Microprocessor, 16-Bit, 5MHz, NMOS, CDIP40, CERAMIC, DIP-40
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| Parts packaging code | DIP |
| package instruction | DIP, DIP40,.6 |
| Contacts | 40 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| Address bus width | 20 |
| bit size | 16 |
| boundary scan | NO |
| maximum clock frequency | 5 MHz |
| External data bus width | 16 |
| Format | FIXED POINT |
| Integrated cache | NO |
| JESD-30 code | R-GDIP-T40 |
| JESD-609 code | e0 |
| length | 52.2605 mm |
| low power mode | NO |
| Number of DMA channels | |
| Number of external interrupt devices | 2 |
| Number of serial I/Os | |
| Number of terminals | 40 |
| On-chip data RAM width | |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP40,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (number of words) | 0 |
| Filter level | 38535Q/M;38534H;883B |
| Maximum seat height | 6.096 mm |
| speed | 5 MHz |
| Maximum slew rate | 340 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | NMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |
| Base Number Matches | 1 |

| 8086/BQA | D8086-2 | D8086-1 | D8086-2B | D8086 | 8086-2/BQA | ID8086B | N8086-2 | N8086-1 | |
|---|---|---|---|---|---|---|---|---|---|
| Description | Microprocessor, 16-Bit, 5MHz, NMOS, CDIP40, CERAMIC, DIP-40 | Microprocessor, 16-Bit, 8MHz, NMOS, CDIP40, CERAMIC, DIP-40 | Microprocessor, 16-Bit, 10MHz, NMOS, CDIP40, CERAMIC, DIP-40 | Microprocessor, 16-Bit, 8MHz, NMOS, CDIP40, CERAMIC, DIP-40 | Microprocessor, 16-Bit, 5MHz, NMOS, CDIP40, CERAMIC, DIP-40 | Microprocessor, 16-Bit, 8MHz, NMOS, CDIP40, CERAMIC, DIP-40 | Microprocessor, 16-Bit, 5MHz, NMOS, CDIP40, CERAMIC, DIP-40 | Microprocessor, 16-Bit, 8MHz, NMOS, PQCC44, PLASTIC, LCC-44 | Microprocessor, 16-Bit, 10MHz, NMOS, PQCC44, PLASTIC, LCC-44 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | DIP | DIP | DIP | DIP | DIP | DIP | DIP | LCC | LCC |
| package instruction | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | PLASTIC, LCC-44 | PLASTIC, LCC-44 |
| Contacts | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 44 | 44 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Address bus width | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| bit size | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| boundary scan | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| maximum clock frequency | 5 MHz | 8 MHz | 10 MHz | 8 MHz | 5 MHz | 8 MHz | 5 MHz | 8 MHz | 10 MHz |
| External data bus width | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Format | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| Integrated cache | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| JESD-30 code | R-GDIP-T40 | R-GDIP-T40 | R-GDIP-T40 | R-GDIP-T40 | R-GDIP-T40 | R-GDIP-T40 | R-GDIP-T40 | S-PQCC-J44 | S-PQCC-J44 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 52.2605 mm | 52.2605 mm | 52.2605 mm | 52.2605 mm | 52.2605 mm | 52.2605 mm | 52.2605 mm | 16.5862 mm | 16.5862 mm |
| low power mode | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| Number of external interrupt devices | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 44 | 44 |
| Maximum operating temperature | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C | 85 °C | 70 °C | 70 °C |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DIP | QCCJ | QCCJ |
| Encapsulate equivalent code | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | LDCC44,.7SQ | LDCC44,.7SQ |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 6.096 mm | 6.096 mm | 6.096 mm | 6.096 mm | 6.096 mm | 6.096 mm | 6.096 mm | 4.57 mm | 4.57 mm |
| speed | 5 MHz | 8 MHz | 10 MHz | 8 MHz | 5 MHz | 8 MHz | 5 MHz | 8 MHz | 10 MHz |
| Maximum slew rate | 340 mA | 340 mA | 340 mA | 340 mA | 340 mA | 340 mA | 340 mA | 340 mA | 340 mA |
| Maximum supply voltage | 5.5 V | 5.25 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V | 5.25 V | 5.25 V |
| Minimum supply voltage | 4.5 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V | 4.75 V | 4.75 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO | NO | YES | YES |
| technology | NMOS | NMOS | NMOS | NMOS | NMOS | NMOS | NMOS | NMOS | NMOS |
| Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 16.5862 mm | 16.5862 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR |
| Maker | AMD | AMD | AMD | AMD | AMD | - | AMD | AMD | AMD |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |