WEDPNF8M722V-XBX datasheet, PDF

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WEDPNF8M722V-XBX: Description8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package; File Size1MB，43 Pages; ManufacturerWhite Electronic Designs Corporation; Websitehttp://www.wedc.com/

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WEDPNF8M722V-XBX Overview

8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package

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White Electronic Designs

WEDPNF8M722V-XBX

8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module

Multi-Chip Package

ADVANCED*

FEATURES

Sector Architecture

Package:

• 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm

•One 16KByte, two 8KBytes, one 32KByte, and fifteen

64KBytes in byte mode

•One 8K word, two 4K words, one 16K word, and

fifteen 32K word sectors in word mode.

•Any combination of sectors can be concurrently

erased. Also supports full chip erase

Boot Code Sector Architecture (Bottom)

Embedded Erase and Program Algorithms

Commercial, Industrial and Military Temperature Ranges

Weight:

• WEDPNF8M722V-XBX - 2.5 grams typical

SDRAM PERFORMANCE FEATURES

Organized as 8M x 72

High Frequency = 100, 125MHz

Single 3.3V ±0.3V power supply

Erase Suspend/Resume

•Supports reading data from or programing data to a

sector not being erased

Fully Synchronous; all signals registered on positive

edge of system clock cycle

changed every clock cycle

BENEFITS

Internal pipelined operation; column address can be

Internal banks for hiding row access/precharge

Programmable Burst length 1,2,4,8 or full page

4096 refresh cycles

44% SPACE SAVINGS

Reduced part count

•25% I/O Reduction

Reduced I/O count

Suitable for hi-reliability applications

SDRAM Upgradeable to 16M x 72 density (contact

FLASH PERFORMANCE FEATURES

User Configurable as 2Mx8, 1M x16 or 512K x 32

Access Times of 100, 120, 150ns

3.3 Volt for Read and Write Operations

1,000,000 Erase/Program Cycles

factory for information)

* This data sheet describes a product that may or may not be under

development and is subject to change or cancellation without notice.

September 2002 Rev. 2

White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

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	WEDPNF8M722V-XBX	WEDPNF8M722V-1012BM	WEDPNF8M722V-1015BM	WEDPNF8M722V-1010BM	WEDPNF8M722V-1215BM	WEDPNF8M722V-1215BI	WEDPNF8M722V-1212BI	WEDPNF8M722V-1210BC	WEDPNF8M722V-1012BC	WEDPNF8M722V-1010BC
Description	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package
Is it Rohs certified?	-	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	-	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation
package instruction	-	32 X 25 MM, PLASTIC, BGA-275	32 X 25 MM, PLASTIC, BGA-275	32 X 25 MM, PLASTIC, BGA-275	32 X 25 MM, PLASTIC, BGA-275	32 X 25 MM, PLASTIC, BGA-275	32 X 25 MM, PLASTIC, BGA-275	32 X 25 MM, PLASTIC, BGA-275	32 X 25 MM, PLASTIC, BGA-275	32 X 25 MM, PLASTIC, BGA-275
Reach Compliance Code	-	unknow	unknow	unknow	unknow	unknow	unknow	unknow	unknow	unknow
Other features	-	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH
JESD-30 code	-	R-PBGA-B275	R-PBGA-B275	R-PBGA-B275	R-PBGA-B275	R-PBGA-B275	R-PBGA-B275	R-PBGA-B275	R-PBGA-B275	R-PBGA-B275
length	-	32 mm	32 mm	32 mm	32 mm	32 mm	32 mm	32 mm	32 mm	32 mm
memory density	-	603979776 bi	603979776 bi	603979776 bi	603979776 bi	603979776 bi	603979776 bi	603979776 bi	603979776 bi	603979776 bi
Memory IC Type	-	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
memory width	-	72	72	72	72	72	72	72	72	72
Number of functions	-	1	1	1	1	1	1	1	1	1
Number of terminals	-	275	275	275	275	275	275	275	275	275
word count	-	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words
character code	-	8000000	8000000	8000000	8000000	8000000	8000000	8000000	8000000	8000000
Operating mode	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	-	125 °C	125 °C	125 °C	125 °C	85 °C	85 °C	70 °C	70 °C	70 °C
Minimum operating temperature	-	-55 °C	-55 °C	-55 °C	-55 °C	-40 °C	-40 °C	-	-	-
organize	-	8MX72	8MX72	8MX72	8MX72	8MX72	8MX72	8MX72	8MX72	8MX72
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Maximum supply voltage (Vsup)	-	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	-	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	-	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	-	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	-	MILITARY	MILITARY	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	-	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	-	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	-	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm

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