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HN58C65P-25

Description
8192-word X 8-bit Electrically Erasable and Programmable CMOS ROM
Categorystorage    storage   
File Size109KB,16 Pages
ManufacturerHitachi (Renesas )
Websitehttp://www.renesas.com/eng/
Download Datasheet Parametric Compare View All

HN58C65P-25 Overview

8192-word X 8-bit Electrically Erasable and Programmable CMOS ROM

HN58C65P-25 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeDIP
package instructionDIP, DIP28,.6
Contacts28
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time250 ns
Other features100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; 32 BYTE PAGE WRITE; AUTOMATIC WRITE
command user interfaceNO
Data pollingYES
Data retention time - minimum10
JESD-30 codeR-PDIP-T28
JESD-609 codee0
length35.6 mm
memory density65536 bi
Memory IC TypeEEPROM
memory width8
Number of functions1
Number of terminals28
word count8192 words
character code8000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize8KX8
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP28,.6
Package shapeRECTANGULAR
Package formIN-LINE
page size32 words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height5.7 mm
Maximum standby current0.001 A
Maximum slew rate0.025 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitNO
width15.24 mm
Base Number Matches1
HN58C65 Series
8192-word
×
8-bit Electrically Erasable and Programmable CMOS
ROM
ADE-203-374A (Z)
Rev. 1.0
Apr. 12, 1995
Description
The Hitachi HN58C65 is a electrically erasable and programmable ROM organized as 8192-word
×
8-bit. It
realizes high speed, low power consumption, and a high level of reliability, employing advanced MNOS
memory technology and CMOS process and circuitry technology. It also has a 32-byte page programming
function to make its erase and write operations faster.
Features
Single 5 V Supply
On chip latches: address, data,
CE, OE, WE
Automatic byte write: 10 ms max
Automatic page write (32 byte): 10 ms max
Fast access time: 250 ns max
Low power dissipation: 20 mW/MHz typ (Active)
2.0 mW typ (Standby)
Data
polling and Ready/Busy
Data protection circuity on power on/power off
Conforms to JEDEC byte-wide standard
Reliable CMOS with MNOS cell technology
10
5
erase/write cycles (in page mode)
10 year data retention
Ordering Information
Type No.
HN58C65P-25
HN58C65FP-25
Note:
Access Time
250 ns
250 ns
Package
600 mil 28 pin plastic DIP (DP-28)
28 pin plastic SOP
*1
(FP-28D/DA)
1. T is added to the end of the type no. for a SOP of 3.0 mm (max) thickness.

HN58C65P-25 Related Products

HN58C65P-25 HN58C65 HN58C65FP-25
Description 8192-word X 8-bit Electrically Erasable and Programmable CMOS ROM 8192-word X 8-bit Electrically Erasable and Programmable CMOS ROM 8192-word X 8-bit Electrically Erasable and Programmable CMOS ROM
Is it Rohs certified? incompatible - incompatible
Parts packaging code DIP - SOIC
package instruction DIP, DIP28,.6 - SOP, SOP28,.5
Contacts 28 - 28
Reach Compliance Code unknow - unknow
ECCN code EAR99 - EAR99
Maximum access time 250 ns - 250 ns
Other features 100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; 32 BYTE PAGE WRITE; AUTOMATIC WRITE - 100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; 32 BYTE PAGE WRITE; AUTOMATIC WRITE
command user interface NO - NO
Data polling YES - YES
Data retention time - minimum 10 - 10
JESD-30 code R-PDIP-T28 - R-PDSO-G28
JESD-609 code e0 - e0
length 35.6 mm - 18.3 mm
memory density 65536 bi - 65536 bi
Memory IC Type EEPROM - EEPROM
memory width 8 - 8
Number of functions 1 - 1
Number of terminals 28 - 28
word count 8192 words - 8192 words
character code 8000 - 8000
Operating mode ASYNCHRONOUS - ASYNCHRONOUS
Maximum operating temperature 70 °C - 70 °C
organize 8KX8 - 8KX8
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code DIP - SOP
Encapsulate equivalent code DIP28,.6 - SOP28,.5
Package shape RECTANGULAR - RECTANGULAR
Package form IN-LINE - SMALL OUTLINE
page size 32 words - 32 words
Parallel/Serial PARALLEL - PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED
power supply 5 V - 5 V
Programming voltage 5 V - 5 V
Certification status Not Qualified - Not Qualified
ready/busy YES - YES
Maximum seat height 5.7 mm - 2.5 mm
Maximum standby current 0.001 A - 0.001 A
Maximum slew rate 0.025 mA - 0.025 mA
Maximum supply voltage (Vsup) 5.5 V - 5.5 V
Minimum supply voltage (Vsup) 4.5 V - 4.5 V
Nominal supply voltage (Vsup) 5 V - 5 V
surface mount NO - YES
technology CMOS - CMOS
Temperature level COMMERCIAL - COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE - GULL WING
Terminal pitch 2.54 mm - 1.27 mm
Terminal location DUAL - DUAL
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED
switch bit NO - NO
width 15.24 mm - 8.4 mm
Base Number Matches 1 - 1
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