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ZL38001QDC

Description
AEC for Analog Hands-Free Communication
CategoryWireless rf/communication    Telecom circuit   
File Size524KB,49 Pages
ManufacturerZarlink Semiconductor (Microsemi)
Websitehttp://www.zarlink.com/
Download Datasheet Parametric Compare View All

ZL38001QDC Overview

AEC for Analog Hands-Free Communication

ZL38001QDC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerZarlink Semiconductor (Microsemi)
package instructionHTFQFP,
Reach Compliance Codecompliant
JESD-30 codeS-PQFP-G48
JESD-609 codee0
length7 mm
Humidity sensitivity level3
Number of functions1
Number of terminals48
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeHTFQFP
Package shapeSQUARE
Package formFLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)240
Certification statusNot Qualified
Maximum seat height1.2 mm
Nominal supply voltage3.3 V
surface mountYES
Telecom integrated circuit typesISDN ECHO CANCELLER
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width7 mm
ZL38001
AEC for Analog Hands-Free
Communication
Data Sheet
Zarlink has introduced a new generation family of
AEC (ZL38002 and ZL38004). Zarlink recommends
these products for new designs.
October 2006
Features
Contains two echo cancellers: 112 ms acoustic
echo canceller + 16 ms line echo canceller
Works with low cost voice codec. ITU-T G.711 or
signed mag
µ/A-Law,
or linear 2’s comp
Each port may operate in different format
Advanced NLP design - full duplex speech with
no switched loss on audio paths
Fast re-convergence time: tracks changing echo
environment quickly
Adaptation algorithm converges even during
Double-Talk
Designed for exceptional performance in high
background noise environments
Provides protection against narrow-band signal
divergence
Howling prevention stops uncontrolled oscillation
in high loop gain conditions
Offset nulling of all PCM channels
Serial micro-controller interface
Ordering Information
ZL38001DGA
36 Pin QSOP Tubes
ZL38001QDC
48 Pin TQFP
Trays
ZL38001QDG1 48 Pin TQFP* Trays, Bake & Drypack
ZL38001DGF1 36 Pin SSOP* Tape & Reel,
Bake & Drypack
ZL38001DGE1 36 Pin SSOP* Tubes, Bake & Drypack
*Pb Free Matte Tin
-40°C to +85°C
ST-BUS, GCI, or variable-rate SSI PCM interfaces
User gain control provided for speaker path
(-24 dB to +48 dB in 3 dB steps)
18 dB gain at Sout to compensate for high ERL
environments
AGC on speaker path
Handles up to 0 dB acoustic echo return loss
Transparent data transfer and mute options
20 MHz master clock operation
Low power mode during PCM Bypass
Bootloadable for future factory software upgrades
2.7 V to 3.6 V supply voltage; 5 V-tolerant inputs
Sin
MD1
µ
/A-Law/
Linear
Offset
Null
+
Limiter
+
-
S
2
ADV
NLP
Program
RAM
S
3
Program
ROM
18dB
Gain
Linear/
µ/A-Law
Sout
DATA1
ACOUSTIC ECHO PATH
NBSD
S
1
Micro
Interface
DATA2
CONTROL
UNIT
Adaptive
Filter
Double
Talk
Detector
R
3
R
2
ADV
NLP
Line ECho Path
PORT 1
PORT 2
Adaptive
Filter
NBSD
Howling
Controller
R
1
MD2
Rout
L
inear/
µ
/A-Law
Limiter
SCLK
-24 -> +21 dB
AGC
User
Gain
-
CS
+
+
Offset
Null
µ
/A-Law/
Linear
Rin
VDD
VSS
RESET
FORMAT
ENA2
ENA1
LAW
F0i
BCLK/C4i
MCLK
Figure 1 - Functional Block Diagram
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2004-2006, Zarlink Semiconductor Inc. All Rights Reserved.

ZL38001QDC Related Products

ZL38001QDC ZL38001DGA ZL38001QDG1 ZL38001_06 ZL38001DGF1 ZL38001DGE1
Description AEC for Analog Hands-Free Communication AEC for Analog Hands-Free Communication AEC for Analog Hands-Free Communication AEC for Analog Hands-Free Communication AEC for Analog Hands-Free Communication AEC for Analog Hands-Free Communication
Is it Rohs certified? incompatible - conform to - conform to conform to
Maker Zarlink Semiconductor (Microsemi) - Zarlink Semiconductor (Microsemi) - Zarlink Semiconductor (Microsemi) Zarlink Semiconductor (Microsemi)
package instruction HTFQFP, - HTFQFP, - SSOP, SSOP,
Reach Compliance Code compliant - compli - compli compli
JESD-30 code S-PQFP-G48 - S-PQFP-G48 - R-PDSO-G36 R-PDSO-G36
JESD-609 code e0 - e3 - e3 e3
length 7 mm - 7 mm - 15.37 mm 15.37 mm
Humidity sensitivity level 3 - 3 - 3 3
Number of functions 1 - 1 - 1 1
Number of terminals 48 - 48 - 36 36
Maximum operating temperature 85 °C - 85 °C - 85 °C 85 °C
Minimum operating temperature -40 °C - -40 °C - -40 °C -40 °C
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HTFQFP - HTFQFP - SSOP SSOP
Package shape SQUARE - SQUARE - RECTANGULAR RECTANGULAR
Package form FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH - FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH - SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius) 240 - 260 - 260 260
Certification status Not Qualified - Not Qualified - Not Qualified Not Qualified
Maximum seat height 1.2 mm - 1.2 mm - 2.64 mm 2.64 mm
Nominal supply voltage 3.3 V - 3.3 V - 3.3 V 3.3 V
surface mount YES - YES - YES YES
Telecom integrated circuit types ISDN ECHO CANCELLER - ISDN ECHO CANCELLER - ISDN ECHO CANCELLER ISDN ECHO CANCELLER
Temperature level INDUSTRIAL - INDUSTRIAL - INDUSTRIAL INDUSTRIAL
Terminal surface TIN LEAD - Matte Tin (Sn) - Matte Tin (Sn) Matte Tin (Sn)
Terminal form GULL WING - GULL WING - GULL WING GULL WING
Terminal pitch 0.5 mm - 0.5 mm - 0.8 mm 0.8 mm
Terminal location QUAD - QUAD - DUAL DUAL
Maximum time at peak reflow temperature 30 - 30 - 30 30
width 7 mm - 7 mm - 7.5 mm 7.5 mm

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