54F433FMQB datasheet, PDF - EEWORLD Datasheet

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54F433FMQB: DescriptionIC,FIFO,64X4,ASYNCHRONOUS,F-TTL,FP,24PIN,CERAMIC; Categorystorage storage; File Size729KB，14 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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54F433FMQB Overview

IC,FIFO,64X4,ASYNCHRONOUS,F-TTL,FP,24PIN,CERAMIC

54F433FMQB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DFP, FL24,.4
Reach Compliance Code	unknown
JESD-30 code	R-XDFP-F24
JESD-609 code	e0
Memory IC Type	OTHER FIFO
memory width	4
Number of terminals	24
word count	64 words
character code	64
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	64X4
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL24,.4
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum slew rate	0.215 mA
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

54F433FMQB Related Products

	54F433FMQB	54F433SDMQB	54F433LMQB	74F433SPC
Description	IC,FIFO,64X4,ASYNCHRONOUS,F-TTL,FP,24PIN,CERAMIC	IC,FIFO,64X4,ASYNCHRONOUS,F-TTL,DIP,24PIN,CERAMIC	IC,FIFO,64X4,ASYNCHRONOUS,F-TTL,LLCC,28PIN,CERAMIC	64X4 OTHER FIFO, 16ns, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	DFP, FL24,.4	DIP, DIP24,.3	QCCN, LCC28,.45SQ	DIP, DIP24,.3
Reach Compliance Code	unknown	unknown	unknown	unknown
JESD-30 code	R-XDFP-F24	R-XDIP-T24	S-XQCC-N28	R-PDIP-T24
JESD-609 code	e0	e0	e0	e0
Memory IC Type	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO
memory width	4	4	4	4
Number of terminals	24	24	28	24
word count	64 words	64 words	64 words	64 words
character code	64	64	64	64
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	70 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-
organize	64X4	64X4	64X4	64X4
Package body material	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY
encapsulated code	DFP	DIP	QCCN	DIP
Encapsulate equivalent code	FL24,.4	DIP24,.3	LCC28,.45SQ	DIP24,.3
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	FLATPACK	IN-LINE	CHIP CARRIER	IN-LINE
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	0.215 mA	0.215 mA	0.215 mA	0.215 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	NO
technology	TTL	TTL	TTL	TTL
Temperature level	MILITARY	MILITARY	MILITARY	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	FLAT	THROUGH-HOLE	NO LEAD	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	QUAD	DUAL
Base Number Matches	1	1	1	1
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	-

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