WEDPNF8M722V-1012BM datasheet, PDF

Datasheet> All Categories > storage> storage> WEDPNF8M722V-1012BM

WEDPNF8M722V-1012BM: Description8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package; Categorystorage storage; File Size1MB，43 Pages; ManufacturerWhite Electronic Designs Corporation; Websitehttp://www.wedc.com/

Download Datasheet Parametric Compare View All

WEDPNF8M722V-1012BM Overview

8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package

WEDPNF8M722V-1012BM Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	White Electronic Designs Corporation
package instruction	32 X 25 MM, PLASTIC, BGA-275
Reach Compliance Code	unknow
Other features	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH
JESD-30 code	R-PBGA-B275
length	32 mm
memory density	603979776 bi
Memory IC Type	MEMORY CIRCUIT
memory width	72
Number of functions	1
Number of terminals	275
word count	8388608 words
character code	8000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	8MX72
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	RECTANGULAR
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	2.54 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	25 mm

Preview

Download Datasheet

View All

White Electronic Designs

WEDPNF8M722V-XBX

8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module

Multi-Chip Package

ADVANCED*

FEATURES

Sector Architecture

Package:

• 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm

•One 16KByte, two 8KBytes, one 32KByte, and fifteen

64KBytes in byte mode

•One 8K word, two 4K words, one 16K word, and

fifteen 32K word sectors in word mode.

•Any combination of sectors can be concurrently

erased. Also supports full chip erase

Boot Code Sector Architecture (Bottom)

Embedded Erase and Program Algorithms

Commercial, Industrial and Military Temperature Ranges

Weight:

• WEDPNF8M722V-XBX - 2.5 grams typical

SDRAM PERFORMANCE FEATURES

Organized as 8M x 72

High Frequency = 100, 125MHz

Single 3.3V ±0.3V power supply

Erase Suspend/Resume

•Supports reading data from or programing data to a

sector not being erased

Fully Synchronous; all signals registered on positive

edge of system clock cycle

changed every clock cycle

BENEFITS

Internal pipelined operation; column address can be

Internal banks for hiding row access/precharge

Programmable Burst length 1,2,4,8 or full page

4096 refresh cycles

44% SPACE SAVINGS

Reduced part count

•25% I/O Reduction

Reduced I/O count

Suitable for hi-reliability applications

SDRAM Upgradeable to 16M x 72 density (contact

FLASH PERFORMANCE FEATURES

User Configurable as 2Mx8, 1M x16 or 512K x 32

Access Times of 100, 120, 150ns

3.3 Volt for Read and Write Operations

1,000,000 Erase/Program Cycles

factory for information)

* This data sheet describes a product that may or may not be under

development and is subject to change or cancellation without notice.

September 2002 Rev. 2

White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

WEDPNF8M722V-1012BM Related Products

	WEDPNF8M722V-1012BM	WEDPNF8M722V-1015BM	WEDPNF8M722V-1010BM	WEDPNF8M722V-XBX	WEDPNF8M722V-1215BM	WEDPNF8M722V-1215BI	WEDPNF8M722V-1212BI	WEDPNF8M722V-1210BC	WEDPNF8M722V-1012BC	WEDPNF8M722V-1010BC
Description	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package	8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package
Is it Rohs certified?	incompatible	incompatible	incompatible	-	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	-	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation
package instruction	32 X 25 MM, PLASTIC, BGA-275	32 X 25 MM, PLASTIC, BGA-275	32 X 25 MM, PLASTIC, BGA-275	-	32 X 25 MM, PLASTIC, BGA-275	32 X 25 MM, PLASTIC, BGA-275	32 X 25 MM, PLASTIC, BGA-275	32 X 25 MM, PLASTIC, BGA-275	32 X 25 MM, PLASTIC, BGA-275	32 X 25 MM, PLASTIC, BGA-275
Reach Compliance Code	unknow	unknow	unknow	-	unknow	unknow	unknow	unknow	unknow	unknow
Other features	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH	-	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH	USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH
JESD-30 code	R-PBGA-B275	R-PBGA-B275	R-PBGA-B275	-	R-PBGA-B275	R-PBGA-B275	R-PBGA-B275	R-PBGA-B275	R-PBGA-B275	R-PBGA-B275
length	32 mm	32 mm	32 mm	-	32 mm	32 mm	32 mm	32 mm	32 mm	32 mm
memory density	603979776 bi	603979776 bi	603979776 bi	-	603979776 bi	603979776 bi	603979776 bi	603979776 bi	603979776 bi	603979776 bi
Memory IC Type	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	-	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
memory width	72	72	72	-	72	72	72	72	72	72
Number of functions	1	1	1	-	1	1	1	1	1	1
Number of terminals	275	275	275	-	275	275	275	275	275	275
word count	8388608 words	8388608 words	8388608 words	-	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words
character code	8000000	8000000	8000000	-	8000000	8000000	8000000	8000000	8000000	8000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	-	125 °C	85 °C	85 °C	70 °C	70 °C	70 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-	-55 °C	-40 °C	-40 °C	-	-	-
organize	8MX72	8MX72	8MX72	-	8MX72	8MX72	8MX72	8MX72	8MX72	8MX72
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	-	BGA	BGA	BGA	BGA	BGA	BGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	-	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.54 mm	2.54 mm	2.54 mm	-	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	-	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	-	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	-	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	-	MILITARY	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	BALL	BALL	BALL	-	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	-	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	25 mm	25 mm	25 mm	-	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm

Recommended Resources

1 to 2W audio power amplifier for easy in-instrument installation

Two-input transistor NOR gate circuit

Homemade standard signal transmitter

Simple multi-function charger production circuit

Computer motherboard circuit diagram 815 1_30

Recording pen circuit diagram

Extraordinary Fujitsu FRAM memory, safe, easy to write, low power consumption, download data to get gifts!: [size=3][url=https://www.eeworld.com.cn/huodong/FUJITSU_FRAM_20180517/][color=#000]Download Fujitsu related information and experience the powerful functions of Fujitsu's three major memories. Not onl...; EEWORLD社区 Integrated technical exchanges

I use the SimpliciTI protocol to build a network, and I use the full AP-AS-HUB directly, but it is not successful. I need a solution.: Why does it fail when using SimpliciTI's example to build a network?I'm asking for help from experts. I'm stuck here. I used the example program directly without making any changes, but the network is...; duanjuan Microcontroller MCU

Masters who have worked on V4L (video for linux) please come in!: Hi everyone, I have an em2750 webcam and want to use it in Linux. However, after using the v4l2 driver, I can open xawtv, tvtime, mplayer and other playback software correctly, but xawtv and tvtime ca...; 672192076 Linux and Android

MDK4.0 crack, ULINK1+ULINK2+JLINK: Recently, people have been asking how to download the new MDK version of ULINK1. I just found something good on the Internet and would like to share it with you. I will also mark it;P...; ddllxxrr MCU

Automotive electronics, hardware, what to learn, beginners,: I have applied for a job in automotive electronics and hardware. I want to learn something after class, but I don’t know what to learn. Can experienced masters give me some suggestions?...; skyxylx77 Automotive Electronics

The second step of the Bluetooth 4.0 journey: CC2540 USB DONGLE layout is complete: The ones sold on Taobao are too expensive, so I'm going to make one myself. You can connect a Bluetooth module via the USB on your Android to equip an ordinary PAD with BLE functionality.By the way, h...; littleshrimp Wireless Connectivity

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components