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PDSP16510AMAGCPR

Description
Stand Alone FFT Processor
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size190KB,24 Pages
ManufacturerZarlink Semiconductor (Microsemi)
Websitehttp://www.zarlink.com/
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PDSP16510AMAGCPR Overview

Stand Alone FFT Processor

PDSP16510AMAGCPR Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerZarlink Semiconductor (Microsemi)
package instructionQFF, QFL132,.95SQ,25
Reach Compliance Codecompliant
ECCN code3A001.A.2.C
Is SamacsysN
boundary scanNO
maximum clock frequency40 MHz
External data bus width16
JESD-30 codeS-CQFP-F132
JESD-609 codee0
length24.1935 mm
low power modeNO
Number of terminals132
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Output data bus width16
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFF
Encapsulate equivalent codeQFL132,.95SQ,25
Package shapeSQUARE
Package formFLATPACK
Peak Reflow Temperature (Celsius)225
power supply5 V
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum seat height2.49 mm
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formFLAT
Terminal pitch0.635 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width24.1935 mm
uPs/uCs/peripheral integrated circuit typeDSP PERIPHERAL, FFT PROCESSOR
Base Number Matches1
PDSP16510A MA
PDSP16510A MA
Stand Alone FFT Processor
Advance Information
DS3762
ISSUE 3.0
October 1998
The PDSP16510 performs Forward or Inverse Fast
Fourier Transforms on complex or real data sets containing up
to 1024 points. Data and coefficients are each represented by
16 bits, with block floating point arithmetic for increased
dynamic range.
An internal RAM is provided which can hold up to 1024
complex data points. This removes the memory transfer
bottleneck, inherent in building block solutions. Its organisa-
tion allows the PDSP16510 to simultaneously input new data,
transform data stored in the RAM, and to output previous
results. No external buffering is needed for transforms con-
taining up to 256 points, and the PDSP16510 can be directly
connected to an A/D converter to perform continuous trans-
forms. The user can choose to overlap data blocks by either
0%, 50%, or 75%. Inputs and outputs are asynchronous to the
40MHz system clock used for internal operations.
A 1024 point complex transform can be completed in
some 98µs, which is equivalent to throughput rates of 450
million operations per second. Multiple devices can be con-
nected in parallel in order to increase the sampling rate up to
the 40MHz system clock. Six devices are needed to give the
maximum performance with 1024 point transforms.
Either a Hamming or a Blackman-Harris window operator
can be internally applied to the incoming real or complex data.
The latter gives 67dB side lobe attenuation. The operator
values are calculated internally and do not require an external
ROM nor do they incur any time penalty.
The device outputs the real and imaginary components of
the frequency bins. These can be directly connected to the
PDSP16330 in order to produce magnitude and phase values
from the complex data.
DATA INPUT
3 TERM
WINDOW
OPERATOR
COEFFICIENT
ROM
WORKSPACE
RAM
WORKSPACE
RAM
FOUR
DATA PATHS
OUTPUT
BUFFER
RESULT OUPUT
Fig. 1. Block Diagram
FEATURES
Completely self contained FFT Processor
Internal RAM supports up to1024 complex points
16 bit data and coefficients plus block floating point for
increased dynamic range
450 MIP operation gives 98 microsecond transforma-
tion times for 1024 points
Rev
Date
A
B
C
D
Up to 40MHz sampling rates with A grade multiple
devices.
Internal window operator gives 67dB side lobe
attenuation and needs no external ROM.
132 pin surface mount package
MAR 1993 JAN 1997 OCT 1998
NOTE
Polyimide is used as an inter-layer dielectric and as
glassivation.
Polymeric material is also used for die attach which according
to the requirement in paragraph 1.2.1.b. (2) precludes
catagorising this device as fully compliant. In every other
respect this device has been manufactured and screened in
full accordance with the requirements of Mil-Std 883 (latest
revision).
CHANGE NOTIFICATION
The change notification requirements of MIL-PRF-38535 will
be implemented on this device type. Known customers will be
notified of any changes since the last buy when ordering
further parts if significant changes have been made.
ORDERING INFORMATION
PDSP16510A MA GCPR
(Power Ceramic QFP Package
- HIREL LEVEL A Screening)
PDSP16510A MA AC1R
(Power Ceramic PGA Package
- HIREL LEVEL A Screening)
1

PDSP16510AMAGCPR Related Products

PDSP16510AMAGCPR PDSP16510AMAAC1R
Description Stand Alone FFT Processor Stand Alone FFT Processor
Is it Rohs certified? incompatible incompatible
Maker Zarlink Semiconductor (Microsemi) Zarlink Semiconductor (Microsemi)
package instruction QFF, QFL132,.95SQ,25 PGA, PGA84,13X13
Reach Compliance Code compliant compli
ECCN code 3A001.A.2.C 3A001.A.2.C
boundary scan NO NO
maximum clock frequency 40 MHz 40 MHz
External data bus width 16 16
JESD-30 code S-CQFP-F132 S-CPGA-P84
JESD-609 code e0 e0
length 24.1935 mm 33.525 mm
low power mode NO NO
Number of terminals 132 84
Maximum operating temperature 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C
Output data bus width 16 16
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code QFF PGA
Encapsulate equivalent code QFL132,.95SQ,25 PGA84,13X13
Package shape SQUARE SQUARE
Package form FLATPACK GRID ARRAY
Peak Reflow Temperature (Celsius) 225 225
power supply 5 V 5 V
Certification status Not Qualified Not Qualified
Filter level MIL-STD-883 MIL-STD-883
Maximum seat height 2.49 mm 6.15 mm
Maximum supply voltage 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V
surface mount YES NO
technology CMOS CMOS
Temperature level MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form FLAT PIN/PEG
Terminal pitch 0.635 mm 2.54 mm
Terminal location QUAD PERPENDICULAR
Maximum time at peak reflow temperature 30 30
width 24.1935 mm 33.525 mm
uPs/uCs/peripheral integrated circuit type DSP PERIPHERAL, FFT PROCESSOR DSP PERIPHERAL, FFT PROCESSOR

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