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IH5050MJE-883B

Description
Analog Switch ICs Low Charge Injection SPDT Analog Switch
Categorysemiconductor    Analog mixed-signal IC   
File Size1MB,4 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
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IH5050MJE-883B Overview

Analog Switch ICs Low Charge Injection SPDT Analog Switch

IH5050MJE-883B Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerMaxim
Product CategoryAnalog Switch ICs
Number of Switches1 Switch
Configuration1 x SPDT
On Resistance - Max60 Ohms
Switch Voltage - Max+/- 15 V
On Time - Max500 ns
Off Time - Max250 ns
Operating Supply Voltage+/- 15 V
Minimum Operating Temperature- 55 C
Maximum Operating Temperature+ 125 C
Mounting StyleThrough Hole
Package / CaseCDIP-16
Supply TypeDual Supply
Supply Current - Max1 uA
Dual Supply Voltage+/- 15 V
Maximum Dual Supply Voltage+/- 20 V
Minimum Dual Supply Voltage+/- 4.5 V
Pd - Power Dissipation800 mW
Switch Continuous Current30 mA
___________________________________________________________________________
Maxim
Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

IH5050MJE-883B Related Products

IH5050MJE-883B IH5049CPE- IH5047C-D- IH5050C/D IH5051MJE IH5050CPE+ IH5051CJE IH5048ACWE IH5048CWE
Description Analog Switch ICs Low Charge Injection SPDT Analog Switch Analog Switch ICs Dual SPST Low Charge Injection Normally O Analog Switch ICs Analog Switch ICs Low Charge Injection SPDT Analog Switch Analog Switch ICs Dual SPST, Low Charge Injection Analog Switch Analog Switch ICs Low Charge Injection SPDT Analog Switch ICs Low Charge Injection Dual SPDT Analog Switch Analog to Digital Converters - ADC Low Charge Injection Dual SPST Normally Open Analog Switch Switching Voltage Regulators Low Charge Injection Dual SPST Normally Open Analog Switch
Is it lead-free? - - - Contains lead Contains lead - Contains lead Contains lead Contains lead
Is it Rohs certified? - - - incompatible incompatible conform to incompatible incompatible incompatible
Maker - - - Maxim Maxim Maxim Maxim Maxim Maxim
Parts packaging code - - - DIE DIP - DIP SOIC SOIC
package instruction - - - DIE-14 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 SO-16 SO-16
Contacts - - - 14 16 - 16 16 16
Reach Compliance Code - - - not_compliant not_compliant compliant not_compliant not_compliant not_compliant
Analog Integrated Circuits - Other Types - - - SPDT SPDT SPDT SPDT SPST SPST
JESD-30 code - - - R-XUUC-N14 R-GDIP-T16 R-PDIP-T16 R-GDIP-T16 R-PDSO-G16 R-PDSO-G16
JESD-609 code - - - e0 e0 - e0 e0 e0
Nominal Negative Supply Voltage (Vsup) - - - -15 V -15 V - -15 V -15 V -15 V
Number of channels - - - 1 1 - 1 1 1
Number of functions - - - 1 2 1 2 2 2
Number of terminals - - - 14 16 16 16 16 16
Nominal off-state isolation - - - 50 dB 54 dB - 50 dB 50 dB 50 dB
On-state resistance matching specifications - - - 8 Ω 8 Ω - 8 Ω 8 Ω 8 Ω
Maximum on-state resistance (Ron) - - - 45 Ω 40 Ω 75 Ω 45 Ω 30 Ω 45 Ω
Maximum operating temperature - - - 70 °C 125 °C 70 °C 70 °C 70 °C 70 °C
Package body material - - - UNSPECIFIED CERAMIC, GLASS-SEALED PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - - - DIE DIP DIP DIP SOP SOP
Encapsulate equivalent code - - - DIE OR CHIP DIP16,.3 DIP16,.3 DIP16,.3 SOP16,.4 SOP16,.4
Package shape - - - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form - - - UNCASED CHIP IN-LINE IN-LINE IN-LINE SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) - - - 240 240 - 240 240 240
power supply - - - 5,+-15 V 5,+-15 V 5,+-15 V 5,+-15 V 5,+-15 V 5,+-15 V
Certification status - - - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Nominal supply voltage (Vsup) - - - 15 V 15 V - 15 V 15 V 15 V
surface mount - - - YES NO NO NO YES YES
Maximum disconnect time - - - 300 ns 200 ns - 300 ns 300 ns 300 ns
Maximum connection time - - - 600 ns 400 ns 600 ns 600 ns 600 ns 600 ns
switch - - - BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE
technology - - - CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level - - - COMMERCIAL MILITARY COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface - - - TIN LEAD Tin/Lead (Sn85Pb15) - Tin/Lead (Sn/Pb) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
Terminal form - - - NO LEAD THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE GULL WING GULL WING
Terminal location - - - UPPER DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature - - - NOT SPECIFIED 20 - 20 20 20
output - - - - SEPARATE OUTPUT SEPARATE OUTPUT SEPARATE OUTPUT SEPARATE OUTPUT SEPARATE OUTPUT
Terminal pitch - - - - 2.54 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm
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