(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
Operating Junction Temperature Range
Symbol
V
RRM
V
RWM
V
R
Value
Unit
V
50
100
1.0
2.0
50
−65
to +175
A
I
F(AV)
I
FSM
T
J
A
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Lead (T
L
= 25°C) (Note 1)
Thermal Resistance, Junction−to−Ambient (Note 1)
Symbol
Psi
JL
(Note 2)
R
qJA
Max
24
216
Unit
°C/W
1. Rating applies when surface mounted on the minimum pad size recommended, PC Board FR−4.
2. In compliance with JEDEC 51, these values (historically represented by R
qJL
) are now referenced as Psi
JL
.
ELECTRICAL CHARACTERISTICS
Characteristic
Maximum Instantaneous Forward Voltage (Note 3)
(i
F
= 2.0 A, T
J
= 25°C)
(i
F
= 2.0 A, T
J
= 150°C)
Maximum Instantaneous Reverse Current (Note 3)
(Rated DC Voltage, T
J
= 25°C)
(Rated DC Voltage, T
J
= 150°C)
Maximum Reverse Recovery Time
(i
F
= 1.0 A, di/dt = 50 A/ms)
Symbol
v
F
Max
0.94
0.74
2.0
50
30
Unit
V
i
R
mA
t
rr
ns
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Pulse Test: Pulse Width = 300
ms,
Duty Cycle
≤
2.0%.
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2
MURA205, SURA8205, MURA210, NRVUA210V, SURA8210,
TYPICAL CHARACTERISTICS
100
I
R
, REVERSE CURRENT (mA)
10
1
0.1
0.01
T
J
= 175°C
100
I
R
, REVERSE CURRENT (mA)
T
J
= 175°C
10
T
J
= 100°C
1
T
J
= 25°C
T
J
= 100°C
T
J
= 25°C
0
20
40
60
80
100
0.001
0.1
0
20
40
60
80
100
V
R
, REVERSE VOLTAGE (VOLTS)
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 1. Typical Reverse Current
I
F
, INSTANTANEOUS FORWARD CURRENT (A)
I
F
, INSTANTANEOUS FORWARD CURRENT (A)
Figure 2. Maximum Reverse Current
10
T
C
= 175°C
100°C
25°C
1
10
T
C
= 175°C
100°C
25°C
1
0.1
0.1
0.01
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
0.01
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
V
F
, INSTANTANEOUS VOLTAGE (VOLTS)
V
F
, INSTANTANEOUS VOLTAGE (VOLTS)
Figure 3. Typical Forward Voltage
Figure 4. Maximum Forward Voltage
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3
MURA205, SURA8205, MURA210, NRVUA210V, SURA8210,
TYPICAL CHARACTERISTICS
50
45
C, CAPACITANCE (pF)
35
30
25
20
15
10
5
0
0
4
8
12
16
20
24
28
32
36
40
C, CAPACITANCE (pF)
40
NOTE: TYPICAL
CAPACITANCE AT
0 V = 45 pF
50
40
30
20
10
0
0
4
8
12
16
20
24
28
32
36
40
60
NOTE: MAXIMUM
CAPACITANCE AT
0 V = 48 pF
V
R
, REVERSE VOLTAGE (VOLTS)
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 5. Typical Capacitance
Figure 6. Maximum Capacitance
I
F(AV)
, AVERAGE FORWARD CURRENT (A)
3.5
3
dc
R
qJL
= 24°C/W
T
J
= 175°C
I
F
, AVERAGE FORWARD CURRENT (A)
4
1.5
R
qJA
= 216°C/W
T
J
= 175°C
dc
1
SQUARE
WAVE
0.5
2.5 SQUARE WAVE
2
1.5
1
0.5
0
100 110
120
130
140
150
160
170
180
0
0
20
40
60
80
100
120
140
160
T
L
, LEAD TEMPERATURE (°C)
T
A
, AMBIENT TEMPERATURE (°C)
Figure 7. Current Derating, Lead
Figure 8. Current Derating, Ambient
(FR−4 Board with Minimum Pad)
P
F
, AVERAGE POWER DISSIPATION (W)
2.5
T
J
= 175°C
2
1.5
1
0.5
0
SQUARE WAVE
dc
0
0.5
1
1.5
2
2.5
3
3.5
I
F(AV)
, AVERAGE FORWARD CURRENT (AMPS)
Figure 9. Power Dissipation
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4
MURA205, SURA8205, MURA210, NRVUA210V, SURA8210,
PACKAGE DIMENSIONS
SMA
CASE 403D
ISSUE H
H
E
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L.
DIM
A
A1
b
c
D
E
H
E
L
MIN
1.97
0.05
1.27
0.15
2.29
4.06
4.83
0.76
MILLIMETERS
NOM
MAX
2.10
2.20
0.10
0.20
1.45
1.63
0.28
0.41
2.60
2.92
4.32
4.57
5.21
5.59
1.14
1.52
MIN
0.078
0.002
0.050
0.006
0.090
0.160
0.190
0.030
INCHES
NOM
0.083
0.004
0.057
0.011
0.103
0.170
0.205
0.045
MAX
0.087
0.008
0.064
0.016
0.115
0.180
0.220
0.060
b
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
(SEE STYLES)
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
A
A1
L
c
SOLDERING FOOTPRINT*
4.000
0.157
2.000
0.079
2.000
0.079
SCALE 8:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
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