up to 6 terminations
• High data rates. . . . . . . . . . . . . . . . . . . . . . . . . . up to 40Mbps
• Specified for +125°C operation
• 11/13ns (maximum) Tx/Rx propagation delays; 1.5ns
(maximum) skew
• 1/5 unit load allows up to 160 devices on the bus
• Full fail-safe (open, shorted, terminated/undriven) receiver
• High Rx I
OL
to drive optocouplers for isolated applications
• Hot plug - Tx and Rx outputs remain three-state during
power-up
• Low quiescent supply current. . . . . . . . . . . . . . . . . . . . . . 4mA
• Low current shutdown mode . . . . . . . . . . . . . . . . . . . . . . . 1µA
• -7V to +12V common-mode input voltage range
• Three-state Rx and Tx outputs
• Operates from a single +5V supply (10% tolerance)
• Current limiting and thermal shutdown for driver overload
protection
• Pb-free (RoHS compliant)
Applications
• PROFIBUS DP and FMS networks
• SCSI “fast 40” drivers and receivers
• Motor controller/position encoder systems
• Factory automation
• Field bus networks
• Security networks
• Building environmental control systems
• Industrial/process control networks
Related Literature
• For a full list of related documents, refer to our website
-
ISL3159E
product page
+5V
+
8
V
CC
1 RO
2 RE
3 DE
4 DI
D
GND
5
R
B/Z
A/Y
7
6
R
T
0.1µF
SOIC AND MSOP PIN NUMBERS SHOWN
0.1µF
+
+5V
8
V
CC
D
DI 4
DE 3
RE 2
R
GND
5
RO 1
R
T
7
6
B/Z
A/Y
FIGURE 1. TYPICAL OPERATING CIRCUIT
FN6364 Rev.3.00
Aug 28, 2017
Page 1 of 17
ISL3159E
Ordering Information
PART NUMBER
(Notes
3, 4)
ISL3159EIBZ (Note
1)
ISL3159EIUZ (Note
1)
ISL3159EIRZ (Note
2)
ISL3159EFBZ (Note
1)
ISL3159EFUZ (Note
1)
ISL3159EFRZ (Note
2)
NOTES:
1. Add “-T” suffix for 2.5k unit or “-T7A” suffix for 250 unit tape and reel options. Refer to
TB347
for details on reel specifications.
2. Add “-T” suffix for 6k unit or “-T7A” suffix for 250 unit tape and reel options. Refer to
TB347
for details on reel specifications.
3. Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
4. For Moisture Sensitivity Level (MSL), refer to the product information page for the
ISL3159E.
For more information on MSL, refer to
TB363.
TABLE 1. KEY DIFFERENCES BETWEEN HIGH-SPEED INTERFACE FAMILY OF PARTS
PART NUMBER
ISL3179E
ISL3180E
ISL3159E
ISL3259E
FULL/HALF DUPLEX
Half
Full
Half
Half
VCC
(V)
3.3
3.3
5
5
VOD
(V)
1.5
1.5
2.1
2.1
DATA RATE
(Mbps)
40
40
40
100
PART MARKING
3159 EIBZ
3159Z
159Z
3159 EFBZ
159FZ
59FZ
TEMP. RANGE
(°C)
-40 to +85
-40 to +85
-40 to +85
-40 to +125
-40 to +125
-40 to +125
PACKAGE
(RoHS Compliant)
8 Ld SOIC
8 Ld MSOP
10 Ld DFN
8 Ld SOIC
8 Ld MSOP
10 Ld DFN
PKG. DWG. #
M8.15
M8.118
L10.3x3C
M8.15
M8.118
L10.3x3C
Pin Configurations
ISL3159E
(8 LD SOIC, MSOP)
TOP VIEW
RO 1
RE 2
DE 3
DI 4
D
R
8
7
6
5
V
CC
B/Z
A/Y
GND
RO
RE
DE
DI
NC
1
2
3
4
5
EP
ISL3159E
(10 LD DFN)
TOP VIEW
10 V
CC
9 NC
8 B/Z
7 A/Y
6 GND
Truth Table
TRANSMITTING
INPUTS
RE
X
X
0
1
DE
1
1
0
0
DI
1
0
X
X
B/Z
0
1
High-Z
High-Z *
OUTPUTS
A/Y
1
0
High-Z
High-Z *
Truth Table
RECEIVING
INPUTS
RE
0
0
0
0
1
1
DE
0
0
0
0
1
0
A-B
V
AB
≥-0.05V
-0.05V >V
AB
>-0.2V
V
AB
≤
-0.2V
Inputs Open/Shorted
X
X
OUTPUT
RO
1
Undetermined
0
1
High-Z
High-Z*
NOTE: *Shutdown mode
NOTE: *Shutdown mode
FN6364 Rev.3.00
Aug 28, 2017
Page 2 of 17
ISL3159E
Pin Descriptions
PIN
RO
FUNCTION
Receiver output.
If A-B
≥
-50mV, RO is high.
If A-B
≤
-200mV, RO is low.
If A and B are unconnected (floating) or shorted, or connected to a terminated bus that is undriven, RO is high.
Receiver output enable.
RO is enabled when RE is low.
RO is high impedance when RE is high.
If the Rx enable function isn’t required, connect RE directly to GND.
Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They are high impedance when DE is low. If the Tx
enable function isn’t required, connect DE to V
CC
through a 1kΩ or greater resistor.
Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low.
Ground connection. This is also the potential of the DFN’s exposed metal pad.
±15kV IEC61000 ESD protected RS-485/422 level, noninverting receiver input and noninverting driver output. This pin is an input (A) if
DE = 0; pin is an output (Y) if DE = 1.
±15kV IEC61000 ESD protected RS-485/422 level, inverting receiver input and inverting driver output. This pin is an input (B) if DE = 0;
pin is an output (Z) if DE = 1.
System power supply input (4.5V to 5.5V).
No internal connection.
The exposed metal pad on the bottom of the DFN; connect to GND.
RE
DE
DI
GND
A/Y
B/Z
V
CC
NC
EP
Typical Operating Circuit
+5V
+
8
V
CC
1 RO
2 RE
3 DE
4 DI
D
GND
5
GND
5
R
B/Z
A/Y
7
6
R
T
R
T
7
6
B/Z
A/Y
R
0.1µF
SOIC AND MSOP PIN NUMBERS SHOWN
0.1µF
+
8
V
CC
D
DI 4
DE 3
RE 2
RO 1
+5V
FIGURE 2. TYPICAL OPERATING CIRCUIT
FN6364 Rev.3.00
Aug 28, 2017
Page 3 of 17
ISL3159E
Absolute Maximum Ratings
V
CC
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI, DE, RE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input/Output Voltages
A/Y, B/Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -9V to +13V
RO. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (V
CC
+0.3V)
Short-circuit Duration
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . . . . . . Refer to
“Electrical Specifications”
Thermal Information
Thermal Resistance (Typical)
JA
(°C/W)
JC
(°C/W)
8 Ld SOIC Package (Notes
5, 7)
. . . . . . . . .
105
60
8 Ld MSOP Package (Notes
5, 7)
. . . . . . . .
140
55
10 Ld DFN Package (Notes
6, 8)
. . . . . . . .
46
3.5
Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . . . . .-65°C to +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to
TB493
Operating Conditions
Temperature Range
ISL3159EF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +125°C
ISL3159EI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
5.
JA
is measured with the component mounted on a high-effective thermal conductivity test board in free air. Refer to
TB379
for details.
6.
JA
is measured in free air with the component mounted on a high-effective thermal conductivity test board with “direct attach” features. Refer to
TB379.
7. For
JC
, the “case temp” location is taken at the package top center.
8. For
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
(Note
9)
PARAMETER
DC CHARACTERISTICS
Driver Differential V
OUT
Test Conditions: V
CC
= 4.5V to 5.5V; unless otherwise specified. Typical values are at V
CC
= 5V, T
A
= +25°C,
TEMP
(°C)
MIN
(Note
19)
MAX
(Note
19)
SYMBOL
TEST CONDITIONS
TYP
UNIT
V
OD
No Load
R
L
= 100Ω (RS-422) (Figure
3A)
R
L
= 54Ω (RS-485)
(Figure
3A)
I Suffix
F Suffix, (Note
18)
Full
Full
Full
Full
Full
Full
-
2.6
2.1
2.1
1.9
-
-
3.4
2.8
2.8
2.7
0.01
V
CC
-
V
CC
V
CC
-
0.2
V
V
V
V
V
R
L
= 60Ω, -7V
≤
V
CM
≤
12V (Figure
3B, Note 18)
Change in Magnitude of Driver
Differential V
OUT
for
Complementary Output States
Driver Common-Mode V
OUT
Change in Magnitude of Driver
Common-Mode V
OUT
for
Complementary Output States
Logic Input High Voltage
Logic Input Low Voltage
Logic Input Current
Input Current (A/Y, B/Z)
V
OD
R
L
= 54Ω or 100Ω (Figure
3A)
V
OC
V
OC
R
L
= 54Ω or 100Ω (Figure
3A, Note 18)
R
L
= 54Ω or 100Ω (Figure
3A)
Full
Full
-
-
2
0.01
3
0.2
V
V
V
IH
V
IL
I
IN1
I
IN2
DI, DE, RE
DI, DE, RE
DI = DE = RE = 0V or V
CC
DE = 0V, V
CC
= 0V or 5.5V V
IN
= 12V
V
IN
= -7V
Full
Full
Full
Full
Full
Full
25
Full
2
-
-2
-
-160
-
-
-200
-
-
-
-
-
-
9
-
-
0.8
2
220
-
±250
-
-50
V
V
µA
µA
µA
mA
pF
mV
Driver Short-Circuit Current,
V
O
= High or Low
Differential Capacitance
Receiver Differential Threshold
Voltage
I
OSD1
C
D
V
TH
DE = V
CC
, -7V
≤
V
Y
or V
Z
≤
12V (Note
11)
A/Y to B/Z
-7V
≤
V
CM
≤
12V
FN6364 Rev.3.00
Aug 28, 2017
Page 4 of 17
ISL3159E
Electrical Specifications
(Note
9)
(Continued)
PARAMETER
Receiver Input Hysteresis
Receiver Output High Voltage
Receiver Output Low Voltage
Receiver Output Low Current
Three-state (high impedance)
Receiver Output Current
Receiver Input Resistance
Receiver Short-Circuit Current
SUPPLY CURRENT
No-Load Supply Current (Note
10)
Shutdown Supply Current
ESD PERFORMANCE
RS-485 Pins (A/Y, B/Z)
Test Conditions: V
CC
= 4.5V to 5.5V; unless otherwise specified. Typical values are at V
CC
= 5V, T
A
= +25°C,
TEMP
(°C)
25
Full
Full
Full
Full
Full
Full
MIN
(Note
19)
-
V
CC
- 0.5
-
25
-1
54
±20
MAX
(Note
19)
-
-
0.4
-
1
-
±110
SYMBOL
V
TH
V
OH
V
OL
I
OL
I
OZR
R
IN
I
OSR
V
CM
= 0V
TEST CONDITIONS
TYP
28
-
-
40
0.015
80
-
UNIT
mV
V
V
mA
µA
kΩ
mA
I
O
= -8mA, V
ID
= -50mV
I
O
= +10mA, V
ID
= -200mV
V
OL
= 1V, V
ID
= -200mV
0.4V
≤
V
O
≤
2.4V
-7V
≤
V
CM
≤
12V
0V
≤
V
O
≤
V
CC
I
CC
I
SHDN
DI = DE = 0V or V
CC
DE = 0V, RE = V
CC
, DI = 0V or V
CC
Full
Full
-
-
2.6
0.05
4
1
mA
µA
IEC61000-4-2, Air-Gap Discharge Method
IEC61000-4-2, Contact Discharge Method
Human Body Model, From Bus Pins to GND
25
25
25
25
25
-
-
-
-
-
±15
±8
±16.5
> ±9
> ±400
-
-
-
-
-
kV
kV
kV
kV
V
All Pins
HBM, per MIL-STD-883 Method 3015
Machine Model
DRIVER SWITCHING CHARACTERISTICS
Maximum Data Rate
Driver Differential Output Delay
Driver Differential Output Skew
Prop Delay Part-to-Part Skew
Driver Differential Rise or Fall
Time
Driver Enable to Output High
Driver Enable to Output Low
Driver Enable Time Skew
Driver Disable from Output High
Driver Disable from Output Low
Driver Disable Time Skew
Time to Shutdown
Driver Enable from Shutdown to
Output High
Driver Enable from Shutdown to
Output Low
f
MAX
t
DD
t
SKEW
t
SKP-P
t
R
, t
F
t
ZH
t
ZL
t
ENSKEW
t
HZ
t
LZ
t
DISSKEW
t
SHDN
V
OD
≥
±1.5V, R
D
= 54Ω, C
L
= 100pF (Figure
6)
R
D
= 54Ω, C
D
= 50pF (Figure
4)
R
D
= 54Ω, C
D
= 50pF (Figure
4)
R
D
= 54Ω, C
D
= 50pF (Figure
4, Note 17)
R
D
= 54Ω, C
D
= 50pF (Figure
4)
R
L
= 110Ω, C
L
= 50pF, SW = GND
(Figure
5, Note 12)
R
L
= 110Ω, C
L
= 50pF, SW = V
CC
(Figure
5, Note 12)
|t
ZH
(Y or Z) - t
ZL
(Z or Y)|
R
L
= 110Ω, C
L
= 50pF, SW = GND (Figure
5)
R
L
= 110Ω, C
L
= 50pF, SW = V
CC
(Figure
5)
|t
HZ
(Y or Z) - t
LZ
(Z or Y)|
(Note
14)
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
40
-
-
-
2
-
-
-
-
-
-
60
-
-
-
8
0.5
-
5
13
11
2.5
14
12
3
-
-
-
-
12
1.5
4
8
20
20
-
20
20
-
600
1000
1000
Mbps
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
t
ZH(SHDN)
R
L
= 110Ω, C
L
= 50pF, SW = GND
(Figure
5, Notes 14, 15)
t
ZL(SHDN)
R
L
= 110Ω, C
L
= 50pF, SW = V
CC
(Figure
5, Notes 14, 15)
RECEIVER SWITCHING CHARACTERISTICS
Maximum Data Rate
Receiver Input to Output Delay
Receiver Skew | t
PLH
- t
PHL
|
Prop Delay Part-to-Part Skew
f
MAX
V
ID
= ±1.5V
Full
Full
Full
Full
40
-
-
-
-
9
0
-
-
13
1.5
4
Mbps
ns
ns
ns
t
PLH
, t
PHL
(Figure
7)
t
SKD
t
SKP-P
(Figure
7)
(Figure
7, Note 17)
FN6364 Rev.3.00
Aug 28, 2017
Page 5 of 17
Embedded System
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