8413202SX datasheet, PDF - EEWORLD Datasheet

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8413202SX: DescriptionStandard SRAM, 16KX1, 45ns, CMOS, 0.540 X 0.300 INCH, 0.100 INCH HEIGHT, FP-20; Categorystorage storage; File Size189KB，7 Pages; ManufacturerCypress Semiconductor

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8413202SX Overview

Standard SRAM, 16KX1, 45ns, CMOS, 0.540 X 0.300 INCH, 0.100 INCH HEIGHT, FP-20

8413202SX Parametric

Parameter Name	Attribute value
Maker	Cypress Semiconductor
Parts packaging code	DFP
package instruction	DFP,
Contacts	20
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	45 ns
Other features	AUTOMATIC POWER-DOWN
JESD-30 code	R-XDFP-F20
length	12.7 mm
memory density	16384 bit
Memory IC Type	STANDARD SRAM
memory width	1
Number of functions	1
Number of terminals	20
word count	16384 words
character code	16000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	16KX1
Package body material	UNSPECIFIED
encapsulated code	DFP
Package shape	RECTANGULAR
Package form	FLATPACK
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	2.286 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
width	6.985 mm
Base Number Matches	1

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8413202SX Related Products

	8413202SX	8413202SA	8413202YA	8413205SA	8413205YA	8413202YX	8413205SX	2661250402_18	8413205YX
Description	Standard SRAM, 16KX1, 45ns, CMOS, 0.540 X 0.300 INCH, 0.100 INCH HEIGHT, FP-20	Standard SRAM, 16KX1, 40ns, CMOS, CDFP20, CERPACK-20	Standard SRAM, 16KX1, 40ns, CMOS, CQCC20, CERAMIC, LCC-20	Standard SRAM, 16KX1, 35ns, CMOS, CDFP20, CERPACK-20	Standard SRAM, 16KX1, 35ns, CMOS, CQCC20, CERAMIC, LCC-20	Standard SRAM, 16KX1, 45ns, CMOS, 0.440 X 0.305 INCH, 0.120 INCH HEIGHT, LCC-20	Standard SRAM, 16KX1, 35ns, CMOS, 0.540 X 0.300 INCH, 0.100 INCH HEIGHT, FP-20	EMI Suppression Beads	Standard SRAM, 16KX1, 35ns, CMOS, 0.440 X 0.305 INCH, 0.120 INCH HEIGHT, LCC-20
Maker	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	-	Cypress Semiconductor
Parts packaging code	DFP	DFP	QLCC	DFP	QLCC	QLCC	DFP	-	QLCC
package instruction	DFP,	DFP,	CERAMIC, LCC-20	CERPACK-20	CERAMIC, LCC-20	QCCN,	DFP,	-	QCCN,
Contacts	20	20	20	20	20	20	20	-	20
Reach Compliance Code	unknown	unknown	compliant	compliant	compliant	unknown	unknown	-	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	-	3A001.A.2.C
Maximum access time	45 ns	40 ns	40 ns	35 ns	35 ns	45 ns	35 ns	-	35 ns
Other features	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	-	AUTOMATIC POWER-DOWN	-	-
JESD-30 code	R-XDFP-F20	R-GDFP-F20	R-CQCC-N20	R-GDFP-F20	R-CQCC-N20	S-XQCC-N20	R-XDFP-F20	-	S-XQCC-N20
length	12.7 mm	12.7 mm	10.8585 mm	12.7 mm	10.8585 mm	-	12.7 mm	-	-
memory density	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	-	16384 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	-	STANDARD SRAM
memory width	1	1	1	1	1	1	1	-	1
Number of functions	1	1	1	1	1	1	1	-	1
Number of terminals	20	20	20	20	20	20	20	-	20
word count	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	-	16384 words
character code	16000	16000	16000	16000	16000	16000	16000	-	16000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	-	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-	-55 °C
organize	16KX1	16KX1	16KX1	16KX1	16KX1	16KX1	16KX1	-	16KX1
Package body material	UNSPECIFIED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	UNSPECIFIED	-	UNSPECIFIED
encapsulated code	DFP	DFP	QCCN	DFP	QCCN	QCCN	DFP	-	QCCN
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	-	SQUARE
Package form	FLATPACK	FLATPACK	CHIP CARRIER	FLATPACK	CHIP CARRIER	CHIP CARRIER	FLATPACK	-	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	-	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
Filter level	MIL-STD-883	-	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	MIL-STD-883	MIL-STD-883	-	MIL-STD-883
Maximum seat height	2.286 mm	2.286 mm	1.9812 mm	2.286 mm	1.9812 mm	-	2.286 mm	-	-
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	-	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	-	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	-	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	-	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	-	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	-	MILITARY
Terminal form	FLAT	FLAT	NO LEAD	FLAT	NO LEAD	NO LEAD	FLAT	-	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	-	1.27 mm	-	-
Terminal location	DUAL	DUAL	QUAD	DUAL	QUAD	QUAD	DUAL	-	QUAD
width	6.985 mm	6.985 mm	7.366 mm	6.985 mm	7.366 mm	-	6.985 mm	-	-
Base Number Matches	1	1	1	1	1	1	1	-	-

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