to GND ........................................................................ –0.3V to +6V
Analog Inputs to GND ............................................ –0.3V to +V
CC
+ 0.3V
Digital Inputs to GND ............................................. –0.3V to +V
CC
+ 0.3V
Power Dissipation .......................................................................... 250mW
Maximum Junction Temperature ................................................... +150°C
Operating Temperature Range ........................................ –40°C to +85°C
Storage Temperature Range ......................................... –65°C to +150°C
Lead Temperature (soldering, 10s) ............................................... +300°C
NOTE: (1) Stresses above these ratings can cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION
(1)
MAXIMUM
INTEGRAL
LINEARITY
ERROR (LSB)
±2
SPECIFIED
TEMPERATURE
RANGE
–40°C to +85°C
PRODUCT
ADS7846E
PACKAGE-LEAD
SSOP-16
PACKAGE
DESIGNATOR
DBQ
PACKAGE
MARKING
ADS7846E
ORDERING
NUMBER
ADS7846E
ADS7846E/2K5
ADS7846N
ADS7846N/2K5
ADS7846N/2K5G4
ADS7846IGQCR
ADS7846IRGVT
ADS7846IRGVR
"
ADS7846N
"
±2
"
TSSOP-16
"
PW
"
–40°C to +85°C
"
ADS7846N
"
"
ADS7846I
ADS7846I
"
"
±2
±2
"
"
VFBGA-48
QFN-16
"
"
GQC
RGV
"
"
–40°C to +85°C
–40°C to +85°C
"
"
ADS7846
ADS7846
"
"
"
"
"
"
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or see the TI web site
at www.ti.com.
2
ADS7846
www.ti.com
SBAS125H
ELECTRICAL CHARACTERISTICS
At T
A
= –40°C to +85°C, +V
CC
= +2.7V, V
REF
= 2.5V internal voltage, f
SAMPLE
= 125kHz, f
CLK
= 16 • f
SAMPLE
= 2MHz, 12-bit mode, and digital inputs = GND or +V
CC
,
unless otherwise noted.
ADS7846E
PARAMETER
ANALOG INPUT
Full-Scale Input Span
Absolute Input Range
Capacitance
Leakage Current
SYSTEM PERFORMANCE
Resolution
No Missing Codes
Integral Linearity Error
Offset Error
Gain Error
Noise
Power-Supply Rejection
SAMPLING DYNAMICS
Conversion Time
Acquisition Time
Throughput Rate
Multiplexer Settling Time
Aperture Delay
Aperture Jitter
Channel-to-Channel Isolation
SWITCH DRIVERS
On-Resistance
Y+, X+
Y–, X–
Drive Current
(2)
REFERENCE OUTPUT
Internal Reference Voltage
Internal Reference Drift
Quiescent Current
REFERENCE INPUT
Range
Input Impedance
CONDITIONS
Positive Input-Negative Input
Positive Input
Negative Input
MIN
0
–0.2
–0.2
25
0.1
12
11
±2
±6
±4
70
70
12
3
125
500
30
100
100
TYP
MAX
V
REF
+V
CC
+ 0.2
+0.2
UNITS
V
V
V
pF
µA
Bits
Bits
LSB
(1)
LSB
LSB
µVrms
dB
CLK Cycles
CLK Cycles
kHz
ns
ns
ps
dB
External V
REF
Including Internal V
REF
V
IN
= 2.5Vp-p at 50kHz
5
6
Duration 100ms
2.45
2.50
15
500
50
2.55
Ω
Ω
mA
V
ppm/°C
µA
V
GΩ
Ω
1.0
SER/DFR = 0, PD1 = 0,
Internal Reference Off
Internal Reference On
0.5
10
1
External V
REF
= 2.5V
Internal Reference
–2
–3
–40
Differential Method
(3)
TEMP0
(4)
Differential Method
(3)
TEMP0
(4)
1.6
0.3
±2
±3
CMOS
| I
IH
|
≤
+5µA
| I
IL
|
≤
+5µA
I
OH
= –250µA
I
OL
= 250µA
T
A
= 0°C to +85°C, 50kΩ Pull-Up
Straight Binary
Specified Performance
Operating Range
Internal Reference Off
Internal Reference On
f
SAMPLE
= 12.5kHz
Power-Down Mode with
CS = DCLK = DIN = +V
CC
+V
CC
= +2.7V
2.7
2.2
280
780
220
+V
CC
• 0.7
–0.3
+V
CC
• 0.8
1
250
+V
CC
BATTERY MONITOR
Input Voltage Range
Input Impedance
Sampling Battery
Battery Monitor Off
Accuracy
TEMPERATURE MEASUREMENT
Temperature Range
Resolution
Accuracy
DIGITAL INPUT/OUTPUT
Logic Family
Logic Levels, Except
PENIRQ
V
IH
V
IL
V
OH
V
OL
PENIRQ
V
OL
Data Format
POWER-SUPPLY REQUIREMENTS
+V
CC(5)
Quiescent Current
6.0
V
kΩ
GΩ
%
%
°C
°C
°C
°C
°C
+2
+3
+85
+V
CC
+ 0.3
+0.8
0.4
0.8
V
V
V
V
3.6
5.25
650
3
1.8
–40
+85
V
V
µA
µA
µA
µA
mW
°C
Power Dissipation
TEMPERATURE RANGE
Specified Performance
NOTES: (1) LSB means least significant bit. With V
REF
equal to +2.5V, one LSB is 610µV. (2) Ensured by design, but not tested. Exceeding 50mA source current
may result in device degradation. (3) Difference between TEMP0 and TEMP1 measurement. No calibration necessary. (4) Temperature drift is –2.1mV/°C.
(5) ADS7846 operates down to 2.2V.
ADS7846
SBAS125H
www.ti.com
3
PIN CONFIGURATION
Top View
SSOP, TSSOP
Top View
DCLK
CS
DIN
BUSY DOUT
VFBGA
+V
CC
X+
Y+
X–
Y–
GND
V
BAT
AUX
1
2
3
4
5
6
7
8
ADS7846
16
15
14
13
12
11
10
9
DCLK
CS
DIN
BUSY
DOUT
PENIRQ
X+
+V
CC
C
+V
CC
D
1
A NC
2
3
4
5
6
7
NC
B
NC
NC
NC
NC
NC
PENIRQ
NC
NC
NC
NC
+V
CC
NC
NC
NC
NC
NC
V
REF
+V
CC
V
REF
Y+
E
NC
NC
NC
NC
NC
AUX
F NC
NC
NC
NC
NC
NC
NC
G NC
NC
X–
Y–
GND
GND
V
BAT
Top View
15 PENIRQ
QFN
16 DOUT
14 +V
CC
BUSY
DIN
CS
DCLK
1
2
ADS7846
3
4
5
6
7
8
13 V
REF
12
11
10
9
AUX
V
BAT
GND
Y–
X+
PIN DESCRIPTION
SSOP AND
TSSOP PIN #
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
VFBGA PIN #
B1 and C1
D1
E1
G2
G3
G4 and G5
G6
E7
D7
C7
B7
A6
A5
A4
A3
A2
QFN PIN #
5
6
7
8
9
10
11
12
13
14
15
16
1
2
3
4
NAME
+V
CC
X+
Y+
X–
Y–
GND
V
BAT
AUX
V
REF
+V
CC
PENIRQ
DOUT
BUSY
DIN
CS
DCLK
DESCRIPTION
Power Supply
X+ Position Input
Y+ Position Input
X– Position Input
Y– Position Input
Ground
Battery Monitor Input
Auxiliary Input to ADC
Voltage Reference Input/Output
Digital I/O Power Supply
Pen Interrupt. Open anode output (requires 10kΩ to 100kΩ pull-up resistor externally).
Serial Data Output. Data is shifted on the falling edge of DCLK. This output is high
impedance when
CS
is high.
Busy Output. This output is high impedance when
CS
is high.
Serial Data Input. If
CS
is low, data is latched on rising edge of DCLK.
Chip Select Input. Controls conversion timing and enables the serial input/output register.
CS
high = power-down mode (ADC only).
External Clock Input. This clock runs the SAR conversion process and synchronizes serial data
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Embedded System
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