time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are
advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the
product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not
authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc. – www.issi.com
Rev. A, 10/17/2012
3
IS31FL3235
ABSOLUTE MAXIMUM RATINGS
Supply voltage, V
CC
Voltage at SCL, SDA, SDB
Voltage at OUT1 to OUT28
GND thermal current
Maximum junction temperature, T
JMAX
Storage temperature range, T
STG
Operating temperature range, T
A
-0.3V
~ +6.0V
-0.3V
~ V
CC
+0.3V
+5V
400mA
150°C
-65°C
~ +150°C
−40°C
~ +85°C
Note:
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other condition beyond those indicated in the operational sections of the specifications is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
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FPGA/CPLD
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