CD4035BK/3 datasheet, PDF - EEWORLD Datasheet

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CD4035BK/3: DescriptionShift Register, 4-Bit, CMOS, CDFP16; Categorylogic logic; File Size267KB，5 Pages; ManufacturerRCA

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CD4035BK/3 Overview

Shift Register, 4-Bit, CMOS, CDFP16

CD4035BK/3 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	RCA
package instruction	DFP, FL16,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDFP-F16
JESD-609 code	e0
Number of digits	4
Number of functions	1
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL16,.3
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	5/15 V
Certification status	Not Qualified
Filter level	MIL-STD-883 Class B (Modified)
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

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CD4035BK/3 Related Products

	CD4035BK/3	CD4035BFX	CD4035BEX	CD4035BF/3A	CD4035BJ	CD4035BF/3W
Description	Shift Register, 4-Bit, CMOS, CDFP16	Shift Register, 4-Bit, CMOS, CDIP16,	Shift Register, 4-Bit, CMOS, PDIP16,	Shift Register, 4-Bit, CMOS, CDIP16	Shift Register, 4-Bit, CMOS, CQCC20	Shift Register, 4-Bit, CMOS, CDIP16
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	RCA	RCA	RCA	RCA	RCA	RCA
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDFP-F16	R-XDIP-T16	R-PDIP-T16	R-XDIP-T16	S-XQCC-N20	R-XDIP-T16
JESD-609 code	e0	e0	e0	e0	e0	e0
Number of digits	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1
Number of terminals	16	16	16	16	20	16
Maximum operating temperature	125 °C	125 °C	85 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-40 °C	-55 °C	-55 °C	-55 °C
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DFP	DIP	DIP	DIP	QCCN	DIP
Encapsulate equivalent code	FL16,.3	DIP16,.3	DIP16,.3	DIP16,.3	LCC20,.35SQ	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	FLATPACK	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE
power supply	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V
surface mount	YES	NO	NO	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	INDUSTRIAL	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	FLAT	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	QUAD	DUAL
Base Number Matches	1	1	1	1	1	1
package instruction	DFP, FL16,.3	DIP, DIP16,.3	DIP, DIP16,.3	-	QCCN, LCC20,.35SQ	-
Certification status	Not Qualified	-	-	Not Qualified	Not Qualified	Not Qualified

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