®
EMIF10-LCD01F1
IPAD
TM
10 LINES EMI FILTER
AND ESD PROTECTION
MAIN PRODUCT CHARACTERISTICS:
Where EMI filtering in ESD sensitive equipment is
required :
LCD for Mobile phones
Computers and printers
Communication systems
MCU Boards
DESCRIPTION
The EMIF10-LCD01F1 is a 10 lines highly
integrated devices designed to suppress EMI/RFI
noise in all systems subjected to electromagnetic
interferences. The EMIF10 flip chip packaging
means the package size is equal to the die size.
This filter includes an ESD protection circuitry,
which prevents the device from destruction when
subjected to ESD surges up 15kV.
s
s
s
s
Flip Chip package
PIN CONFIGURATION (ball side)
BENEFITS
EMI symmetrical (I/O) low-pass filter
High efficiency in EMI filtering
Very low PCB space consuming:
2.64mm x 2.64mm
Very thin package: 0.65 mm
High efficiency in ESD suppression on input
pins (IEC6100-4-2 level 4)
High reliability offered by monolithic integration
High reducing of parasitic elements through in-
tegration & wafer level packaging.
s
s
s
s
s
s
s
5
I5
I10
GND
4
I4
I9
GND
3
I3
I8
GND
2
I2
I7
GND
1
I1
I6
GND
A
B
C
D
E
O10
O5
O9
O4
O8
O3
O7
O2
O6
O1
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC61000-4-2
Level 4 input pins 15kV (air discharge)
8 kV (contact discharge)
Level 1 output pins 2kV (air discharge)
2kV (contact discharge)
MIL STD 883E - Method 3015-6 Class 3
BASIC CELL CONFIGURATION
Low-pass Filter
Input
Output
Ri/o = 100
Ω
Cline = 35pF
GND
TM
: IPAD is a trademark of STMicroelectronics.
GND
GND
November 2003 - Ed: 2A
1/6
EMIF10-LCD01F1
ABSOLUTE MAXIMUM RATINGS
(T
amb
= 25 °C)
Symbol
T
j
T
op
T
stg
Parameter and test conditions
Maximum junction temperature
Operating temperature range
Storage temperature range
Value
125
-40 to + 85
-55 to +150
Unit
°C
°C
°C
ELECTRICAL CHARACTERISTICS
(T
amb
= 25°C)
Symbol
V
BR
I
RM
V
RM
V
CL
R
d
I
PP
R
I/O
C
line
Parameters
Breakdown voltage
Leakage current @ V
RM
Stand-off voltage
Clamping voltage
Dynamic impedance
Peak pulse current
Series resistance between Input &
Output
Input capacitance per line
I
PP
V
CL
V
BR
V
RM
I
RM
I
R
V
F
V
I
I
F
Symbol
V
BR
I
RM
R
I/O
C
line
Rt / Ft
At 0V bias
I
R
= 1mA
V
RM
= 3V
Test conditions
Min
6
90
Typ
8
100
8
(1)
Max
10
500
110
35
Unit
V
nA
Ω
pF
ns
Induced rise and fall time 10-90% at 26 MHz fre-
quency signal V = 1.9 V (Rt / Ft input 1 ns, 50Ω
impedance generator)
(1) guaranteed by design
Fig. 1:
S21(dB) all lines attenuation measurement
and Aplac simulation.
Fig. 2:
Analog crosstalk measurements.
2/6
EMIF10-LCD01F1
Fig. 3:
ESD response to IEC61000-4-2 (+15kV air
discharge) on one input and one output.
Fig. 4:
ESD response to IEC61000-4-2 (-15kV air
discharge) on one input and one output.
V
in
V
out
Fig. 5:
Line capacitance versus applied voltage.
Fig. 6:
Rise time 10-90% measurements with
1.9V signal at 26 MHz frequency (50Ω generator).
CLine(pF)
35
30
25
20
15
10
5
0
0.0
VLine(V)
1.0
2.0
3.0
4.0
5.0
Fig. 7:
Fall time 10-90% measurements with 1.9V
signal at 26 MHz frequency (50Ω generator).
3/6
EMIF10-LCD01F1
Aplac model.
EMIF10-LCD01F1 model
Ground return
Aplac parameters.
ZRZ structure
aplacvar Remif10low 100
aplacvar Cemif10flow 17.5pF
Bumps
aplacvar Lbump 50pH
aplacvar Rbump 20m
aplacvar Cbump 1.5pF
Bulk
aplacvar Rsub 100m
Gnd connections
aplacvar Rgnd 100m
aplacvar Lgnd 200pH
aplacvar Cgnd 0.15pF
BV = 7
CJO = Cemif10low
IBV = 1u
IKF = 1000
IS = 10f
ISR = 100p
N=1
M = 0.3333
RS = 0.015
VJ = 0.6
TT = 50n
ORDER CODE
EMIF
EMI Filter
Number of lines
yy
-
xxx
zz
F
x
1: Pitch = 500µm Bump = 315µm
2: Leadfree Pitch = 500µm Bump = 315µm
3: Leadfree Pitch = 400µm Bump = 250µm
4: Pitch = 500µm Bump = 250µm
Flip Chip
x: resistance value (Ohms) z: capacitance value / 10(pF)
or
Application (3 letters) and Version (2 digits)
4/6
EMIF10-LCD01F1
PACKAGE MECHANICAL DATA
FLIP CHIP
500µm ± 50
500µm ± 50
315µm ± 50
650µm ± 65
2.64mm ± 50µm
2.64mm ± 50µm
250µm ± 40
FOOT PRINT RECOMMENDATIONS
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 315µm copper pad diameter
MARKING
Dot, ST logo
xxx = marking
yww = datecode
(y = year
ww = week)
545
545
400
x x x
y ww
100
230
All dimensions in µm
5/6
Embedded System
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