Shift Register, 4-Bit, CMOS, CDIP16
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | RCA |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDIP-T16 |
| JESD-609 code | e0 |
| Number of digits | 4 |
| Number of functions | 1 |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5/15 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| CD4035BF/3A | CD4035BFX | CD4035BEX | CD4035BJ | CD4035BF/3W | CD4035BK/3 | |
|---|---|---|---|---|---|---|
| Description | Shift Register, 4-Bit, CMOS, CDIP16 | Shift Register, 4-Bit, CMOS, CDIP16, | Shift Register, 4-Bit, CMOS, PDIP16, | Shift Register, 4-Bit, CMOS, CQCC20 | Shift Register, 4-Bit, CMOS, CDIP16 | Shift Register, 4-Bit, CMOS, CDFP16 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | RCA | RCA | RCA | RCA | RCA | RCA |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | S-XQCC-N20 | R-XDIP-T16 | R-XDFP-F16 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of digits | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 16 | 16 | 16 | 20 | 16 | 16 |
| Maximum operating temperature | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -40 °C | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP | QCCN | DIP | DFP |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 | LCC20,.35SQ | DIP16,.3 | FL16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | FLATPACK |
| power supply | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| surface mount | NO | NO | NO | YES | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | INDUSTRIAL | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | FLAT |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| Certification status | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified |
| package instruction | - | DIP, DIP16,.3 | DIP, DIP16,.3 | QCCN, LCC20,.35SQ | - | DFP, FL16,.3 |
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