Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1:
VS cannot exceed PVDD + 0.3V. See the
Power Sequencing
section.
Note 2:
Thermal performance of this device is highly dependant on PCB layout. See the
Applications Information
section for more details.
Note 3:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer
board. For detailed information on package thermal considerations, visit
www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
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