D8086-1 datasheet, PDF - EEWORLD Datasheet

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D8086-1: DescriptionMicroprocessor, 16-Bit, 10MHz, NMOS, CDIP40, CERAMIC, DIP-40; CategoryThe embedded processor and controller Microcontrollers and processors; File Size975KB，31 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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D8086-1 Overview

Microprocessor, 16-Bit, 10MHz, NMOS, CDIP40, CERAMIC, DIP-40

D8086-1 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	AMD
Parts packaging code	DIP
package instruction	DIP, DIP40,.6
Contacts	40
Reach Compliance Code	unknown
Address bus width	20
bit size	16
boundary scan	NO
maximum clock frequency	10 MHz
External data bus width	16
Format	FIXED POINT
Integrated cache	NO
JESD-30 code	R-GDIP-T40
JESD-609 code	e0
length	52.2605 mm
low power mode	NO
Number of DMA channels
Number of external interrupt devices	2
Number of serial I/Os
Number of terminals	40
On-chip data RAM width
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP40,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
RAM (number of words)	0
Maximum seat height	6.096 mm
speed	10 MHz
Maximum slew rate	340 mA
Maximum supply voltage	5.25 V
Minimum supply voltage	4.75 V
Nominal supply voltage	5 V
surface mount	NO
technology	NMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR
Base Number Matches	1

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D8086-1 Related Products

	D8086-1	D8086-2	D8086-2B	D8086	8086/BQA	8086-2/BQA	ID8086B	N8086-2	N8086-1
Description	Microprocessor, 16-Bit, 10MHz, NMOS, CDIP40, CERAMIC, DIP-40	Microprocessor, 16-Bit, 8MHz, NMOS, CDIP40, CERAMIC, DIP-40	Microprocessor, 16-Bit, 8MHz, NMOS, CDIP40, CERAMIC, DIP-40	Microprocessor, 16-Bit, 5MHz, NMOS, CDIP40, CERAMIC, DIP-40	Microprocessor, 16-Bit, 5MHz, NMOS, CDIP40, CERAMIC, DIP-40	Microprocessor, 16-Bit, 8MHz, NMOS, CDIP40, CERAMIC, DIP-40	Microprocessor, 16-Bit, 5MHz, NMOS, CDIP40, CERAMIC, DIP-40	Microprocessor, 16-Bit, 8MHz, NMOS, PQCC44, PLASTIC, LCC-44	Microprocessor, 16-Bit, 10MHz, NMOS, PQCC44, PLASTIC, LCC-44
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	LCC	LCC
package instruction	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	PLASTIC, LCC-44	PLASTIC, LCC-44
Contacts	40	40	40	40	40	40	40	44	44
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Address bus width	20	20	20	20	20	20	20	20	20
bit size	16	16	16	16	16	16	16	16	16
boundary scan	NO	NO	NO	NO	NO	NO	NO	NO	NO
maximum clock frequency	10 MHz	8 MHz	8 MHz	5 MHz	5 MHz	8 MHz	5 MHz	8 MHz	10 MHz
External data bus width	16	16	16	16	16	16	16	16	16
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	NO	NO	NO	NO	NO	NO	NO	NO	NO
JESD-30 code	R-GDIP-T40	R-GDIP-T40	R-GDIP-T40	R-GDIP-T40	R-GDIP-T40	R-GDIP-T40	R-GDIP-T40	S-PQCC-J44	S-PQCC-J44
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	52.2605 mm	52.2605 mm	52.2605 mm	52.2605 mm	52.2605 mm	52.2605 mm	52.2605 mm	16.5862 mm	16.5862 mm
low power mode	NO	NO	NO	NO	NO	NO	NO	NO	NO
Number of external interrupt devices	2	2	2	2	2	2	2	2	2
Number of terminals	40	40	40	40	40	40	40	44	44
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	125 °C	125 °C	85 °C	70 °C	70 °C
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	QCCJ	QCCJ
Encapsulate equivalent code	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6	LDCC44,.7SQ	LDCC44,.7SQ
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	6.096 mm	6.096 mm	6.096 mm	6.096 mm	6.096 mm	6.096 mm	6.096 mm	4.57 mm	4.57 mm
speed	10 MHz	8 MHz	8 MHz	5 MHz	5 MHz	8 MHz	5 MHz	8 MHz	10 MHz
Maximum slew rate	340 mA	340 mA	340 mA	340 mA	340 mA	340 mA	340 mA	340 mA	340 mA
Maximum supply voltage	5.25 V	5.25 V	5.25 V	5.5 V	5.5 V	5.5 V	5.5 V	5.25 V	5.25 V
Minimum supply voltage	4.75 V	4.75 V	4.75 V	4.5 V	4.5 V	4.5 V	4.5 V	4.75 V	4.75 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	YES	YES
technology	NMOS	NMOS	NMOS	NMOS	NMOS	NMOS	NMOS	NMOS	NMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY	INDUSTRIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	16.5862 mm	16.5862 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR
Maker	AMD	AMD	AMD	AMD	AMD	-	AMD	AMD	AMD
Base Number Matches	1	1	1	1	1	1	-	-	-

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