CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
1.
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
DC Operating Characteristics – RTC
Test Conditions: V
DD
= +2.7 to +5.5V, Temperature = -40°C to +85°C, unless otherwise stated.
SYMBOL
V
DD
V
BAT
I
DD1
PARAMETER
Main Power Supply
Battery Supply Voltage
Supply Current
V
DD
= 5V
V
DD
= 3V
I
DD2
I
DD3
I
BAT
I
BATLKG
I
LI
I
LO
V
TRIP
V
TRIPHYS
V
BATHYS
EVIN
V
IL
V
IH
Hysteresis
I
EVPU
EVIN Pullup Current
V
SUP
= 3V
-0.3
0.7 x V
DD
0.05 x V
DD
1.5
0.3 x V
DD
V
DD
+ 0.3
V
V
V
µA
6
Supply Current With I
2
C Active
Supply Current (Low Power Mode)
Battery Supply Current
Battery Input Leakage
Input Leakage Current on SCL
I/O Leakage Current on SDA
V
BAT
Mode Threshold
V
TRIP
Hysteresis
V
BAT
Hysteresis
1.6
10
10
V
DD
= 5V
V
DD
= 5V, LPMODE = 1
V
BAT
= 3V
V
DD
= 5.5V, V
BAT
= 1.8V
100
100
2.2
35
50
2.64
60
100
CONDITIONS
MIN
(Note 9)
2.7
1.8
2
1.2
40
1.4
400
TYP
(Note 5)
MAX
(Note 9)
5.5
5.5
6
4
120
5
950
100
UNITS NOTES
V
V
µA
µA
µA
µA
nA
nA
nA
nA
V
mV
mV
2, 3
2, 8
2
2, 3
IRQ/EVDET and F
OUT
V
OL
Output Low Voltage
V
DD
= 5V, I
OL
= 3mA
V
DD
= 2.7V, I
OL
= 1mA
I
LO
Output Leakage Current
V
DD
= 5.5V
V
OUT
= 5.5V
100
0.4
0.4
400
V
V
nA
Power-Down Timing
Test Conditions: V
DD
= +2.7 to +5.5V, Temperature = -40°C to +85°C, unless otherwise stated.
SYMBOL
V
DD SR-
PARAMETER
V
DD
Negative Slew rate
CONDITIONS
MIN
(Note 9)
TYP
(Note 5)
MAX
(Note 9)
10
UNITS
V/ms
NOTES
4
FN6316 Rev 1.00
July 15, 2010
Page 3 of 24
ISL1221
I
2
C Interface Specifications
Test Conditions: V
DD
= +2.7 to +5.5V, Temperature = -40°C to +85°C, unless otherwise specified.
SYMBOL
V
IL
V
IH
Hysteresis
V
OL
Cpin
f
SCL
t
IN
t
AA
PARAMETER
SDA and SCL Input Buffer LOW
Voltage
SDA and SCL Input Buffer HIGH
Voltage
SDA and SCL Input Buffer
Hysteresis
SDA Output Buffer LOW Voltage,
Sinking 3mA
SDA and SCL Pin Capacitance
SCL Frequency
Pulse Width Suppression Time at
SDA and SCL Inputs
SCL falLing Edge to SDA Output
Data Valid
Time the Bus Must be Free Before
the Start of a New Transmission
Any pulse narrower than the max
spec is suppressed.
SCL falling edge crossing 30% of
V
DD
, until SDA exits the 30% to
70% of V
DD
window.
SDA crossing 70% of V
DD
during
a STOP condition, to SDA
crossing 70% of V
DD
during the
following START condition.
Measured at the 30% of V
DD
crossing.
Measured at the 70% of V
DD
crossing.
SCL rising edge to SDA falling
edge. Both crossing 70% of V
DD
.
From SDA falling edge crossing
30% of V
DD
to SCL falling edge
crossing 70% of V
DD
.
From SDA exiting the 30% to
70% of V
DD
window, to SCL
rising edge crossing 30% of V
DD.
From SCL falling edge crossing
30% of V
DD
to SDA entering the
30% to 70% of V
DD
window.
From SCL rising edge crossing
70% of V
DD
, to SDA rising edge
crossing 30% of V
DD
.
From SDA rising edge to SCL
falling edge. Both crossing 70%
of V
DD
.
From SCL falling edge crossing
30% of V
DD
, until SDA enters the
30% to 70% of V
DD
window.
From 30% to 70% of V
DD.
From 70% to 30% of V
DD.
Total on-chip and off-chip
1300
V
DD
= 5V, I
OL
= 3mA
T
A
= +25°C, f = 1MHz, V
DD
= 5V,
V
IN
= 0V, V
OUT
= 0V
TEST CONDITIONS
MIN
(Note 9)
-0.3
0.7 x V
DD
0.05 x V
DD
0.4
10
400
50
900
TYP (Note 5)
MAX
(Note 9)
0.3 x V
DD
V
DD
+ 0.3
UNITS NOTES
V
V
V
V
pF
kHz
ns
ns
t
BUF
ns
t
LOW
t
HIGH
t
SU:STA
t
HD:STA
Clock LOW Time
Clock HIGH Time
START Condition Setup Time
START Condition Hold Time
1300
600
600
600
ns
ns
ns
ns
t
SU:DAT
Input Data Setup Time
100
ns
t
HD:DAT
Input Data Hold Time
0
900
ns
t
SU:STO
STOP Condition Setup Time
600
ns
t
HD:STO
STOP Condition Hold Time
600
ns
t
DH
Output Data Hold Time
0
ns
t
R
t
F
Cb
SDA and SCL Rise Time
SDA and SCL Fall Time
Capacitive Loading of SDA or SCL
20 + 0.1 x Cb
20 +
0.1 x Cb
10
300
300
400
ns
ns
pF
7
7
7
FN6316 Rev 1.00
July 15, 2010
Page 4 of 24
ISL1221
I
2
C Interface Specifications
Test Conditions: V
DD
= +2.7 to +5.5V, Temperature = -40°C to +85°C, unless otherwise specified.
(Continued)
SYMBOL
Rpu
PARAMETER
TEST CONDITIONS
MIN
(Note 9)
1
TYP (Note 5)
MAX
(Note 9)
UNITS NOTES
k
7
SDA and SCL Bus Pull-up Resistor Maximum is determined by t
R
Off-chip
and t
F
.
For Cb = 400pF, max is about
2~2.5k. For Cb = 40pF, max is
about 15~20k
NOTES:
2. IRQ and F
OUT
and EVDET Inactive.
3. LPMODE = 0 (default).
4. In order to ensure proper timekeeping, the V
DD SR-
specification must be followed.
5. Typical values are for T = 25°C and 3.3V supply voltage.
6. V
SUP
= V
DD
if in V
DD
Mode, V
SUP
= V
BAT
if in V
BAT
Mode.
7. These are I
2
C specific parameters and are not directly tested, however they are used during device testing to validate device specification.
8. A write to register 08h should only be done if V
DD
> V
BAT
, otherwise the device will be unable to communicate using I
2
C.
9. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
[font=Tahoma, Helvetica, SimSun, sans-serif]To learn MSP430, as a beginner, you must learn a chip from two places: the chip manual and the header file. I like to start with the header file. [/font] [f...
I hope EEWORLD and TI can provide some learning methods and usage introductions for us rookies! I want to use this 9B96 in the future, but I don’t seem to understand the basics yet!...
Every year at this time, it is time to sum up. Time is like flowing water. It is true. You see, 2017 has quietly gone. Have you not yet felt the mood of 2017, 2018 has quietly come. Yes, it is 2018. I...
[i=s] This post was last edited by wangfuchong on 2014-7-19 16:26 [/i] Due to some sudden reasons that I cannot explain, I will not come here anymore. I have received more than one prize from the foru...
Keithley's Series 2300 Battery / Charger Emulators (Fast Transient Response Power Supplies) are designed for power estimation of RFIC amplifiers, cell phones, and other portable battery-powered produc...
The TIA Portal software's shift instructions shift the contents of an accumulator bit by bit to the left or right. The number of bits shifted is determined by N. A left shift of N bits multiplies t...[Details]
EtherCAT (Ethernet for Control Automation Technology) is a real-time industrial fieldbus communication protocol based on an Ethernet-based development framework. EtherCAT is one of the fastest indu...[Details]
Nios II is a configurable 16-/32-bit RISC processor. Combined with a rich set of peripheral-specific instructions and hardware acceleration units, it provides a highly flexible and powerful SOPC sy...[Details]
On August 25th, Apple's expansion in India encountered new troubles. According to Bloomberg, Foxconn Technology Group has recalled approximately 300 Chinese engineers from India, further hindering ...[Details]
With the continuous development of the industrial automation industry, we are seeing an increasing number of intelligent devices using flexible, efficient, and precise robotic arms to p...[Details]
The difference between a series inverter and a parallel inverter is that they use different oscillation circuits. A series inverter connects L, R, and C in series, while a parallel inverter connect...[Details]
Batteries, at the core of new energy vehicles, are crucial to vehicle performance and range. Existing automotive batteries are categorized into lead-acid and lithium batteries. Currently, new energ...[Details]
introduction
As core electronic components used in vastly different fields, automotive-grade chips and mobile/consumer-grade chips exhibit significant differences in their...[Details]
introduction
The rapid development of science and technology has enabled mankind to quickly move from the Internet era to the big data era. As a result, the amount of data generated by people ...[Details]
0 Introduction
Portable terminals integrate a computer and display screen into a single device. Due to limited space in portable devices, previous designs often used a single-chip microcompute...[Details]
A new multi-layer diffractive optical processor can block images in one direction while allowing images in another direction to pass through.
Researchers at the University of California,...[Details]
EVTank predicts that all-solid-state batteries will achieve small-scale mass production in 2027 and large-scale shipments by 2030. Global solid-state battery shipments will reach 614.1GWh, of which...[Details]
On August 19, Reuters reported that people familiar with the matter said that Nvidia is developing a new AI chip based on its latest Blackwell architecture for the Chinese market. The performance o...[Details]
Mathematical functions are very important and are used in many situations such as analog quantity processing and PID control.
(12) Calculate sine value instruction (SIN)
The "Calculate Si...[Details]
While aberration theory is a vast subject, a basic understanding of some fundamental concepts can make it easier to understand: spherical aberration, astigmatism, field curvature, and chromatic abe...[Details]
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
