REVISIONS
LTR
A
B
DESCRIPTION
Add vendor, CAGE 01295 for devices 01EX and 012X. Update format. Editorial
changes throughout.
Update drawing to current requirements. – drw
DATE (YR-MO-DA)
90-04-09
03-09-30
APPROVED
M. A. Frye
Raymond Monnin
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
Gary Zahn
B
1
B
2
B
3
B
4
B
5
B
6
B
7
B
8
B
9
B
10
B
11
B
12
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Charles E. Besore
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
87-12-14
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
MICROCIRCUIT, CMOS, 8-BIT MULTIPLYING
DIGITAL TO ANALOG CONVERTER, MONOLITHIC
SILICON
AMSC N/A
REVISION LEVEL
B
SIZE
A
SHEET
CAGE CODE
67268
1 OF
12
5962-87700
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E555-03
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-87700
01
E
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device types. The device types identify the circuit function as follows:
Device type
01
02
03
Generic number
7524
7524
7524
Circuit function
CMOS 8-bit multiplying buffered DAC with .5 LSB
CMOS 8-bit multiplying buffered DAC with .25 LSB
CMOS 8-bit multiplying buffered DAC with .125 LSB
1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
E
2
Descriptive designator
GDIP1-T16 and CDIP2-T16
CQCC1-N20
Terminals
16
20
Package style
Dual-in-line
Square leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
V
DD
to GND ..................................................................................................................
V
RFB
to GND.................................................................................................................
Digital input voltage to GND.........................................................................................
V
REF
to GND.................................................................................................................
V
OUT1
, V
OUT2
, 0 to GND ................................................................................................
Power dissipation (P
D
):
Up to +75°C .............................................................................................................
Derates above +75°C...............................................................................................
Storage temperature range..........................................................................................
Lead temperature (soldering, 10 seconds)..................................................................
Thermal resistance, junction-to-case (
JC
) ..................................................................
Thermal resistance, junction-to-ambient (
JA
).............................................................
1.4 Recommended operating conditions.
Ambient operating temperature range (T
A
) ................................................................. -55°C to +125°C
Supply voltage range (V
DD
).......................................................................................... +5 V to +15 V
-0.3 V, +17 V
±25 V
-0.3 V to V
DD
±25 V
-0.3 V to V
DD
450 mW
6mW/°C
-65°C to +150°C
+300°C
See MIL-STD-1835
120°C/W
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
θ
θ
SIZE
A
REVISION LEVEL
5962-87700
SHEET
B
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the
issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 -
MIL-STD-1835 -
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN
class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing
(QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535
may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval
in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make
modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These
modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-38535 is
required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Mode selection table. The mode selection table shall be as specified on figure 2.
3.2.4 Write cycle timing diagram. The write cycle timing diagram shall be as specified on figure 3.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as
specified in table I and shall apply over the full ambient operating temperature range.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87700
SHEET
B
3
TABLE I. Electrical performance characteristics.
Conditions
-55°C
≤
T
A
≤
+125°C
unless otherwise specified
1/
Resolution
RES
V
DD
= +5 V
V
DD
= +15 V
Relative accuracy
RA
V
DD
= +5 V
V
DD
= +15 V
1, 2, 3
1, 2, 3
1
2, 3
V
DD
= +15 V, T
A
= +25°C 2/
V
DD
= +15 V
12
1
2, 3
V
DD
= +15 V, T
A
= +25°C 2/
Gain error 3/
A
E
V
DD
= +5 V
12
1
2, 3
V
DD
= +15 V
1
2, 3
All
03
All
01
02
1, 2, 3
All
Test
Symbol
Group A
subgroups
Device
type
Min
8
8
Limits
Max
Unit
Bits
±.5
±.5
±.5
±.25
±.25
±.5
±.125
±.125
±1.0
±1.4
±0.5
±0.6
LSB
%FSR
Output leakage current
I
OUT1
I
OL
DB0-DB7 = 0 V,
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
∆
Power supply rejection
PSRR
V
DD
= ±10%
V
DD
=
+5 V
1
2, 3
All
±.08
±.16
±.02
±.04
%/%
V
DD
=
+15 V
1
2, 3
V
DD
=
+5 V
1
All
±50
nA
WR
=
CS = 0 V
V
DD
=
+15 V
2, 3
1
2, 3
±400
±50
±200
SIZE
A
REVISION LEVEL
5962-87700
SHEET
B
4
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55
°
C
≤
T
A
≤
+125
°
C
unless otherwise specified
1/
Output leakage current
I
OUT2
I
OL
DB0-DB7 = V
DD
,
WR = CS = 0 V
V
DD
=
+15 V
V
DD
=
+5 V
1
2, 3
1
2, 3
Input resistance (V
REF
pin)
R
IN
V
DD
=
+5 V
V
DD
=
+15 V
Digital input high voltage
V
IH
V
DD
=
+5 V
V
DD
=
+15 V
Digital input low voltage
V
IL
V
DD
=
+5 V
V
DD
=
+15 V
Digital input leakage current
I
IN
V
IN
= 0 V or V
DD
V
DD
=
+5 V
1
2, 3
V
DD
=
+15 V
1
2, 3
Supply current
I
DD
All digital inputs =
V
IL
or V
IH
V
DD
=
+5 V
V
DD
=
+15 V
All digital inputs =
0 V or V
DD
V
DD
=
+5 V
1
2, 3
V
DD
=
+15 V
1
2, 3
Gain temperature
coefficient
TC
AE
4/
V
DD
=
+5 V
V
DD
=
+15 V
1, 2, 3
All
All
All
1, 2, 3
All
All
All
1, 2, 3
All
1, 2, 3
All
1, 2, 3
All
5
5
2.4
13.5
0.8
1.5
V
All
Test
Symbol
Group A
subgroups
Device
type
Min
Limits
Max
±50
±400
±50
±200
Unit
nA
20
V
±10
±1
±10
2
2
mA
500
100
500
±40
±10
ppm/°C
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87700
SHEET
B
5
µ
100
µ
±1
Ω
A
A
20
k
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