P
OLYFUSE
®
R
ESETTABLE
F
USES
RLD30
Radial Leaded, 30 V
Standard
UL 1434 1
st
Edition
CSA C22.2 No. 0 CSA TIL No. CA-3A
cULus Recognition
TÜV
Specifications
Packaging
A*
G
F*
* preferred type
bulk
tape and reel
tape and ammo
Approvals
Features
Dimensions (mm)
This 30 V product line can be used in almost
anywhere there is a low voltage power supply
(<30 V dc) and a load to be protected including
• General electronics
• Computer and Peripherals
• Automotive Electronics
Insulating Material:Yellow Epoxy Polymer,
UL 94 V-0
Round Pins:
Copper alloy, tin plated
Max. Device Surface Temperature in Tripped State
125 °C
Operating / Storage Temperature
-40 ºC to +85 ºC (consider derating)
Humidity Ageing
+85 °C, 85 % R.H., 1000 hours, ± 5 % typical
resistance change
Soldering Characteristics
Solderability per MIL-STD-202, Method 208E
Thermal Shock
MIL-STD-202F, Method 107G
+125 °C to -40 °C 10 times, ±10 % typical
resistance change
Solvent Resistance
MIL-STD-202, Method 215F, no change
Marking
“P”, voltage, amperage rating, lot number
Materials
Dimensions (mm)
Model
A
Max
RLD30P090U
RLD30P110U
RLD30P135U
RLD30P160U
RLD30P185U
RLD30P250U
RLD30P300U
RLD30P400U
RLD30P500U
RLD30P600U
RLD30P700U
RLD30P800U
RLD30P900U
7.4
7.4
8.9
8.9
10.2
11.4
11.4
14.0
14.0
16.5
19.1
21.6
24.1
B
Max
12.2
14.2
13.5
15.2
15.7
18.3
17.3
20.1
24.9
24.9
26.7
29.2
29.7
C
typ
5.1
5.1
5.1
5.1
5.1
5.1
5.1
5.1
10.2
10.2
10.2
10.2
10.2
D
Min
7.6
7.6
7.6
7.6
7.6
7.6
7.6
7.6
7.6
7.6
7.6
7.6
7.6
E
Max
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
Physical Characteristics
Lead
Material
0.51 dia.
0.51 dia.
0.51 dia.
0.51 dia.
0.51 dia.
0.51 dia.
0.81 dia.
0.81 dia.
0.81 dia.
0.81 dia.
0.81 dia.
0.81 dia.
0.81 dia.
Sn/CuFe
Sn/CuFe
Sn/CuFe
Sn/CuFe
Sn/CuFe
Sn/CuFe
Sn/Cu
Sn/Cu
Sn/Cu
Sn/Cu
Sn/Cu
Sn/Cu
Sn/Cu
packaging quantity
bag
ammo
500
500
500
500
500
500
500
100
100
100
100
100
100
2,000
2,000
2,000
2,000
2,000
2,000
2,000
1,000
1,000
1,000
1,000
1,000
1,000
Permissible continuous operating current is
≤
100% at ambient temperature of 20ºC (68ºF).
Model
cURus
•
•
•
•
•
•
•
•
•
•
•
•
•
RLD30P090U
RLD30P110U
RLD30P135U
RLD30P160U
RLD30P185U
RLD30P250U
RLD30P300U
RLD30P400U
RLD30P500U
RLD30P600U
RLD30P700U
RLD30P800U
RLD30P900U
NOTE:
I
hold
=
I
trip
=
V
max
=
I
max
=
0.90
1.10
1.35
1.60
1.85
2.50
3.00
4.00
5.00
6.00
7.00
8.00
9.00
1.80
2.20
2.70
3.20
3.70
5.00
6.00
8.00
10.00
12.00
14.00
16.00
18.00
30
30
30
30
30
30
30
30
30
30
30
30
30
40
40
40
40
40
40
40
40
40
40
40
40
40
5.90 @ 4.50
6.60 @ 5.50
7.30 @ 6.75
8.00 @ 8.00
8.70 @ 9.25
10.30 @ 12.50
10.80 @ 15.00
12.70 @ 20.00
14.50 @ 25.00
16.00 @ 30.00
17.50 @ 35.00
18.80 @ 40.00
20.00 @ 40.00
0.6
0.7
0.8
0.9
1.0
1.2
2.0
2.5
3.0
3.5
3.8
4.0
4.2
0.070
0.050
0.040
0.030
0.030
0.020
0.020
0.010
0.010
0.005
0.005
0.005
0.005
0.220
0.170
0.130
0.110
0.090
0.070
0.080
0.050
0.050
0.040
0.030
0.020
0.020
Hold current: maximum current device will pass without tripping in 20 °C still air.
Trip current: minimum current at which the device will trip in 20 °C still air.
Maximum voltage device can withstand without damage at rated current (I
max
)
Maximum fault current device can withstand without damage at rated voltage (V
max
)
P
d
=
Power dissipated from device when in the tripped state at 20 °C still air.
Minimum resistance of device in initial (un-soldered) state.
R
min
=
R
1max
= Maximum resistance of device at 20 °C measured one hour after tripping for 20 s.
Caution: Operation beyond the specified rating may result in damage and possible arcing and
fl
ame.
Specifications are subject to change without notice
Order
Information
Qty.
Order-
Number
Model
* Packaging
* optional "F" for lead free devices
040706
In our continuing strategy to deliver unparalleled circuit protection solutions,
technical expertise and application leadership, we proudly introduce the
WICKMANN Group and its products to the Littelfuse portfolio.
www.littelfuse.com
TÜV
•
•
•
•
•
•
•
•
•
•
•
•
•
I
hold
(A)
I
Trip
(A)
V
max. dc
(V)
I
max.
(A)
max. time to trip
(sec. @ A)
P
d max.
(W)
Resistance
R
min.
( )
R
I max.
( )
Approvals
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