|
DTA114GKA |
DTA114GE |
DTA114GSA |
DTA114GUA |
DTC114GSA |
| Description |
Digital Transistors (Built-in Resistor) |
Digital Transistors (Built-in Resistor) |
Digital Transistors (Built-in Resistor) |
Digital Transistors (Built-in Resistor) |
Digital Transistors (Built-in Resistor) |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
| Maker |
ROHM Semiconductor |
ROHM Semiconductor |
ROHM Semiconductor |
ROHM Semiconductor |
ROHM Semiconductor |
| package instruction |
SMALL OUTLINE, R-PDSO-G3 |
SMALL OUTLINE, R-PDSO-G3 |
IN-LINE, R-PSIP-T3 |
SMALL OUTLINE, R-PDSO-G3 |
IN-LINE, R-PSIP-T3 |
| Reach Compliance Code |
compli |
compli |
compli |
compliant |
compli |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| Other features |
DIGITAL, BUILT IN BIAS RESISTOR |
DIGITAL, BUILT IN BIAS RESISTOR |
DIGITAL |
DIGITAL, BUILT IN BIAS RESISTOR |
DIGITAL |
| Maximum collector current (IC) |
0.1 A |
0.1 A |
0.1 A |
0.1 A |
0.1 A |
| Collector-emitter maximum voltage |
50 V |
50 V |
50 V |
50 V |
50 V |
| Configuration |
SINGLE WITH BUILT-IN RESISTOR |
SINGLE WITH BUILT-IN RESISTOR |
SINGLE WITH BUILT-IN RESISTOR |
SINGLE WITH BUILT-IN RESISTOR |
SINGLE WITH BUILT-IN RESISTOR |
| Minimum DC current gain (hFE) |
30 |
30 |
30 |
30 |
30 |
| JESD-30 code |
R-PDSO-G3 |
R-PDSO-G3 |
R-PSIP-T3 |
R-PDSO-G3 |
R-PSIP-T3 |
| JESD-609 code |
e1 |
e1 |
e1 |
e1 |
e1 |
| Number of components |
1 |
1 |
1 |
1 |
1 |
| Number of terminals |
3 |
3 |
3 |
3 |
3 |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
SMALL OUTLINE |
SMALL OUTLINE |
IN-LINE |
SMALL OUTLINE |
IN-LINE |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
260 |
| Polarity/channel type |
PNP |
PNP |
PNP |
PNP |
NPN |
| Maximum power dissipation(Abs) |
0.2 W |
0.15 W |
0.3 W |
0.2 W |
0.3 W |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| surface mount |
YES |
YES |
NO |
YES |
NO |
| Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
TIN SILVER COPPER |
TIN SILVER COPPER |
Tin/Silver/Copper (Sn/Ag/Cu) |
TIN SILVER COPPER |
| Terminal form |
GULL WING |
GULL WING |
THROUGH-HOLE |
GULL WING |
THROUGH-HOLE |
| Terminal location |
DUAL |
DUAL |
SINGLE |
DUAL |
SINGLE |
| Maximum time at peak reflow temperature |
10 |
10 |
10 |
10 |
10 |
| transistor applications |
SWITCHING |
SWITCHING |
SWITCHING |
SWITCHING |
SWITCHING |
| Transistor component materials |
SILICON |
SILICON |
SILICON |
SILICON |
SILICON |
| Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
- |