64X4 OTHER FIFO, 16ns, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DIP, DIP24,.3 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 16 ns |
| Other features | REGISTER BASED; FALL THRU 1.0NS; PORTA/PORTB:CONFIGURABLE |
| period time | 18 ns |
| JESD-30 code | R-PDIP-T24 |
| JESD-609 code | e0 |
| length | 31.915 mm |
| memory density | 256 bit |
| Memory IC Type | OTHER FIFO |
| memory width | 4 |
| Number of functions | 1 |
| Number of terminals | 24 |
| word count | 64 words |
| character code | 64 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 64X4 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL/SERIAL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum slew rate | 0.215 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |
| Base Number Matches | 1 |
| 74F433SPC | 54F433SDMQB | 54F433FMQB | 54F433LMQB | |
|---|---|---|---|---|
| Description | 64X4 OTHER FIFO, 16ns, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 | IC,FIFO,64X4,ASYNCHRONOUS,F-TTL,DIP,24PIN,CERAMIC | IC,FIFO,64X4,ASYNCHRONOUS,F-TTL,FP,24PIN,CERAMIC | IC,FIFO,64X4,ASYNCHRONOUS,F-TTL,LLCC,28PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| package instruction | DIP, DIP24,.3 | DIP, DIP24,.3 | DFP, FL24,.4 | QCCN, LCC28,.45SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| JESD-30 code | R-PDIP-T24 | R-XDIP-T24 | R-XDFP-F24 | S-XQCC-N28 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Memory IC Type | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| memory width | 4 | 4 | 4 | 4 |
| Number of terminals | 24 | 24 | 24 | 28 |
| word count | 64 words | 64 words | 64 words | 64 words |
| character code | 64 | 64 | 64 | 64 |
| Operating mode | SYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | - | -55 °C | -55 °C | -55 °C |
| organize | 64X4 | 64X4 | 64X4 | 64X4 |
| Package body material | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DFP | QCCN |
| Encapsulate equivalent code | DIP24,.3 | DIP24,.3 | FL24,.4 | LCC28,.45SQ |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| Package form | IN-LINE | IN-LINE | FLATPACK | CHIP CARRIER |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 0.215 mA | 0.215 mA | 0.215 mA | 0.215 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | YES |
| technology | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | FLAT | NO LEAD |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 |
| Filter level | - | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
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