NOTE: (1) Stresses above those listed above may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at
these or any other condition above those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
PIN CONNECTIONS
Top View
DIP/SOIC
I
OUT 1
I
OUT 2
GND
Bit 1 (MSB)
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
1
2
3
4
DAC7541A
5
6
7
8
9
18 R
FB
17 V
REF
16 +V
DD
15 Bit 12 (LSB)
14 Bit 11
13 Bit 10
12 Bit 9
11 Bit 8
10 Bit 7
ELECTROSTATIC
DISCHARGE SENSITIVITY
The DAC7541A is an ESD (electrostatic discharge) sensi-
tive device. The digital control inputs have a special FET
structure, which turns on when the input exceeds the supply
by 18V, to minimize ESD damage. However, permanent
damage may occur on unconnected devices subject to high
energy electrostatic fields. When not in use, devices must be
stored in conductive foam or shunts. The protective foam
should be discharged to the destination socket before
devices are removed.
BURN-IN SCREENING
Burn-in screening is an option available for the models in the
Ordering Information table. Burn-in duration is 160 hours at
the indicated temperature (or equivalent combination of time
and temperature).
All units are tested after burn-in to ensure that grade speci-
fications are met. To order burn-in, add “-BI” to the base
model number.
ORDERING INFORMATION
MODEL
DAC7541AJP
DAC7541AKP
DAC7541AJU
DAC7541AKU
PACKAGE
Plastic DIP
Plastic DIP
Plastic SOIC
Plastic SOIC
TEMPERATURE
RANGE
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
PACKAGE INFORMATION
MODEL
DAC7541JP
DAC7541KP
DAC7541JU
DAC7541KU
DAC7541JP-BI
DAC7541KP-BI
PACKAGE
Plastic DIP
Plastic DIP
Plastic SOIC
Plastic SOIC
Plastic DIP
Plastic DIP
PACKAGE DRAWING
NUMBER
(1)
218
218
219
219
218
218
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix D of Burr-Brown IC Data Book.
RELATIVE
ACCURACY (LSB)
±1
±1/2
±1
±1/2
GAIN ERROR (LSB)
±6
±1
±6
±1
BURN-IN SCREENING OPTION
See text for details.
MODEL
DAC7541AJP-BI
DAC7541AKP-BI
PACKAGE
Plastic DIP
Plastic DIP
TEMPERATURE
RANGE
0°C to +70°C
0°C to +70°C
RELATIVE
ACCURACY (LSB)
±1
±1/2
BURN-IN TEMP.
(160 Hours)
(1)
+85°C
+85°C
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN
assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject
to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not
authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.
®
3
DAC7541A
PAD
1
2
3
4
5
6
7
8
9
FUNCTION
I
OUT1
I
OUT2
GND
Bit 1 (MSB)
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
PAD
10
11
12
13
14
15
16
17
18
FUNCTION
Bit 7
Bit 8
Bit 9
Bit 10
Bit 11
Bit 12 (LSB)
+V
DD
V
REF
R
FEEDBACK
Substrate Bias:
Isolated.
NC: No Connection.
MECHANICAL INFORMATION
MILS (0.001")
Die Size
Die Thickness
Min. Pad Size
Metalization
104 x 105
±5
20
±3
4x4
MILLIMETERS
2.64 x 2.67
±0.13
0.51
±0.08
0.10 x 0.10
Aluminum
DIE TOPOLOGY DAC7541A
TYPICAL PERFORMANCE CURVES
T
A
= +25°C, V
DD
= +15V, unless otherwise noted.
GAIN ERROR vs SUPPLY VOLTAGE
3
5/2
Feedthrough (% FSR)
FEEDTHROUGH ERROR vs FREQUENCY
10
1
Gain Error (LSB)
2
3/2
1
1/2
0
0
5
10
15
Supply Voltage (V)
0.10
0.010
0.001
100
1k
10k
Frequency (Hz)
100k
1M
LINEARITY vs SUPPLY VOLTAGE
3/2
5/4
SUPPLY CURRENT vs SUPPLY VOLTAGE
3/2
5/4
Linearity Error (LSB)
Supply Current (µA)
1
3/4
1/2
1/4
0
0
5
10
15
Supply Voltage (V)
1
3/4
V
IH
= +2.4V
1/2
1/4
0
0
5
10
Supply Voltage (V)
V
IH
= V
DD
15
®
DAC7541A
4
DISCUSSION
OF SPECIFICATIONS
RELATIVE ACCURACY
This term (also known as linearity) describes the transfer
function of analog output to digital input code. The linearity
error describes the deviation from a straight line between
zero and full scale.
DIFFERENTIAL NONLINEARITY
Differential nonlinearity is the deviation from an ideal 1LSB
change in the output, from one adjacent output state to the
next. A differential nonlinearity specification of
±1.0LSB
guarantees monotonicity.
GAIN ERROR
Gain error is the difference in measure of full-scale output
versus the ideal DAC output. The ideal output for the
DAC7541A is –(4095/4096)
X
(V
REF
). Gain error may be
adjusted to zero using external trims.
OUTPUT LEAKAGE CURRENT
The measure of current which appears at Out
1
with the DAC
loaded with all zeros, or at Out
2
with the DAC loaded with
all ones.
MULTIPLYING FEEDTHROUGH ERROR
This is the AC error output due to capacitive feedthrough
from V
REF
to Out
1
with the DAC loaded with all zeros. This
test is performed at 10kHz.
OUTPUT CURRENT SETTLING TIME
This is the time required for the output to settle to a tolerance
of
±0.5LSB
of final value from a change in code of all zeros
to all ones, or all ones to all zeros.
PROPAGATION DELAY
This is the measure of the delay of the internal circuitry and
is measured as the time from a digital code change to the
point at which the output reaches 90% of final value.
DIGITAL-TO-ANALOG GLITCH IMPULSE
This is the measure of the area of the glitch energy measured
in nV-seconds. Key contributions to glitch energy are digital
Next-generation server, AI accelerator, and network system-on-chip (SoC) designs require increasing capabilities to meet the demands of faster data processing and advanced AI/machine learning workload...
I recently debugged the 51+CC2420 program. The CC2420 is a purchased module. I found that the SPI port communication was successful, and the SFD pin of the CC2420 on the sending end also sent out puls...
[i=s]This post was last edited by tingting4ever on 2015-1-30 14:24[/i] I'll give it a title first, and I'll come back this afternoon to add the content. . . It's so sad. . . Thanks to the first floor,...
The current problem is that the compiled boot and kernel cannot be downloaded into the system to start. This problem may be too broad and difficult to solve, but I still hope that you can provide the ...
Does the extern "C" in front of NTSTATUS DriverEntry mean that the Windows kernel is written in C? I have just started learning driver development, and I would like to ask for your advice....
In recent years, with the increasing demand for manufacturing and automated production management, industrial barcode scanners have gradually become an indispensable part of the industrial manufact...[Details]
Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
Some time ago, I attended the 4th Energy Chemistry Forum of the Chinese Chemical Society and learned about high-energy-density and high-safety batteries. I would like to summarize and share this wi...[Details]
As the number of cars increases, environmental pressures are also increasing. At this time, some people are saying that new energy vehicles are energy-efficient and environmentally friendly, and ar...[Details]
When we travel in cities, we all find that electric vehicles have many advantages. As a means of transportation, they can also fulfill their mission well. Now, more and more residential communities...[Details]
Limited vocabulary recognition
According to the number of characters, words or short sentences in the vocabulary, it can be roughly divided into: less than 100 is small vocabulary; 100-1000 is...[Details]
For healthcare professionals, accurate diagnosis and treatment are crucial for a clear picture of a person's health. However, healthcare professionals often rely on tests at medical facilities, cli...[Details]
According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
Gross profit margin jumped from 13.6% in the first half of last year to 25.9%, almost doubling year-on-year.
On August 21, RoboSense released its interim performance report, in which the...[Details]
Recently, South Korean robotics giant WIRobotics launched its first general-purpose humanoid robot, ALLEX, at the Robotics Innovation Center (RIH) at the Korea University of Science and Technology....[Details]
On August 22, South Korean media Nate reported on the 20th local time that Samsung Electronics is introducing Hyper Cell technology into its most advanced 2nm process technology, striving to improv...[Details]
PowiGaN achieves 95% efficiency at both light and full loads, meeting critical operational and safety requirements.
DARWIN, Australia and SAN JOSE, Calif.,
August 22, 2025 – Powe...[Details]
As the range of electric vehicles continues to increase, driving electric vehicles for long-distance travel has become a trend. For high-speed travel, how much impact will high-speed driving of ele...[Details]
For today's new energy vehicles, they have different configurations from fuel vehicles, and some configurations have also become a selling point for manufacturers. Compared with traditional vehicle...[Details]
On August 21, it was reported that Intel's new generation of AI chip Jaguar Shores was recently exposed for the first time.
According to photos shared by Andreas Schilling, the Jaguar Shores t...[Details]
Integrated technical exchanges
京公网安备 11010802033920号
EEWORLD
