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89HPES6T5ZBBCI8

Description
CABGA-196, Reel
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size439KB,29 Pages
ManufacturerIDT (Integrated Device Technology)
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89HPES6T5ZBBCI8 Overview

CABGA-196, Reel

89HPES6T5ZBBCI8 Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeCABGA
package instructionLBGA,
Contacts196
Manufacturer packaging codeBC196
Reach Compliance Codenot_compliant
ECCN codeEAR99
Address bus width
Bus compatibilityPCI; SMBUS
maximum clock frequency125 MHz
Maximum data transfer rate3000 MBps
External data bus width
JESD-30 codeS-PBGA-B196
JESD-609 codee0
length15 mm
Humidity sensitivity level3
Number of terminals196
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)225
Maximum seat height1.5 mm
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width15 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
Base Number Matches1
6-Lane 5-Port
PCI Express® Switch
®
89HPES6T5
Data Sheet
The 89HPES6T5 is a member of IDT’s PRECISE™ family of PCI
Express switching solutions. The PES6T5 is an 6-lane, 5-port peripheral
chip that performs PCI Express Base switching. It provides connectivity
and switching functions between a PCI Express upstream port and up to
four downstream ports and supports switching between downstream
ports.
Device Overview
u
u
Features
u
u
u
High Performance PCI Express Switch
– Six 2.5Gbps PCI Express lanes
– Five switch ports
– Upstream port is x2
– Downstream ports are x1
– Low-latency cut-through switch architecture
– Support for Max Payload Sizes up to 256 bytes
– One virtual channel
– Eight traffic classes
– PCI Express Base Specification Revision 1.1 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Bus locking
u
u
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates six 2.5 Gbps embedded SerDes with 8B/10B
encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
– Supports ECRC and Advanced Error Reporting
– Supports PCI Express Native Hot-Plug, Hot-Swap capable I/O
– Compatible with Hot-Plug I/O expanders used on PC mother-
boards
Power Management
– Utilizes advanced low-power design techniques to achieve low
typical power consumption
– Support PCI Power Management Interface specification (PCI-
PM 1.2)
– Unused SerDes are disabled.
– Supports Advanced Configuration and Power Interface Speci-
fication, Revision 2.0 (ACPI) supporting active link state
Testability and Debug Features
– Built in Pseudo-Random Bit Stream (PRBS) generator
– Numerous SerDes test modes
– Ability to read and write any internal register via the SMBus
– Ability to bypass link training and force any link into any mode
– Provides statistics and performance counters
Block Diagram
5-Port Switch Core / 6 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Mux / Demux
Phy
Logical
Layer
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
(Port 0)
(Port 2)
(Port 3)
Figure 1 Internal Block Diagram
(Port 4)
(Port 5)
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 28
June 18, 2014

89HPES6T5ZBBCI8 Related Products

89HPES6T5ZBBCI8 WBC-T0303AS-06-2840-BD 89HPES6T5ZBBCG 89HPES6T5ZBBCGI
Description CABGA-196, Reel Array/Network Resistor, Center Tap, Thin Film, 0.25W, 284ohm, 100V, 0.1% +/-Tol, -50,50ppm/Cel, 0303, CABGA-196, Tray CABGA-196, Tray
Is it Rohs certified? incompatible conform to conform to conform to
Reach Compliance Code not_compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99
Number of terminals 196 6 196 196
Maximum operating temperature 85 °C 150 °C 70 °C 85 °C
Minimum operating temperature -40 °C -55 °C - -40 °C
Package form GRID ARRAY, LOW PROFILE SMT GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
technology CMOS THIN FILM CMOS CMOS
Brand Name Integrated Device Technology - Integrated Device Technology Integrated Device Technology
Is it lead-free? Contains lead - Lead free Lead free
Maker IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code CABGA - CABGA CABGA
package instruction LBGA, - LBGA, BGA196,14X14,40 CABGA-196
Contacts 196 - 196 196
Manufacturer packaging code BC196 - BCG196 BCG196
Bus compatibility PCI; SMBUS - PCI PCI
maximum clock frequency 125 MHz - 125 MHz 125 MHz
JESD-30 code S-PBGA-B196 - S-PBGA-B196 S-PBGA-B196
JESD-609 code e0 - e1 e1
length 15 mm - 15 mm 15 mm
Humidity sensitivity level 3 - 3 3
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA - LBGA LBGA
Package shape SQUARE - SQUARE SQUARE
Peak Reflow Temperature (Celsius) 225 - 260 260
Maximum seat height 1.5 mm - 1.5 mm 1.5 mm
Maximum supply voltage 1.1 V - 1.1 V 1.1 V
Minimum supply voltage 0.9 V - 0.9 V 0.9 V
Nominal supply voltage 1 V - 1 V 1 V
surface mount YES - YES YES
Temperature level INDUSTRIAL - COMMERCIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) - Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL - BALL BALL
Terminal pitch 1 mm - 1 mm 1 mm
Terminal location BOTTOM - BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED - 30 30
width 15 mm - 15 mm 15 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI - BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches 1 - 1 1
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