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5962-9206502MYA

Description
OTP ROM, 64KX8, 20ns, CMOS, CQCC32
Categorystorage    storage   
File Size244KB,8 Pages
ManufacturerCypress Semiconductor
Download Datasheet Parametric Compare View All

5962-9206502MYA Overview

OTP ROM, 64KX8, 20ns, CMOS, CQCC32

5962-9206502MYA Parametric

Parameter NameAttribute value
MakerCypress Semiconductor
package instructionQCCN,
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time20 ns
JESD-30 codeR-CQCC-N32
JESD-609 codee0
memory density524288 bit
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals32
word count65536 words
character code64000
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize64KX8
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQCCN
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTIN LEAD
Terminal formNO LEAD
Terminal locationQUAD
Base Number Matches1

5962-9206502MYA Related Products

5962-9206502MYA 5962-9207101MXA 5962-9207102MXA
Description OTP ROM, 64KX8, 20ns, CMOS, CQCC32 UVPROM, 64KX8, 70ns, CMOS, CDIP28, CERAMIC, DIP-28 UVPROM, 64KX8, 60ns, CMOS, CDIP28, CERAMIC, DIP-28
package instruction QCCN, DIP, DIP,
Reach Compliance Code unknown unknown unknown
ECCN code EAR99 EAR99 EAR99
Maximum access time 20 ns 70 ns 60 ns
JESD-30 code R-CQCC-N32 R-GDIP-T28 R-GDIP-T28
memory density 524288 bit 524288 bit 524288 bit
Memory IC Type OTP ROM UVPROM UVPROM
memory width 8 8 8
Number of functions 1 1 1
Number of terminals 32 28 28
word count 65536 words 65536 words 65536 words
character code 64000 64000 64000
Operating mode SYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C
organize 64KX8 64KX8 64KX8
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
encapsulated code QCCN DIP DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount YES NO NO
technology CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY
Terminal form NO LEAD THROUGH-HOLE THROUGH-HOLE
Terminal location QUAD DUAL DUAL
Maker Cypress Semiconductor - Cypress Semiconductor
Base Number Matches 1 1 -
Parts packaging code - DIP DIP
Contacts - 28 28
Filter level - MIL-STD-883 MIL-STD-883
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