Circuit diagrams and other information relating to SMSC products are included as a means of illustrating typical applications. Consequently, complete
information sufficient for construction purposes is not necessarily given. Although the information has been checked and is believed to be accurate, no
responsibility is assumed for inaccuracies. SMSC reserves the right to make changes to specifications and product descriptions at any time without
notice. Contact your local SMSC sales office to obtain the latest specifications before placing your product order. The provision of this information does
not convey to the purchaser of the described semiconductor devices any licenses under any patent rights or other intellectual property rights of SMSC
or others. All sales are expressly conditional on your agreement to the terms and conditions of the most recently dated version of SMSC's standard
Terms of Sale Agreement dated before the date of your order (the "Terms of Sale Agreement"). The product may contain design defects or errors
known as anomalies which may cause the product's functions to deviate from published specifications. Anomaly sheets are available upon request.
SMSC products are not designed, intended, authorized or warranted for use in any life support or other application where product failure could cause
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OR FOR LOST DATA, PROFITS, SAVINGS OR REVENUES OF ANY KIND; REGARDLESS OF THE FORM OF ACTION, WHETHER BASED ON
CONTRACT; TORT; NEGLIGENCE OF SMSC OR OTHERS; STRICT LIABILITY; BREACH OF WARRANTY; OR OTHERWISE; WHETHER OR
NOT ANY REMEDY OF BUYER IS HELD TO HAVE FAILED OF ITS ESSENTIAL PURPOSE, AND WHETHER OR NOT SMSC HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Revision 1.2 (04-15-05)
PRODUCT PREVIEW
2
SMSC EMC1002
1°C Dual SMBus Sensor with Resistance Error Correction
Package Outlines
Figure 1 8-Pin MSOP and 8-Pin MSOP (Lead-Free) Package Outline - 3x3mm Body 0.65mm Pitch
Table 1 8-Pin MSOP and 8-Pin MSOP (Lead-Free) Package Parameters
MIN
A
A1
A2
D
E
E1
H
L
L1
e
0.80
0.05
0.75
2.80
4.65
2.80
0.08
0.40
NOMINAL
~
~
0.85
3.00
4.90
~
~
~
0.95 REF
0.65 BSC
0
o
0.22
~
~
~
~
8
o
0.38
0.10
MAX
1.10
0.15
0.95
3.20
5.15
3.20
0.23
0.80
REMARKS
Overall Package Height
Standoff
Body Thickness
X Body Size
Y Span
Y body Size
Lead Foot Thickness
Lead Foot Length
Lead Length
Lead Pitch
Lead Foot Angle
Lead Width
Coplanarity
θ
W
ccc
Notes:
1. Controlling Unit: millimeters.
2. Tolerance on the true position of the leads is ± 0.065 mm maximum.
3. Package body dimensions D and E1 do not include mold protrusion or flash. Dimensions D and
E1 to be determined at datum plane H. Maximum mold protrusion or flash is 0.15mm (0.006 inches)
per end, and 0.15mm (0.006 inches) per side.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
SMSC EMC1002
3
Revision 1.2 (04-15-05)
PRODUCT PREVIEW
REVISION HISTORY
REVISION
A
INITIAL RELEASE
7/07/04
S.K.ILIEV
DESCRIPTION
DATE
RELEASED BY
D
3
SEE DETAIL "A"
e
3
E1
E
1
4
c
2
4
2
5
INDEX AREA
(D/2 X E1/2)
8X b
TOP VIEW
END VIEW
C
A2
A
SEATING PLANE
A1
ccc C
SIDE VIEW
NOTES:
H
0.25
GAUGE PLANE
1. ALL DIMENSIONS ARE IN MILLIMETER.
2. TRUE POSITION SPREAD TOLERANCE IS ± 0.125mm AT MAXIMUM MATERIAL CONDITION.
3. PACKAGE BODY DIMENSION "D" DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR
GATE BURRS. MAXIMUM MOLD FLASH, PROTRUSIONS OR GATE BURRS IS 0.15 mm PER
END. DIMENSION "E1" DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
MAXIMUM INTERLEAD FLASH OR PROTRUSION IS 0.25 mm PER SIDE. "D1" & "E1"
DIMENSIONS ARE DETERMINED AT DATUM PLANE "H".
4. DIMENSIONS "b" & "c" APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 TO
0.25 mm FROM THE LEAD TIP.
5. THE CHAMFER FEATURE IS OPTIONAL. IF IT IS NOT PRESENT, THEN A PIN 1 IDENTIFIER
MUST BE LOCATED WITHIN THE INDEX AREA INDICATED.
L
0
THIRD ANGLE PROJECTION
L1
UNLESS OTHERW ISE SPECIFIED
DIMENSIONS ARE IN MILLIMETERS
AND TOLERANCES ARE:
DECIMAL
X.X
±0.1
X.XX ±0.05
X.XXX ±0.025
ANGULAR
±1°
80 ARKAY DRIVE
HAUPPAUGE, NY 11788
USA
DETAIL "A"
TITLE
SCALE: 3/1
DIM AND TOL PER ASME Y14.5M - 1994
MATERIAL
NAME
DATE
-
FINISH
DRAWN
S.K.ILIEV
-
PRINT W ITH "SCALE TO FIT"
DO NOT SCALE DRAWING
CHECKED
7/07/04
S.K.ILIEV
APPROVED
PACKAGE OUTLINE
8 PIN SOIC, 3.9mm BODY WIDTH, 1.27mm PITCH
DWG NUMBER
REV
7/07/04
SCALE
MO-8-SOIC-4.9x3.9
STD COMPLIANCE
SHEET
A
S.K.ILIEV
7/07/04
1:1
JEDEC: MS-012 / AA
1 OF 1
SMSC EMC1002
Figure 2 8-Pin SOIC and 8-Pin SOIC (Lead-Free) Package Outline and Parameters - 3.9mm Body 1.27 mm Pitch
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