PEEL22CV10ZJI35 datasheet, PDF

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PEEL22CV10ZJI35: DescriptionProgrammable Logic Device; CategoryProgrammable logic devices Programmable logic; File Size631KB，7 Pages; ManufacturerIntegrated Circuit Systems（IDT ）

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PEEL22CV10ZJI35 Overview

Programmable Logic Device

PEEL22CV10ZJI35 Parametric

Parameter Name	Attribute value
Maker	Integrated Circuit Systems（IDT ）
Reach Compliance Code	unknown
Base Number Matches	1

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PEEL22CV10ZJI35 Related Products

	PEEL22CV10ZJI35	PEEL22CV10ZP-25	PEEL22CV10ZJ-25
Description	Programmable Logic Device	EE PLD, 25ns, PAL-Type, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24	EE PLD, 25ns, PAL-Type, CMOS, PQCC28, PLASTIC, LCC-28
Maker	Integrated Circuit Systems（IDT ）	Integrated Circuit Systems（IDT ）	Integrated Circuit Systems（IDT ）
Reach Compliance Code	unknown	unknown	unknown
Base Number Matches	1	1	-
Is it Rohs certified?	-	incompatible	incompatible
Parts packaging code	-	DIP	QLCC
package instruction	-	DIP, DIP24,.3	QCCJ, LDCC28,.5SQ
Contacts	-	24	28
Other features	-	10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK	10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
Architecture	-	PAL-TYPE	PAL-TYPE
maximum clock frequency	-	33.3 MHz	33.3 MHz
JESD-30 code	-	R-PDIP-T24	S-PQCC-J28
JESD-609 code	-	e0	e0
length	-	31.75 mm	11.5062 mm
Dedicated input times	-	11	11
Number of I/O lines	-	10	10
Number of entries	-	22	22
Output times	-	10	10
Number of product terms	-	132	132
Number of terminals	-	24	28
Maximum operating temperature	-	70 °C	70 °C
organize	-	11 DEDICATED INPUTS, 10 I/O	11 DEDICATED INPUTS, 10 I/O
Output function	-	MACROCELL	MACROCELL
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	DIP	QCCJ
Encapsulate equivalent code	-	DIP24,.3	LDCC28,.5SQ
Package shape	-	RECTANGULAR	SQUARE
Package form	-	IN-LINE	CHIP CARRIER
power supply	-	5 V	5 V
Programmable logic type	-	EE PLD	EE PLD
propagation delay	-	25 ns	25 ns
Certification status	-	Not Qualified	Not Qualified
Maximum supply voltage	-	5.25 V	5.25 V
Minimum supply voltage	-	4.75 V	4.75 V
Nominal supply voltage	-	5 V	5 V
surface mount	-	NO	YES
technology	-	CMOS	CMOS
Temperature level	-	COMMERCIAL	COMMERCIAL
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	-	THROUGH-HOLE	J BEND
Terminal pitch	-	2.54 mm	1.27 mm
Terminal location	-	DUAL	QUAD
width	-	7.62 mm	11.5062 mm

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