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89HPES24N3AZCBXG

Description
SBGA-420, Tray
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size784KB,32 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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89HPES24N3AZCBXG Overview

SBGA-420, Tray

89HPES24N3AZCBXG Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeSBGA
package instructionSBGA-420
Contacts420
Manufacturer packaging codeBXG420
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresALSO REQUIRES 3.3V SUPPLY
Address bus width
Bus compatibilityPCI
maximum clock frequency125 MHz
External data bus width
JESD-30 codeS-PBGA-B420
JESD-609 codee1
length27 mm
Humidity sensitivity level3
Number of terminals420
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA420,26X26,40
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Certification statusNot Qualified
Maximum seat height1.7 mm
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width27 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
Base Number Matches1
24-Lane 3-Port
PCI Express® Switch
®
89HPES24N3A
Data Sheet
Device Overview
The 89HPES24N3A is a member of the IDT PRECISE™ family of
PCI Express® switching solutions. The PES24N3A is a 24-lane, 3-port
peripheral chip that performs PCI Express packet switching with a
feature set optimized for high performance applications such as servers,
storage, and communications/networking. It provides connectivity and
switching functions between a PCI Express upstream port and two
downstream ports and supports switching between downstream ports.
Features
High Performance PCI Express Switch
– Twenty-four 2.5 Gbps PCI Express lanes
– Three switch ports
– Upstream port configurable up to x8
– Downstream ports configurable up to x8
– Low-latency cut-through switch architecture
– Support for Max Payload Size up to 2048 bytes
– One virtual channel
– Eight traffic classes
– PCI Express Base Specification Revision 1.1 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic per port link width negotiation to x8, x4, x2 or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion on all lanes
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Bus locking
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates twenty-four 2.5 Gbps embedded SerDes with 8B/
10B encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Supports ECRC and Advanced Error Reporting
– Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
– Supports PCI Express Native Hot-Plug, Hot-Swap capable I/O
– Compatible with Hot-Plug I/O expanders used on PC and
server motherboards
Block Diagram
3-Port Switch Core
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
...
...
...
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
24 PCI Express Lanes
x8 Upstream Port and Two x8 Downstream Ports
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 31
April 23, 2008
DSC 6921

89HPES24N3AZCBXG Related Products

89HPES24N3AZCBXG 89HPES24N3AZGBXG 89HPES24N3AZGBX 89HPES24N3AZCBX
Description SBGA-420, Tray SBGA-420, Tray SBGA-420, Tray SBGA-420, Tray
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Lead free Lead free Contains lead Contains lead
Is it Rohs certified? conform to conform to incompatible incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code SBGA SBGA SBGA SBGA
package instruction SBGA-420 LBGA, BGA420,26X26,40 SBGA-420 SBGA-420
Contacts 420 420 420 420
Manufacturer packaging code BXG420 BXG420 BX420 BX420
Reach Compliance Code compliant compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99
Other features ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
Bus compatibility PCI PCI PCI PCI
maximum clock frequency 125 MHz 125 MHz 125 MHz 125 MHz
JESD-30 code S-PBGA-B420 S-PBGA-B420 S-PBGA-B420 S-PBGA-B420
JESD-609 code e1 e1 e0 e0
length 27 mm 27 mm 27 mm 27 mm
Humidity sensitivity level 3 3 3 3
Number of terminals 420 420 420 420
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LBGA LBGA LBGA
Encapsulate equivalent code BGA420,26X26,40 BGA420,26X26,40 BGA420,26X26,40 BGA420,26X26,40
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius) 260 260 225 225
power supply 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.7 mm 1.7 mm 1.7 mm 1.7 mm
Maximum supply voltage 1.1 V 1.1 V 1.1 V 1.1 V
Minimum supply voltage 0.9 V 0.9 V 0.9 V 0.9 V
Nominal supply voltage 1 V 1 V 1 V 1 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal form BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 30 20 20
width 27 mm 27 mm 27 mm 27 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches 1 1 1 1
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