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70V639S15BCG

Description
Dual-Port SRAM, 128KX18, 15ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256
Categorystorage    storage   
File Size201KB,24 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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70V639S15BCG Overview

Dual-Port SRAM, 128KX18, 15ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256

70V639S15BCG Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instructionLBGA, BGA256,16X16,40
Contacts256
Reach Compliance Codecompliant
ECCN code3A991
Maximum access time15 ns
I/O typeCOMMON
JESD-30 codeS-PBGA-B256
JESD-609 codee1
length17 mm
memory density2359296 bit
Memory IC TypeDUAL-PORT SRAM
memory width18
Humidity sensitivity level3
Number of functions1
Number of ports2
Number of terminals256
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128KX18
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA256,16X16,40
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply2.5/3.3,3.3 V
Certification statusNot Qualified
Maximum seat height1.7 mm
Maximum standby current0.015 A
Minimum standby current3.15 V
Maximum slew rate0.44 mA
Maximum supply voltage (Vsup)3.45 V
Minimum supply voltage (Vsup)3.15 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width17 mm
Base Number Matches1
HIGH-SPEED 3.3V
128K x 18 ASYNCHRONOUS
DUAL-PORT STATIC RAM
Features
IDT70V639S
LEAD FINISH (SnPb) ARE IN EOL PROCESS - LAST TIME BUY EXPIRES JUNE 15, 2018
Functional Block Diagram
UB
L
LB
L
True Dual-Port memory cells which allow simultaneous
access of the same memory location
High-speed access
– Commercial: 10/12/15ns (max.)
– Industrial: 12/15ns (max.)
Dual chip enables allow for depth expansion without
external logic
IDT70V639 easily expands data bus width to 36 bits or
more using the Master/Slave select when cascading more
than one device
M/S = V
IH
for
BUSY
output flag on Master,
M/S = V
IL
for
BUSY
input on Slave
Busy and Interrupt Flags
On-chip port arbitration logic
Full on-chip hardware support of semaphore signaling
between ports
Fully asynchronous operation from either port
Separate byte controls for multiplexed bus and bus
matching compatibility
Supports JTAG features compliant to IEEE 1149.1
– Due to limited pin count, JTAG is not supported on the
128-pin TQFP package.
LVTTL-compatible, single 3.3V (±150mV) power supply for
core
LVTTL-compatible, selectable 3.3V (±150mV)/2.5V (±100mV)
power supply for I/Os and control signals on each port
Available in a 128-pin Thin Quad Flatpack, 208-ball fine
pitch Ball Grid Array, and 256-ball Ball Grid Array
Industrial temperature range (–40°C to +85°C) is available
for selected speeds
Green parts available, see ordering information
UB
R
LB
R
R/
W
L
B
E
0
L
B
E
1
L
B
E
1
R
B
E
0
R
R/
W
R
CE
0L
CE
1L
CE
0R
CE
1R
OE
L
Dout0-8_L
Dout9-17_L
Dout0-8_R
Dout9-17_R
OE
R
128K x 18
MEMORY
ARRAY
I/O
0L
- I/O
17L
Din_L
Din_R
I/O
0R
- I/O
17R
A
16L
A
0L
Address
Decoder
ADDR_L
ADDR_R
Address
Decoder
A
16R
A
0R
OE
L
CE
0L
CE
1L
R/W
L
BUSY
L
SEM
L
INT
L
ARBITRATION
INTERRUPT
SEMAPHORE
LOGIC
OE
R
CE
0R
CE
1R
R/W
R
BUSY
R
M/S
SEM
R
INT
R
TDI
TDO
JTAG
TMS
TCK
TRST
5621 drw 01
NOTES:
1.
BUSY
is an input as a Slave (M/S=V
IL
) and an output when it is a Master (M/S=V
IH
).
2.
BUSY
and
INT
are non-tri-state totem-pole outputs (push-pull).
JUNE 2018
DSC-5621/8
1
©2018 Integrated Device Technology, Inc.

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Description Dual-Port SRAM, 128KX18, 15ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256 Dual-Port SRAM, 128KX18, 15ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256 Application Specific SRAM, 128KX18, 15ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 Application Specific SRAM, 128KX18, 15ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 Dual-Port SRAM, 128KX18, 15ns, CMOS, PQFP128, 14 X 20 MM, 1.40 MM HEIGHT, GREEN, TQFP-128 Dual-Port SRAM, 128KX18, 15ns, CMOS, PQFP128, 14 X 20 MM, 1.40 MM HEIGHT, GREEN, TQFP-128 Dual-Port SRAM, 128KX18, 10ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, FPBGA-208 Dual-Port SRAM, 128KX18, 15ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, FPBGA-208 Dual-Port SRAM, 128KX18, 15ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, FPBGA-208
Is it lead-free? Lead free Lead free Contains lead Contains lead Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to incompatible incompatible conform to conform to conform to conform to conform to
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
package instruction LBGA, BGA256,16X16,40 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 LFQFP, QFP128,.63X.87,20 LFQFP, QFP128,.63X.87,20 LFBGA, BGA208,17X17,32 LFBGA, BGA208,17X17,32 LFBGA, BGA208,17X17,32
Reach Compliance Code compliant compliant not_compliant not_compliant compliant compliant compliant compliant compliant
Maximum access time 15 ns 15 ns 15 ns 15 ns 15 ns 15 ns 10 ns 15 ns 15 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 R-PQFP-G128 R-PQFP-G128 S-PBGA-B208 S-PBGA-B208 S-PBGA-B208
JESD-609 code e1 e1 e0 e0 e3 e3 e1 e1 e1
memory density 2359296 bit 2359296 bit 2359296 bit 2359296 bit 2359296 bit 2359296 bit 2359296 bit 2359296 bit 2359296 bit
Memory IC Type DUAL-PORT SRAM DUAL-PORT SRAM APPLICATION SPECIFIC SRAM APPLICATION SPECIFIC SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
memory width 18 18 18 18 18 18 18 18 18
Humidity sensitivity level 3 3 3 3 3 3 3 3 3
Number of functions 1 1 1 1 1 1 1 1 1
Number of ports 2 2 2 2 2 2 2 2 2
Number of terminals 256 256 256 256 128 128 208 208 208
word count 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words
character code 128000 128000 128000 128000 128000 128000 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 85 °C 85 °C 85 °C 70 °C 85 °C 70 °C 85 °C 70 °C
Minimum operating temperature - -40 °C -40 °C -40 °C - -40 °C - -40 °C -
organize 128KX18 128KX18 128KX18 128KX18 128KX18 128KX18 128KX18 128KX18 128KX18
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LBGA BGA BGA LFQFP LFQFP LFBGA LFBGA LFBGA
Encapsulate equivalent code BGA256,16X16,40 BGA256,16X16,40 BGA256,16X16,40 BGA256,16X16,40 QFP128,.63X.87,20 QFP128,.63X.87,20 BGA208,17X17,32 BGA208,17X17,32 BGA208,17X17,32
Package shape SQUARE SQUARE SQUARE SQUARE RECTANGULAR RECTANGULAR SQUARE SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY GRID ARRAY FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260 225 225 260 260 260 260 260
power supply 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.015 A 0.015 A 0.015 A 0.015 A 0.015 A 0.015 A 0.015 A 0.015 A 0.015 A
Minimum standby current 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V
Maximum slew rate 0.44 mA 0.49 mA 0.49 mA 0.49 mA 0.44 mA 0.49 mA 0.5 mA 0.49 mA 0.44 mA
Maximum supply voltage (Vsup) 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V
Minimum supply voltage (Vsup) 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb) Tin/Lead (Sn63Pb37) Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL BALL BALL BALL GULL WING GULL WING BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm 0.5 mm 0.5 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM QUAD QUAD BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 30 20 20 30 30 30 30 30
Base Number Matches 1 1 1 1 1 1 1 1 1
Parts packaging code BGA BGA - - QFP QFP BGA BGA BGA
Contacts 256 256 - - 128 128 208 208 208
ECCN code 3A991 3A991.B.2.A - - 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991 3A991.B.2.A
length 17 mm 17 mm - - 20 mm 20 mm 15 mm 15 mm 15 mm
Maximum seat height 1.7 mm 1.7 mm - - 1.6 mm 1.6 mm 1.7 mm 1.7 mm 1.7 mm
width 17 mm 17 mm - - 14 mm 14 mm 15 mm 15 mm 15 mm
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