Philips Semiconductors
Product specification
Rectifier diodes
Schottky barrier
FEATURES
• Low forward volt drop
• Fast switching
• Reverse surge capability
• High thermal cycling performance
• low profile surface mounting
package
PBYR245CT series
SYMBOL
QUICK REFERENCE DATA
V
R
= 40 V/ 45 V
I
O(AV)
= 2 A
V
F
≤
0.45V
SOT223
DESCRIPTION
a1
1
k 2
a2
3
GENERAL DESCRIPTION
Dual, common cathode schottky
rectifier diodes in a plastic
envelope. Intended for use as
output rectifiers in low voltage, high
frequency switched mode power
supplies.
The PBYR245CT series is supplied
in the surface mounting SOT223
package.
PINNING
PIN
1
2
3
tab
anode 1
cathode
anode 2
cathode
4
1
2
3
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER
V
RRM
V
RWM
V
R
I
O(AV)
I
FRM
I
FSM
Peak repetitive reverse
voltage
Working peak reverse
voltage
Continuous reverse voltage
Average rectified output
current (both diodes
conducting)
Repetitive peak forward
current per diode
Non-repetitive peak forward
current per diode
Peak repetitive reverse
surge current per diode
Operating junction
temperature
Storage temperature
CONDITIONS
PBYR2
-
-
T
sp
≤
74 ˚C
square wave;
δ
= 0.5; T
sp
≤
119 ˚C
square wave;
δ
= 0.5; T
sp
≤
119 ˚C
t = 10 ms
t = 8.3 ms
sinusoidal; T
j
= 125 ˚C prior to
surge; with reapplied V
RRM(max)
pulse width and repetition rate
limited by T
j max
-
-
-
-
-
-
-
- 40
MIN.
MAX.
40CT
40
40
40
2
2
6
6.6
1
150
150
45CT
45
45
45
UNIT
V
V
V
A
A
A
A
A
˚C
˚C
I
RRM
T
j
T
stg
THERMAL RESISTANCES
SYMBOL PARAMETER
R
th j-a
Thermal resistance junction
to ambient
CONDITIONS
pcb mounted, minimum footprint
pcb mounted, pad area as in fig:1
MIN.
-
-
TYP. MAX. UNIT
156
70
-
-
K/W
K/W
July 1998
1
Rev 1.400
Philips Semiconductors
Product specification
Rectifier diodes
Schottky barrier
ELECTRICAL CHARACTERISTICS
T
j
= 25 ˚C unless otherwise specified
SYMBOL PARAMETER
V
F
I
R
C
d
Forward voltage
Reverse current
Junction capacitance
CONDITIONS
I
F
= 1 A; T
j
= 125˚C
I
F
= 2 A
V
R
= V
RWM
V
R
= V
RWM
; T
j
= 100˚C
V
R
= 5 V; f = 1 MHz, T
j
= 25˚C to 125˚C
PBYR245CT series
MIN.
-
-
-
-
-
TYP. MAX. UNIT
0.41
0.58
0.03
1.5
60
0.45
0.7
0.2
10
-
V
V
mA
mA
pF
PRINTED CIRCUIT BOARD
Dimensions in mm.
36
18
60
9
4.6
4.5
10
7
15
50
Fig.1. PCB for thermal resistance and power rating for SOT223.
PCB: FR4 epoxy glass (1.6 mm thick), copper laminate (35
µ
m thick).
July 1998
2
Rev 1.400
Philips Semiconductors
Product specification
Rectifier diodes
Schottky barrier
PBYR245CT series
1
Forward dissipation, PF (W)
Vo = 0.27 V
Rs = 0.183 Ohms
PBYR245CT
10
Reverse current, IR (mA)
PBYR245CT
0.8
0.5
0.6
0.1
0.4
I
t
p
D = 1.0
0.2
125 C
1
100 C
0.1
t
p
T
t
75 C
50 C
D=
0.2
0
T
0.01
Tj = 25 C
0.001
0
25
Reverse voltage, VR (V)
50
0
0.5
1
Average forward current, IF(AV) (A)
1.5
Fig.2. Maximum forward dissipation P
F
= f(I
F(AV)
) per
diode; square current waveform where
I
F(AV)
=I
F(RMS)
x
√
D.
Forward dissipation, PF (W) PBYR245CT
Vo = 0.27 V
Rs = 0.183 Ohms
Fig.5. Typical reverse leakage current per diode;
I
R
= f(V
R
); parameter T
j
1
0.8
0.6
Cd / pF
1000
PBYR245CT
4
0.4
0.2
0
2.8
2.2
1.9
a = 1.57
100
10
0
0.2
0.4
0.6
0.8
Average forward current, IF(AV) (A)
1
1
10
VR / V
100
Fig.3. Maximum forward dissipation P
F
= f(I
F(AV)
) per
diode; sinusoidal current waveform where a = form
factor = I
F(RMS)
/ I
F(AV)
.
Forward current, IF (A)
Tj = 25 C
Tj = 125 C
2.5
PBYR245CT
Fig.6. Typical junction capacitance per diode;
C
d
= f(V
R
); f = 1 MHz; T
j
= 25˚C to 125 ˚C.
3
100
Transient thermal impedance, Zth j-sp (K/W)
10
2
typ
1.5
1
0.1
P
D
t
p
D=
t
p
T
t
1s
10s
1
max
0.5
0
0.01
1us
T
10us
100us 1ms
10ms
pulse width, tp (s)
100ms
0
0.2
0.4
0.6
0.8
1
Forward voltage, VF (V)
1.2
1.4
PBYR245CT
Fig.4. Typical and maximum forward characteristic
I
F
= f(V
F
); parameter T
j
Fig.7. Transient thermal impedance; per diode;
Z
th j-sp
= f(t
p
).
July 1998
3
Rev 1.400
Philips Semiconductors
Product specification
Rectifier diodes
Schottky barrier
MECHANICAL DATA
Dimensions in mm
Net Mass: 0.11 g
0.32
0.24
6.7
6.3
3.1
2.9
PBYR245CT series
B
0.2
M
A
4
A
0.10
0.02
3.7
3.3
13
7.3
6.7
16
max
1
10
max
1.8
max
1.05
0.85
4.6
2.3
2
0.80
0.60
3
0.1 M
(4x)
B
Fig.8. SOT223 surface mounting package.
Notes
1. For further information, refer to Philips publication SC18 " SMD Footprint Design and Soldering Guidelines".
Order code: 9397 750 00505.
2. Epoxy meets UL94 V0 at 1/8".
July 1998
4
Rev 1.400
Philips Semiconductors
Product specification
Rectifier diodes
Schottky barrier
DEFINITIONS
Data sheet status
Objective specification
Product specification
Limiting values
PBYR245CT series
This data sheet contains target or goal specifications for product development.
This data sheet contains final product specifications.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
©
Philips Electronics N.V. 1998
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
July 1998
5
Rev 1.400
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