EEWORLDEEWORLDEEWORLD

Part Number

Search

HSMS-270C

Description
UNIDIRECTIONAL, 2 ELEMENT, SILICON, TVS DIODE
Categorysemiconductor    Discrete semiconductor   
File Size105KB,8 Pages
ManufacturerHP(Keysight)
Websitehttp://www.semiconductor.agilent.com/
Download Datasheet View All

HSMS-270C Overview

UNIDIRECTIONAL, 2 ELEMENT, SILICON, TVS DIODE

HSMS-270C Preview

High Performance Schottky
Diode for Transient Suppression
Technical Data
HSMS-2700/-2702
-270B/-270C
Features
• Ultra-low Series Resistance
for Higher Current Handling
• Picosecond Switching
• Low Capacitance
• Lead-free Option Available
Package Lead Code
Identification
(Top View)
SINGLE
3
SERIES
3
Description
The HSMS-2700 series of Schottky
diodes, commonly referred to as
clipping /clamping diodes, are
optimal for circuit and waveshape
preservation applications with
high speed switching. Ultra-low
series resistance, R
S
, makes them
ideal for protecting sensitive
circuit elements against higher
current transients carried on data
lines. With picosecond switching,
the HSMS-270x can respond to
noise spikes with rise times as fast
as 1 ns. Low capacitance mini-
mizes waveshape loss that causes
signal degradation.
Applications
RF and computer designs that
require circuit protection, high-
speed switching, and voltage
clamping.
1
0, B
2
1
2, C
2
HSMS-270x DC Electrical Specifications, T
A
= +25°C
[1]
Part
Package
Number Marking Lead
HSMS- Code
[2]
Code Configuration
-2700
J0
-270B
-2702
J2
-270C
C
B
2
Series
0
Single
Maximum Minimum
Typical
Maximum
Forward Breakdown
Typical
Series
Eff. Carrier
Voltage
Voltage Capacitance Resistance Lifetime
V
F
(mV)
V
BR
(V)
C
T
(pF)
R
S
(Ω)
τ
(ps)
Package
SOT-23
SOT-323
(3-lead SC-70)
SOT-23
SOT-323
(3-lead SC-70)
550
[3]
15
[4]
6.7
[5]
0.65
100
[6]
Notes:
1. T
A
= +25°C, where T
A
is defined to be the temperature at the package pins where contact is made to the circuit board.
2. Package marking code is laser marked.
3. I
F
= 100 mA; 100% tested
4. I
F
= 100
µA;
100% tested
5. V
F
= 0; f =1 MHz
6. Measured with Karkauer method at 20 mA; guaranteed by design.
2
Absolute Maximum Ratings, T
A
= 25ºC
Symbol
I
F
I
F-peak
P
T
P
INV
T
J
T
STG
θ
JC
Parameter
DC Forward Current
Peak Surge Current (1µs pulse)
Total Power Dissipation
Peak Inverse Voltage
Junction Temperature
Storage Temperature
Thermal Resistance, junction to lead
Unit
mA
A
mW
V
°C
°C
°C/W
Absolute Maximum
[1]
HSMS-2700/-2702
350
1.0
250
15
150
-65 to 150
500
HSMS-270B/-270C
750
1.0
825
15
150
-65 to 150
150
Note:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
Linear and Non-linear SPICE Model
0.08 pF
SPICE Parameters
Parameter
BV
CJO
EG
IBV
IS
N
RS
PB
PT
M
Unit
V
pF
eV
A
A
V
Value
25
6.7
0.55
10E-4
1.4E-7
1.04
0.65
0.6
2
0.5
2 nH
R
S
SPICE model
3
Typical Performance
I
F
– FORWARD CURRENT (mA)
I
F
– FORWARD CURRENT (mA)
100
T
J
– JUNCTION TEMPERATURE (°C)
300
500
100
160
Max. safe junction temp.
140 T
A
= +75°C
T
A
= +25°C
120 T
A
= –25°C
100
80
60
40
20
0
0
50
100 150
200
250 300 350
I
F
– FORWARD CURRENT (mA)
10
10
1
1
0.1
0.01
0
0.1
0.2
0.3
T
A
= +75°C
T
A
= +25°C
T
A
= –25°C
0.4
0.5
0.6
V
F
– FORWARD VOLTAGE (V)
0.1
0.01
0
T
A
= +75°C
T
A
= +25°C
T
A
= –25°C
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
V
F
– FORWARD VOLTAGE (V)
Figure 1. Forward Current vs.
Forward Voltage at Temperature for
HSMS-2700 and HSMS-2702.
Figure 2. Forward Current vs.
Forward Voltage at Temperature for
HSMS-270B and HSMS-270C.
Figure 3. Junction Temperature vs.
Forward Current as a Function of
Heat Sink Temperature for the
HSMS-2700 and HSMS-2702.
Note: Data is calculated from SPICE
parameters.
T
J
– JUNCTION TEMPERATURE (°C)
160
Max. safe junction temp.
140 T
A
= +75°C
T
A
= +25°C
120 T = –25°C
A
100
80
60
40
20
0
0
150
300
450
600
750
I
F
– FORWARD CURRENT (mA)
7
C
T
– TOTAL CAPACITANCE (pF)
6
5
4
3
2
1
0
5
10
15
20
V
F
– REVERSE VOLTAGE (V)
Figure 4. Junction Temperature vs.
Current as a Function of Heat Sink
Temperature for HSMS-270B and
HSMS-270C.
Note: Data is calculated from SPICE
parameters.
Figure 5. Total Capacitance vs.
Reverse Voltage.
4
Package Dimensions
Outline SOT-23
1.02 (0.040)
0.89 (0.035)
0.54 (0.021)
0.37 (0.015)
3
1.40 (0.055)
1.20 (0.047)
2
2.04 (0.080)
1.78 (0.070)
TOP VIEW
2.65 (0.104)
2.10 (0.083)
Device Orientation
For Outlines SOT-23/323
REEL
DATE CODE (X)
PACKAGE
MARKING
CODE (XX)
XXX
CARRIER
TAPE
USER
FEED
DIRECTION
COVER TAPE
1
0.60 (0.024)
0.45 (0.018)
TOP VIEW
3.06 (0.120)
2.80 (0.110)
1.02 (0.041)
0.85 (0.033)
0.152 (0.006)
0.066 (0.003)
END VIEW
4 mm
8 mm
0.10 (0.004)
0.013 (0.0005)
SIDE VIEW
DIMENSIONS ARE IN MILLIMETERS (INCHES)
0.69 (0.027)
0.45 (0.018)
END VIEW
ABC
ABC
ABC
ABC
Note: "AB" represents package marking code.
"C" represents date code.
Tape Dimensions and Product Orientation
For Outline SOT-23
P
D
P
2
E
P
0
F
W
t1
D
1
9° MAX
Ko
8° MAX
13.5° MAX
A
0
B
0
DESCRIPTION
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
DIAMETER
PITCH
POSITION
WIDTH
THICKNESS
CAVITY TO PERFORATION
(WIDTH DIRECTION)
CAVITY TO PERFORATION
(LENGTH DIRECTION)
SYMBOL
A
0
B
0
K
0
P
D
1
D
P
0
E
W
t1
F
P
2
SIZE (mm)
3.15
±
0.10
2.77
±
0.10
1.22
±
0.10
4.00
±
0.10
1.00 + 0.05
1.50 + 0.10
4.00
±
0.10
1.75
±
0.10
8.00 +0.30 –0.10
0.229
±
0.013
3.50
±
0.05
2.00
±
0.05
SIZE (INCHES)
0.124
±
0.004
0.109
±
0.004
0.048
±
0.004
0.157
±
0.004
0.039
±
0.002
0.059 + 0.004
0.157
±
0.004
0.069
±
0.004
0.315 +0.012 –0.004
0.009
±
0.0005
0.138
±
0.002
0.079
±
0.002
PERFORATION
CARRIER TAPE
DISTANCE
BETWEEN
CENTERLINE
5
Package Dimensions
Outline SOT-323 (SC-70 3 Lead)
PACKAGE
MARKING
CODE (XX)
1.30 (0.051)
REF.
DATE CODE (X)
2.20 (0.087)
2.00 (0.079)
XXX
1.35 (0.053)
1.15 (0.045)
0.650 BSC (0.025)
2.20 (0.087)
1.80 (0.071)
0.10 (0.004)
0.00 (0.00)
0.425 (0.017)
TYP.
0.30 REF.
0.25 (0.010)
0.15 (0.006)
1.00 (0.039)
0.80 (0.031)
10°
0.30 (0.012)
0.10 (0.004)
0.20 (0.008)
0.10 (0.004)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Tape Dimensions and Product Orientation
For Outline SOT-323 (SC-70 3 Lead)
P
P
0
D
P
2
E
F
W
C
D
1
t
1
(CARRIER TAPE THICKNESS)
T
t
(COVER TAPE THICKNESS)
8° MAX.
K
0
8° MAX.
A
0
B
0
DESCRIPTION
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
DIAMETER
PITCH
POSITION
WIDTH
THICKNESS
WIDTH
TAPE THICKNESS
CAVITY TO PERFORATION
(WIDTH DIRECTION)
CAVITY TO PERFORATION
(LENGTH DIRECTION)
SYMBOL
A
0
B
0
K
0
P
D
1
D
P
0
E
W
t
1
C
T
t
F
P
2
SIZE (mm)
2.40
±
0.10
2.40
±
0.10
1.20
±
0.10
4.00
±
0.10
1.00 + 0.25
1.55
±
0.05
4.00
±
0.10
1.75
±
0.10
8.00
±
0.30
0.254
±
0.02
5.4
±
0.10
0.062
±
0.001
3.50
±
0.05
2.00
±
0.05
SIZE (INCHES)
0.094
±
0.004
0.094
±
0.004
0.047
±
0.004
0.157
±
0.004
0.039 + 0.010
0.061
±
0.002
0.157
±
0.004
0.069
±
0.004
0.315
±
0.012
0.0100
±
0.0008
0.205
±
0.004
0.0025
±
0.00004
0.138
±
0.002
0.079
±
0.002
PERFORATION
CARRIER TAPE
COVER TAPE
DISTANCE
Let's discuss several processes of selecting MOS tubes when designing power supplies.
[color=black]In the design of some circuits, not only in switching power supply circuits, MOS tubes are often used. Correctly selecting MOS tubes is a problem that hardware engineers often encounter, ...
qwqwqw2088 Analogue and Mixed Signal
ZigBee Networking Issues
I would like to ask what are the reasons why the NLME_NetworkFormationRequest() function application fails? Why did the coordinator's device status not change to DEV_ZB_COORD after I established the n...
jane123 RF/Wirelessly
About the problem of single chip microcomputer controlling MAX195 analog-to-digital conversion
I am now making a program to control max195 with a single chip microcomputer. The program is as follows#include reg52.h // Reference the header file of the standard library #include intrins.h#define u...
fly2oo8 51mcu
Allwinner heterogeneous multi-core AI intelligent vision V853 development board evaluation - The following error occurs when compiling eye-mppviplite-driver
## 1. The following error occurs when compiling eye-mppviplite-driver ``` Collected errors: * pkg_hash_check_unresolved: cannot find dependency viplite-driver for eyesee-mpp-middleware * pkg_hash_fetc...
IC爬虫 Domestic Chip Exchange
(Solved) Single-step debugging can turn on and off, but run cannot
Today I used cube to configure a GPIO12 flashing program, but it didn't work after I downloaded it to the board. Later I modified the datalog routine and it worked. I commented out all the redundant o...
wugx MEMS sensors
Burn f240 flash via serial port
Without using an emulator, connect the serial port of 240 to the serial port of the PC. How can I download the compiled program tothe flash of 240? What are the specific steps? Thank you!...
kuangql Microcontroller MCU

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 413  2653  508  1913  1357  9  54  11  39  28 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号