EEWORLDEEWORLDEEWORLD

Part Number

Search

8421-150812

Description
IC Socket, DIP8, 8 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder
CategoryThe connector    socket   
File Size100KB,1 Pages
ManufacturerConexcon Group
Environmental Compliance
Download Datasheet Parametric View All

8421-150812 Overview

IC Socket, DIP8, 8 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder

8421-150812 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerConexcon Group
Reach Compliance Codeunknown
body width0.402 inch
subject depth0.354 inch
body length0.5 inch
Contact to complete cooperationAU ON NI
Contact materialBE-CU
Contact styleRND PIN-SKT
current rating1 A
Device slot typeIC SOCKET
Type of equipment usedDIP8
Dielectric withstand voltage1000VAC V
Shell materialGLASS FILLED POLYPHENYLENE SULPHIDE
Insulation resistance1000000000 Ω
Manufacturer's serial number8421
Plug contact pitch0.1 inch
Installation methodSTRAIGHT
Number of contacts8
Maximum operating temperature105 °C
Minimum operating temperature-40 °C
PCB contact patternRECTANGULAR
PCB contact row spacing0.3 mm
Terminal pitch2.54 mm
Termination typeSOLDER
Base Number Matches1
MACHINED CONTACT IC SOCKET
8421 SERIES.
2.54 mm. (0.100”) Pitch.
General Features
Electrical Features
Available in 6 through 64 circuits
Mates with pin headers 2.54 mm pitch 8424 series
Accept round pin 0.40 mm to 0.56 mm
Machined contact with different plating
Voltage rating: < 150 V
Current rating: < 1 A
Contact resistance: < 10 mΩ
Dielectric withstanding voltage: 1000 V AC/minute
Insulation resistance: >1000 MΩ
Materials
Mechanical Features
Insulator: PPS Black + 30% GF UL 94 V-0
Contact: Clip(4 fingers): Beryllium copper
Sleeve: Brass
Operating temperature. -40ºC to +105ºC
RoHS compliant
Insertion force per pin: < 0.20 Kgf (round pin 0.43 mm)
Withdrawal force per pin: > 0.03 Kgf (round pin 0.43 mm)
Durability: 500 cycles
Figuras y dimensiones
D±0.20
Circuits
06
08
10
14
16
18
20
22
24
28
20
22
24
28
32
24
28
32
36
40
42
48
50
52
50
52
64
Part Number
8421-T061L*
8421-T081L*
8421-T101L*
8421-T141L*
8421-T161L*
8421-T181L*
8421-T201L*
8421-T221L*
8421-T241L*
8421-T281L*
8421-T202L*
8421-T222L*
8421-T242L*
8421-T282L*
8421-T322L*
8421-T243L*
8421-T283L*
8421-T323L*
8421-T363L*
8421-T403L*
8421-T423L*
8421-T483L*
8421-T503L*
8421-T523L*
8421-T504L*
8421-T524L*
8421-T644L*
DIMENSIONS
XX
2.54±0.10
A
=
2.54
2
1
XX
ø0.50
B
=
2.54
2
A
B
A
7.62
10.16
12.70
17.78
20.32
22.86
25.40
27.94
30.48
35.56
25.40
27.94
30.48
35.56
40.64
30.48
35.56
40.64
45.72
50.80
53.34
60.96
63.50
66.04
63.50
66.04
81.28
Dimensions
B
C
10,16
7.62
12,70
7.62
15,24
7.62
20,32
7.62
22.86
7.62
25.40
7.62
27.94
7.62
30.48
7.62
33,02
7.62
38.10
7.62
27,94
30,48
33,02
38.10
43,18
33,02
38.10
43,18
48,26
53,34
55,88
63,50
66,04
68,58
66,04
68,58
83,82
10.16
10.16
10.16
10.16
10.16
15.24
15.24
15.24
15.24
15.24
15.24
15.24
15.24
15.24
22.86
22.86
22.86
D
10.20
10.20
10.20
10.20
10.20
10.20
10.20
10.20
10.20
10.20
12.70
12.70
12.70
12.70
12.70
17.80
17.80
17.80
17.80
17.80
17.80
17.80
17.80
17.80
25.40
25.40
25.40
C = 7.62 mm. for 16, 20 and 22 circuits
C = 15.24 mm. for 40, 42, 48, 52 and 56 circuits
D = 12.6 mm. for 24, 30, and 32 circuits
3.80
D = 10.1 mm. for 16, 20 and 22 circuits
2.40
C = 10.16 mm. for 24, 30, and 32 circuits
E
D = 17.72 mm. for 40, 42, 48, 52, and 56 circuits
(XX) = Number of circuits
ø1.00
C±0.10
RECOMMENDED HOLE PATTERN
(Tolerance ±0.05)
3.20
2.54
ø0.80
C
3.00±0.15
T = Contact Plating
T =
13.
Selec. gold flash over 30-50µ" Ni overall
Recommended Finish
T =
15.
15µ" selec. gold over 30-50µ" Ni overall
T =
16.
30µ" selec. gold over 30-50µ" Ni overall
L* = Connector Height
L =
1. E
= 4.20 mm.
L =
2. E
= 9.00 mm.
E-XX
FULL LINE CATALOGUE
Design of multi-channel controllable pulse delay system based on FPGA
[font=Verdana][b]Design of multi-channel controllable pulse delay system based on FPGA[/b][/font] A multi-channel pulse delay system with a maximum resolution of 0.15 ns is designed by using digital a...
aimyself FPGA/CPLD
Exploring IT genes: Recording the internal control transformation of JA Solar
Abstract: In 2007, Shanghai JA Solar successfully listed on NASDAQ in less than a year and a half, taking advantage of the development of the photovoltaic industry. In recent years, the emerging photo...
weaver Energy Infrastructure?
About the connection problem between CCSV5 and MSP430F5529 development board
I just came into contact with this development environment and software. In the process of learning routines, I found that I could not download the program to the development board and there was a pro...
zi_mian Microcontroller MCU
Since Avatar is so popular, let’s take a look at its communication (Part 3)
In "Avatar", humans can transmit data and communicate at high speed across a vast area on the distant planet Pandora. This may be the future 4G or 5G technology. Although CES did not give a practical ...
clark MCU
Shouldn’t students from Class 09 participate in the national competition?
[i=s]This post was last edited by paulhyde on 2014-9-15 08:53[/i]Today the teacher told us that it is recommended that students from Class 2009 do not participate in the national competition. If they ...
欣之 Electronics Design Contest
Shengrun CC2640 SDK Application Getting Started Tutorial 4
[color=#666666][font="][size=14px]Sorry for keeping you waiting, here is the Shengrun CC2640 SDK Application Tutorial 4 - BLE and Serial Data Transmission. In the previous experiment, the mobile phone...
昇润科技 TI Technology Forum

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 584  2233  2612  1092  1182  12  45  53  22  24 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号