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8403607JA

Description
2KX8 STANDARD SRAM, 120ns, CDIP24, CERAMIC, DIP-24
Categorystorage    storage   
File Size218KB,27 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric Compare View All

8403607JA Overview

2KX8 STANDARD SRAM, 120ns, CDIP24, CERAMIC, DIP-24

8403607JA Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerRenesas Electronics Corporation
Parts packaging codeDIP
package instructionCERAMIC, DIP-24
Contacts24
Reach Compliance Codenot_compliant
ECCN code3A001.A.2.C
Maximum access time120 ns
Other featuresTTL COMPATIBLE
JESD-30 codeR-GDIP-T24
memory density16384 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals24
word count2048 words
character code2000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize2KX8
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height5.72 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm
Base Number Matches1
REVISIONS
LTR
E
DESCRIPTION
Change to vendor similar part number for vendor CAGE number
61772 for devices 08KX, 09KX, 10KX, 11KX, 12KX, 13KX, 14KX,
15KX, and 16KX. Remove vendor CAGE number 61772 from devices
08YX, 09YX, 10YX, 11YX, 12YX, 13YX, 15YX, and 16YX. Change to
vendor similar part number for vendor CAGE number 65786 for
devices 09 and 11. Add vendor CAGE number 50088 to the drawing
as a source of supply for devices 04JX and 05JX. Add vendor CAGE
number 65896 to the drawing as a source of supply for devices 15 and
16. Removed 4.3.3 from drawing. Editorial changes throughout.
Added provisions for the addition of QD certified parts to drawing.
Updated boilerplate. Added CAGE OC7V7 as supplier. - ksr
DATE (YR-MO-DA)
92-04-27
APPROVED
M. A. Frye
F
00-09-27
Raymond Monnin
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED
CURRENT CAGE CODE 67268
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
F
15
F
16
F
17
F
18
REV
SHEET
PREPARED BY
James E. Jamison
F
19
F
20
F
21
F
1
F
22
F
2
F
3
F
4
F
5
F
6
F
7
F
8
F
9
F
10
F
11
F
12
F
13
F
14
STANDARD
MICROCIRCUIT
DRAWING
CHECKED BY
Ray Monnin
APPROVED BY
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
Don Cool
DRAWING APPROVAL DATE
84 – 08 - 24
MICROCIRCUITS, MEMORY,
DIGITAL, CMOS, 16K
(2048 X 8) BIT STATIC RAM,
MONOLITHIC SILICON
SIZE
A
SHEET
CAGE CODE
AMSC N/A
REVISION LEVEL
F
14933
1 OF
22
84036
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E173-00

8403607JA Related Products

8403607JA 8403607ZA 8403601JA 8403601ZA
Description 2KX8 STANDARD SRAM, 120ns, CDIP24, CERAMIC, DIP-24 2KX8 STANDARD SRAM, 120ns, CQCC32, CERAMIC, CC-32 2KX8 STANDARD SRAM, 200ns, CDIP24, CERAMIC, DIP-24 2KX8 STANDARD SRAM, 200ns, CQCC32, CERAMIC, CC-32
Maker Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
Parts packaging code DIP QFJ DIP QFN
package instruction CERAMIC, DIP-24 CERAMIC, LCC-32 CERAMIC, DIP-24 CERAMIC, CC-32
Contacts 24 32 24 32
Reach Compliance Code not_compliant unknown not_compliant unknown
ECCN code 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
Maximum access time 120 ns 120 ns 200 ns 200 ns
Other features TTL COMPATIBLE TTL COMPATIBLE TTL COMPATIBLE TTL COMPATIBLE
JESD-30 code R-GDIP-T24 R-CQCC-N32 R-GDIP-T24 R-CQCC-N32
memory density 16384 bit 16384 bit 16384 bit 16384 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8 8
Number of functions 1 1 1 1
Number of terminals 24 32 24 32
word count 2048 words 2048 words 2048 words 2048 words
character code 2000 2000 2000 2000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C
organize 2KX8 2KX8 2KX8 2KX8
Package body material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
encapsulated code DIP QCCN DIP QCCN
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE CHIP CARRIER IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.72 mm 3.05 mm 5.72 mm 3.05 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount NO YES NO YES
technology CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY
Terminal form THROUGH-HOLE NO LEAD THROUGH-HOLE NO LEAD
Terminal pitch 2.54 mm 1.27 mm 2.54 mm 1.27 mm
Terminal location DUAL QUAD DUAL QUAD
width 15.24 mm 11.43 mm 15.24 mm 11.43 mm

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