Microcontroller, 8-Bit, MROM, 12MHz, CMOS, PQFP18, SOIC-18
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IXYS |
| Parts packaging code | SOIC |
| package instruction | SOIC-18 |
| Contacts | 18 |
| Reach Compliance Code | unknown |
| Has ADC | NO |
| Address bus width | |
| bit size | 8 |
| maximum clock frequency | 12 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | |
| JESD-30 code | R-PQFP-G18 |
| JESD-609 code | e0 |
| length | 11.575 mm |
| Number of I/O lines | 12 |
| Number of terminals | 18 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| PWM channel | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QFP |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Peak Reflow Temperature (Celsius) | 225 |
| Certification status | Not Qualified |
| ROM programmability | MROM |
| Maximum seat height | 2.65 mm |
| speed | 12 MHz |
| Maximum slew rate | 15 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| width | 7.5 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| Base Number Matches | 1 |
| Z8611612SSC | Z8611612SSG | |
|---|---|---|
| Description | Microcontroller, 8-Bit, MROM, 12MHz, CMOS, PQFP18, SOIC-18 | Microcontroller, 8-Bit, MROM, 12MHz, CMOS, PQFP18, SOIC-18 |
| Is it lead-free? | Contains lead | Lead free |
| Parts packaging code | SOIC | SOIC |
| package instruction | SOIC-18 | SOIC-18 |
| Contacts | 18 | 18 |
| Reach Compliance Code | unknown | compliant |
| Has ADC | NO | NO |
| bit size | 8 | 8 |
| maximum clock frequency | 12 MHz | 12 MHz |
| DAC channel | NO | NO |
| DMA channel | NO | NO |
| JESD-30 code | R-PQFP-G18 | R-PQFP-G18 |
| JESD-609 code | e0 | e3 |
| length | 11.575 mm | 11.575 mm |
| Number of I/O lines | 12 | 12 |
| Number of terminals | 18 | 18 |
| Maximum operating temperature | 70 °C | 70 °C |
| PWM channel | NO | NO |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QFP | QFP |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | FLATPACK |
| Peak Reflow Temperature (Celsius) | 225 | 225 |
| Certification status | Not Qualified | Not Qualified |
| ROM programmability | MROM | MROM |
| Maximum seat height | 2.65 mm | 2.65 mm |
| speed | 12 MHz | 12 MHz |
| Maximum slew rate | 15 mA | 15 mA |
| Maximum supply voltage | 5.5 V | 5.5 V |
| Minimum supply voltage | 3 V | 3 V |
| surface mount | YES | YES |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | TIN |
| Terminal form | GULL WING | GULL WING |
| Terminal pitch | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | QUAD |
| Maximum time at peak reflow temperature | 30 | 30 |
| width | 7.5 mm | 7.5 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER |
| Base Number Matches | 1 | 1 |
京公网安备 11010802033920号
EEWORLD
