EE PLD, 55ns, CMOS, CQCC20, 0.350 X 0.350 INCH, CERAMIC, LCC-20
| Parameter Name | Attribute value |
| Maker | AMD |
| Parts packaging code | QLCC |
| package instruction | QCCN, |
| Contacts | 20 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| Other features | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET |
| maximum clock frequency | 28.6 MHz |
| JESD-30 code | S-CQCC-N20 |
| JESD-609 code | e0 |
| length | 8.89 mm |
| Dedicated input times | 8 |
| Number of I/O lines | 8 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 8 DEDICATED INPUTS, 8 I/O |
| Output function | MACROCELL |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCN |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Programmable logic type | EE PLD |
| propagation delay | 55 ns |
| Certification status | Not Qualified |
| Maximum seat height | 2.54 mm |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| width | 8.89 mm |
| Base Number Matches | 1 |
| 5962-89839012A | 5962-8983902RA | 5962-89839022A | 5962-89839032A | 5962-8983901RA | 5962-8983903RA | PALCE16V8H-10E5/B2A | PALCE16V8H-10E5/BRA | PALCE16V8H-15E5/B2A | PALCE16V8H-15E5/BRA | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | EE PLD, 55ns, CMOS, CQCC20, 0.350 X 0.350 INCH, CERAMIC, LCC-20 | EE PLD, 20ns, CMOS, CDIP20, 0.250 X 1.166 INCH, CERAMIC, DIP-20 | EE PLD, 20ns, CMOS, CQCC20, 0.350 X 0.350 INCH, CERAMIC, LCC-20 | EE PLD, 15ns, CMOS, CQCC20, 0.350 X 0.350 INCH, CERAMIC, LCC-20 | EE PLD, 55ns, CMOS, CDIP20, 0.250 X 1.166 INCH, CERAMIC, DIP-20 | EE PLD, 15ns, CMOS, CDIP20, 0.250 X 1.166 INCH, CERAMIC, DIP-20 | EE PLD, 10ns, PAL-Type, CMOS, CQCC20, CERAMIC, LCC-20 | EE PLD, 10ns, PAL-Type, CMOS, CDIP20, CERAMIC, DIP-20 | EE PLD, 15ns, PAL-Type, CMOS, CQCC20, CERAMIC, LCC-20 | EE PLD, 15ns, PAL-Type, CMOS, CDIP20, CERAMIC, DIP-20 |
| Parts packaging code | QLCC | DIP | QLCC | QLCC | DIP | DIP | QLCC | DIP | QLCC | DIP |
| package instruction | QCCN, | DIP, | QCCN, | QCCN, | DIP, | DIP, | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 |
| Contacts | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| Other features | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET |
| maximum clock frequency | 28.6 MHz | 33.3 MHz | 33.3 MHz | 41.6 MHz | 28.6 MHz | 41.6 MHz | 58.5 MHz | 58.5 MHz | 41.6 MHz | 41.6 MHz |
| JESD-30 code | S-CQCC-N20 | R-GDIP-T20 | S-CQCC-N20 | S-CQCC-N20 | R-GDIP-T20 | R-GDIP-T20 | S-CQCC-N20 | R-GDIP-T20 | S-CQCC-N20 | R-GDIP-T20 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 8.89 mm | 24.257 mm | 8.89 mm | 8.89 mm | 24.257 mm | 24.257 mm | 8.89 mm | 24.257 mm | 8.89 mm | 24.257 mm |
| Dedicated input times | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of I/O lines | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| organize | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O |
| Output function | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| encapsulated code | QCCN | DIP | QCCN | QCCN | DIP | DIP | QCCN | DIP | QCCN | DIP |
| Package shape | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE |
| Programmable logic type | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
| propagation delay | 55 ns | 20 ns | 20 ns | 15 ns | 55 ns | 15 ns | 10 ns | 10 ns | 15 ns | 15 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.54 mm | 5.08 mm | 2.54 mm | 2.54 mm | 5.08 mm | 5.08 mm | 2.54 mm | 5.08 mm | 2.54 mm | 5.08 mm |
| Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES | YES | NO | NO | YES | NO | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | QUAD | DUAL | QUAD | QUAD | DUAL | DUAL | QUAD | DUAL | QUAD | DUAL |
| width | 8.89 mm | 7.62 mm | 8.89 mm | 8.89 mm | 7.62 mm | 7.62 mm | 8.89 mm | 7.62 mm | 8.89 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |