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SCANSTA101SMX

Description
Low Voltage IEEE 1149.1 System Test Access (STA) Master 49-NFBGA -40 to 85
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,39 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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SCANSTA101SMX Overview

Low Voltage IEEE 1149.1 System Test Access (STA) Master 49-NFBGA -40 to 85

SCANSTA101SMX Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it Rohs certified?incompatible
MakerTexas Instruments
Parts packaging codeBGA
package instructionLFBGA, BGA49,7X7,32
Contacts49
Reach Compliance Code_compli
ECCN codeEAR99
Factory Lead Time1 week
JESD-30 codeS-PBGA-B49
JESD-609 codee0
length7 mm
Humidity sensitivity level3
Number of terminals49
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Encapsulate equivalent codeBGA49,7X7,32
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)235
power supply3.3 V
Certification statusNot Qualified
Maximum seat height1.5 mm
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width7 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR CIRCUIT

SCANSTA101SMX Related Products

SCANSTA101SMX SCANSTA101SM
Description Low Voltage IEEE 1149.1 System Test Access (STA) Master 49-NFBGA -40 to 85 Interface - Specialized R 926-ANSTA101SM/NOPB
Brand Name Texas Instruments Texas Instruments
Is it Rohs certified? incompatible incompatible
Maker Texas Instruments Texas Instruments
Parts packaging code BGA BGA
package instruction LFBGA, BGA49,7X7,32 LFBGA, BGA49,7X7,32
Contacts 49 49
Reach Compliance Code _compli not_compliant
ECCN code EAR99 EAR99
Factory Lead Time 1 week 1 week
JESD-30 code S-PBGA-B49 S-PBGA-B49
JESD-609 code e0 e0
length 7 mm 7 mm
Humidity sensitivity level 3 3
Number of terminals 49 49
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFBGA LFBGA
Encapsulate equivalent code BGA49,7X7,32 BGA49,7X7,32
Package shape SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 235 235
power supply 3.3 V 3.3 V
Certification status Not Qualified Not Qualified
Maximum seat height 1.5 mm 1.5 mm
Maximum supply voltage 3.6 V 3.6 V
Minimum supply voltage 3 V 3 V
Nominal supply voltage 3.3 V 3.3 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL
Terminal pitch 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 NOT SPECIFIED
width 7 mm 7 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT

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