Z8611612SSG datasheet, PDF - EEWORLD Datasheet

Z8611612SSG: DescriptionMicrocontroller, 8-Bit, MROM, 12MHz, CMOS, PQFP18, SOIC-18; CategoryThe embedded processor and controller Microcontrollers and processors; File Size225KB，9 Pages; ManufacturerIXYS; Environmental Compliance

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Z8611612SSG Overview

Microcontroller, 8-Bit, MROM, 12MHz, CMOS, PQFP18, SOIC-18

Parameter Name	Attribute value
Is it lead-free?	Lead free
Parts packaging code	SOIC
package instruction	SOIC-18
Contacts	18
Reach Compliance Code	compliant
Has ADC	NO
Address bus width
bit size	8
maximum clock frequency	12 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	R-PQFP-G18
JESD-609 code	e3
length	11.575 mm
Number of I/O lines	12
Number of terminals	18
Maximum operating temperature	70 °C
Minimum operating temperature
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Package shape	RECTANGULAR
Package form	FLATPACK
Peak Reflow Temperature (Celsius)	225
Certification status	Not Qualified
ROM programmability	MROM
Maximum seat height	2.65 mm
speed	12 MHz
Maximum slew rate	15 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	7.5 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

	Z8611612SSG	Z8611612SSC
Description	Microcontroller, 8-Bit, MROM, 12MHz, CMOS, PQFP18, SOIC-18	Microcontroller, 8-Bit, MROM, 12MHz, CMOS, PQFP18, SOIC-18
Is it lead-free?	Lead free	Contains lead
Parts packaging code	SOIC	SOIC
package instruction	SOIC-18	SOIC-18
Contacts	18	18
Reach Compliance Code	compliant	unknown
Has ADC	NO	NO
bit size	8	8
maximum clock frequency	12 MHz	12 MHz
DAC channel	NO	NO
DMA channel	NO	NO
JESD-30 code	R-PQFP-G18	R-PQFP-G18
JESD-609 code	e3	e0
length	11.575 mm	11.575 mm
Number of I/O lines	12	12
Number of terminals	18	18
Maximum operating temperature	70 °C	70 °C
PWM channel	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QFP	QFP
Package shape	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	FLATPACK
Peak Reflow Temperature (Celsius)	225	225
Certification status	Not Qualified	Not Qualified
ROM programmability	MROM	MROM
Maximum seat height	2.65 mm	2.65 mm
speed	12 MHz	12 MHz
Maximum slew rate	15 mA	15 mA
Maximum supply voltage	5.5 V	5.5 V
Minimum supply voltage	3 V	3 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal surface	TIN	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING
Terminal pitch	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD
Maximum time at peak reflow temperature	30	30
width	7.5 mm	7.5 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER
Base Number Matches	1	1

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