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430-10-254-00-240000

Description
Headers & Wire Housings
CategoryThe connector    The connector   
File Size117KB,3 Pages
ManufacturerMill-Max
Websitehttps://www.mill-max.com
Environmental Compliance
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430-10-254-00-240000 Overview

Headers & Wire Housings

430-10-254-00-240000 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
package instructionROHS COMPLIANT
Reach Compliance Codecompliant
Other featuresPANEL MOUNTABLE
Connector typeBOARD CONNECTOR
Contact to complete cooperationGOLD (10) OVER NICKEL (150)
Contact completed and terminatedGold (Au) - with Nickel (Ni) barrier
Contact point genderMALE
Contact materialNOT SPECIFIED
DIN complianceNO
Filter functionNO
IEC complianceNO
JESD-609 codee4
MIL complianceNO
Mixed contactsNO
Installation methodSTRAIGHT
Installation typeBOARD
Number of rows loaded2
OptionsGENERAL PURPOSE
Terminal pitch2.54 mm
Termination typeSOLDER
Total number of contacts108
Base Number Matches1
 Product Number: 430-10-254-00-240000
Description:
Interconnect Target Connector
Spring-Loaded Header
Vertical Mount Soldercup Target
Double Row
Surface Mount
Plating Code:
10
Shell Plating:
10 μ" Gold over 100 μ" Nickel
#
Of
Pins
54
Mill-Max
Part
Number
430-10-254-00-240000
RoHS
Compliant
 LOOSE PIN:
Pin Used: 3024 (Brass Alloy)
BRASS ALLOY
360 per ASTM B 16, or 385 per ASTM B455
Properties of BRASS ALLOY 360 ASTM B 16:
Chemical composition: Cu 63% (max), Pb 3.7% (max)†, Fe .35% (max), Zn remainder
Temper as machined: H02/H04
Yield Strength: 25-45 ksi
Tensile strength: 57-80 ksi
Hardness as machined: 80-90 Rockwell B
Electrical conductivity: 26% IACS*
Melting point: 1000°C/840°C (liquidus/solidus)
Properties of BRASS ALLOY 385 ASTM B 455:
Chemical composition: Cu 60% (max), Pb 3.5% (max)†, Fe .35% (max), Zn remainder
Temper as machined: H02/H04
Yield Strength: 16 ksi(min)
Tensile strength: 48 ksi(min)
Hardness as machined: 80-90 Rockwell B
Electrical conductivity: 28% IACS*
Melting point: 1000°C/840°C (liquidus/solidus)
After machining, brass parts are often annealed (softened) for subsequent bending, swaging or crimping. A partial anneal
down to 60±10 RB is recommended for 90° bends, a full anneal down to 35±15 RB is recommended for pins or terminals
that are swaged (riveted) to a circuit board or crimped to a wire.
†RoHS-2 directive 2011/65/EU, exemption 6c allows up to 4% lead as an alloy agent in copper.
Mill-Max Mfg. Corp. Datasheet — Last Modified 2/15/2018
Page 1 of 3

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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