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2SC1623-TP-HF

Description
Small Signal Bipolar Transistor,
CategoryDiscrete semiconductor    The transistor   
File Size478KB,4 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance
Download Datasheet Parametric View All

2SC1623-TP-HF Overview

Small Signal Bipolar Transistor,

2SC1623-TP-HF Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
package instructionSMALL OUTLINE, R-PDSO-G3
Reach Compliance Codecompliant
Maximum collector current (IC)0.1 A
Collector-emitter maximum voltage50 V
ConfigurationSINGLE
Minimum DC current gain (hFE)135
JESD-30 codeR-PDSO-G3
Number of components1
Number of terminals3
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Polarity/channel typeNPN
Maximum power dissipation(Abs)0.2 W
surface mountYES
Terminal formGULL WING
Terminal locationDUAL
Transistor component materialsSILICON
Nominal transition frequency (fT)250 MHz
VCEsat-Max0.3 V
Base Number Matches1
2SC1623
Features
Halogen Free Available Upon Request By Adding Suffix "-HF"
Moisture Sensitivity Level 1
Epoxy Meets UL 94 V-0 Flammability Rating
Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS
Compliant. See Ordering Information)
Maximum Ratings @ 25° Unless Otherwise Specified
C
Operating Junction Temperature Range: -55℃ to +150℃
Storage Temperature Range:
-55℃ to +150℃
Thermal Resistance: 625℃/W Junction to Ambient
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Power Dissipation
Symbol
V
CBO
V
CEO
V
EBO
I
C
P
D
Rating
60
50
5
100
200
Unit
V
V
V
mA
mW
NPN Silicon
Epitaxial Transistors
SOT-23
A
D
3
1
2
C
B
F
E
Internal Structure
3
1
2
G
K
H
J
L
1.BASE
2.EMITTER
3.COLLECTOR
DIMENSIONS
INCHES
MM
DIM
MIN MAX MIN MAX
A
0.110 0.120 2.80
3.04
B
0.083 0.104 2.10 2.64
C
0.047 0.055 1.20 1.40
0.034
0.041
0.85 1.05
D
E
0.067 0.083 1.70 2.10
F
0.018 0.024 0.45 0.60
G
0.0004 0.006
0.01 0.15
H
0.035
0.043 0.90 1.10
J
0.003
0.007 0.08 0.18
K
0.012
0.020
0.30
0.51
L
0.007
0.020
0.20 0.50
Suggested Solder Pad Layout
0.031
0.800
0.035
0.900
0.079
2.000
NOTE
inches
mm
0.037
0.950
0.037
0.950
Rev.3-1-01012019
1/4
MCCSEMI.COM

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