EEWORLDEEWORLDEEWORLD

Part Number

Search

89HPES6T5ZBBCGI

Description
CABGA-196, Tray
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size439KB,29 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
Download Datasheet Parametric Compare View All

89HPES6T5ZBBCGI Online Shopping

Suppliers Part Number Price MOQ In stock  
89HPES6T5ZBBCGI - - View Buy Now

89HPES6T5ZBBCGI Overview

CABGA-196, Tray

89HPES6T5ZBBCGI Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeCABGA
package instructionCABGA-196
Contacts196
Manufacturer packaging codeBCG196
Reach Compliance Codecompliant
ECCN codeEAR99
Samacsys DescriptionCHIP ARRAY BGA 15.0 X 15.0 X 1.0 MM PIT
Address bus width
Bus compatibilityPCI
maximum clock frequency125 MHz
External data bus width
JESD-30 codeS-PBGA-B196
JESD-609 codee1
length15 mm
Humidity sensitivity level3
Number of terminals196
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA196,14X14,40
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)260
power supply1,3.3 V
Certification statusNot Qualified
Maximum seat height1.5 mm
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width15 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
Base Number Matches1
6-Lane 5-Port
PCI Express® Switch
®
89HPES6T5
Data Sheet
The 89HPES6T5 is a member of IDT’s PRECISE™ family of PCI
Express switching solutions. The PES6T5 is an 6-lane, 5-port peripheral
chip that performs PCI Express Base switching. It provides connectivity
and switching functions between a PCI Express upstream port and up to
four downstream ports and supports switching between downstream
ports.
Device Overview
u
u
Features
u
u
u
High Performance PCI Express Switch
– Six 2.5Gbps PCI Express lanes
– Five switch ports
– Upstream port is x2
– Downstream ports are x1
– Low-latency cut-through switch architecture
– Support for Max Payload Sizes up to 256 bytes
– One virtual channel
– Eight traffic classes
– PCI Express Base Specification Revision 1.1 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Bus locking
u
u
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates six 2.5 Gbps embedded SerDes with 8B/10B
encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
– Supports ECRC and Advanced Error Reporting
– Supports PCI Express Native Hot-Plug, Hot-Swap capable I/O
– Compatible with Hot-Plug I/O expanders used on PC mother-
boards
Power Management
– Utilizes advanced low-power design techniques to achieve low
typical power consumption
– Support PCI Power Management Interface specification (PCI-
PM 1.2)
– Unused SerDes are disabled.
– Supports Advanced Configuration and Power Interface Speci-
fication, Revision 2.0 (ACPI) supporting active link state
Testability and Debug Features
– Built in Pseudo-Random Bit Stream (PRBS) generator
– Numerous SerDes test modes
– Ability to read and write any internal register via the SMBus
– Ability to bypass link training and force any link into any mode
– Provides statistics and performance counters
Block Diagram
5-Port Switch Core / 6 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Mux / Demux
Phy
Logical
Layer
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
(Port 0)
(Port 2)
(Port 3)
Figure 1 Internal Block Diagram
(Port 4)
(Port 5)
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 28
June 18, 2014

89HPES6T5ZBBCGI Related Products

89HPES6T5ZBBCGI WBC-T0303AS-06-2840-BD 89HPES6T5ZBBCG 89HPES6T5ZBBCI8
Description CABGA-196, Tray Array/Network Resistor, Center Tap, Thin Film, 0.25W, 284ohm, 100V, 0.1% +/-Tol, -50,50ppm/Cel, 0303, CABGA-196, Tray CABGA-196, Reel
Is it Rohs certified? conform to conform to conform to incompatible
Reach Compliance Code compliant compliant compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99
Number of terminals 196 6 196 196
Maximum operating temperature 85 °C 150 °C 70 °C 85 °C
Minimum operating temperature -40 °C -55 °C - -40 °C
Package form GRID ARRAY, LOW PROFILE SMT GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
technology CMOS THIN FILM CMOS CMOS
Brand Name Integrated Device Technology - Integrated Device Technology Integrated Device Technology
Is it lead-free? Lead free - Lead free Contains lead
Maker IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code CABGA - CABGA CABGA
package instruction CABGA-196 - LBGA, BGA196,14X14,40 LBGA,
Contacts 196 - 196 196
Manufacturer packaging code BCG196 - BCG196 BC196
Bus compatibility PCI - PCI PCI; SMBUS
maximum clock frequency 125 MHz - 125 MHz 125 MHz
JESD-30 code S-PBGA-B196 - S-PBGA-B196 S-PBGA-B196
JESD-609 code e1 - e1 e0
length 15 mm - 15 mm 15 mm
Humidity sensitivity level 3 - 3 3
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA - LBGA LBGA
Package shape SQUARE - SQUARE SQUARE
Peak Reflow Temperature (Celsius) 260 - 260 225
Maximum seat height 1.5 mm - 1.5 mm 1.5 mm
Maximum supply voltage 1.1 V - 1.1 V 1.1 V
Minimum supply voltage 0.9 V - 0.9 V 0.9 V
Nominal supply voltage 1 V - 1 V 1 V
surface mount YES - YES YES
Temperature level INDUSTRIAL - COMMERCIAL INDUSTRIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) - Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb)
Terminal form BALL - BALL BALL
Terminal pitch 1 mm - 1 mm 1 mm
Terminal location BOTTOM - BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 - 30 NOT SPECIFIED
width 15 mm - 15 mm 15 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI - BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches 1 - 1 1
Another year has passed, let’s review 2022, set goals for 2023, and start again together!
The year is coming to an end, and we are about to start a new chapter. At this special time, we always hope that everyone can do one thing together - look back on the past and understand how we have c...
okhxyyo Talking
Live Review: Basic Knowledge, Application and Calibration of Fluke Data Loggers on December 7
Live broadcast time: December 7 (Wednesday) 10:00-11:30 amLive broadcast topic: Basic knowledge of Fluke data loggers, their applications and calibrationWatch replay: Click to watch Questions and Answ...
EEWORLD社区 Energy Infrastructure?
Live Review: December 8th MPS new generation magnetic angle sensor MA600 introduction and application
Live broadcast time: December 8 (Thursday) 10:00-11:30 amLive broadcast topic: Introduction and application of MPS new generation magnetic angle sensor MA600Watch replay: Click to watch ppt download: ...
EEWORLD社区 Robotics Development
[BoLiu BL606P audio and video development board] 1. Environment construction and HelloWord Demo operation
Thanks to EEWorld and Pingtou Ge for providing the [Pingtou Ge Bo Liu BL606P Audio and Video Development Board]. I was lucky enough to get the opportunity to review it again. 1. Hardware This is what ...
kit7828 XuanTie RISC-V Activity Zone
Looking back at 2022 and looking forward to 2023+A busy year
●How did you spend 2022? At work: I organized the COVID-19 vaccination day and night, conducted COVID-19 epidemiological investigation day and night, and took nucleic acid samples day and night until ...
lugl4313820 Talking
【Sipeed BL808 all-round board】- Development environment 2 burning software
【Sipeed BL808 all-round board】- Development environment 2 burning software 1. Download BouffaloLabDevCube-v1.8.1: 2. Read this document: 3. Prepare three files to be burned: burn helloworld here Parti...
damiaa Domestic Chip Exchange

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1152  2294  2110  254  933  24  47  43  6  19 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号