SCANSTA101SM datasheet, PDF - EEWORLD Datasheet

SCANSTA101SM: DescriptionInterface - Specialized R 926-ANSTA101SM/NOPB; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，39 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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Interface - Specialized R 926-ANSTA101SM/NOPB

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it Rohs certified?	incompatible
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	LFBGA, BGA49,7X7,32
Contacts	49
Reach Compliance Code	not_compliant
ECCN code	EAR99
Factory Lead Time	1 week
Samacsys Description	STA Master
JESD-30 code	S-PBGA-B49
JESD-609 code	e0
length	7 mm
Humidity sensitivity level	3
Number of terminals	49
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA49,7X7,32
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	235
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	1.5 mm
Maximum supply voltage	3.6 V
Minimum supply voltage	3 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT

	SCANSTA101SM	SCANSTA101SMX
Description	Interface - Specialized R 926-ANSTA101SM/NOPB	Low Voltage IEEE 1149.1 System Test Access (STA) Master 49-NFBGA -40 to 85
Brand Name	Texas Instruments	Texas Instruments
Is it Rohs certified?	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments
Parts packaging code	BGA	BGA
package instruction	LFBGA, BGA49,7X7,32	LFBGA, BGA49,7X7,32
Contacts	49	49
Reach Compliance Code	not_compliant	_compli
ECCN code	EAR99	EAR99
Factory Lead Time	1 week	1 week
JESD-30 code	S-PBGA-B49	S-PBGA-B49
JESD-609 code	e0	e0
length	7 mm	7 mm
Humidity sensitivity level	3	3
Number of terminals	49	49
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFBGA
Encapsulate equivalent code	BGA49,7X7,32	BGA49,7X7,32
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	235	235
power supply	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	1.5 mm	1.5 mm
Maximum supply voltage	3.6 V	3.6 V
Minimum supply voltage	3 V	3 V
Nominal supply voltage	3.3 V	3.3 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	30
width	7 mm	7 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT

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