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7400FCQM

Description
NAND Gate, TTL, CDFP14,
Categorylogic    logic   
File Size160KB,4 Pages
ManufacturerFairchild
Websitehttp://www.fairchildsemi.com/
Download Datasheet Parametric Compare View All

7400FCQM Overview

NAND Gate, TTL, CDFP14,

7400FCQM Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerFairchild
package instructionDFP, FL14,.3
Reach Compliance Codecompliant
JESD-30 codeR-XDFP-F14
JESD-609 codee0
Logic integrated circuit typeNAND GATE
MaximumI(ol)0.016 A
Number of terminals14
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC
encapsulated codeDFP
Encapsulate equivalent codeFL14,.3
Package shapeRECTANGULAR
Package formFLATPACK
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Maximum supply current (ICC)22 mA
Prop。Delay @ Nom-Sup22 ns
Certification statusNot Qualified
Schmitt triggerNO
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyTTL
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1

7400FCQM Related Products

7400FCQM 7400DCQR 7400FCQR 7400PCQM
Description NAND Gate, TTL, CDFP14, NAND Gate, TTL, CDIP14, NAND Gate, TTL, CDFP14, NAND Gate, TTL, PDIP14,
Is it lead-free? Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker Fairchild Fairchild Fairchild Fairchild
Reach Compliance Code compliant compliant compliant compliant
JESD-30 code R-XDFP-F14 R-XDIP-T14 R-XDFP-F14 R-PDIP-T14
JESD-609 code e0 e0 e0 e0
Logic integrated circuit type NAND GATE NAND GATE NAND GATE NAND GATE
MaximumI(ol) 0.016 A 0.016 A 0.016 A 0.016 A
Number of terminals 14 14 14 14
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
Package body material CERAMIC CERAMIC CERAMIC PLASTIC/EPOXY
encapsulated code DFP DIP DFP DIP
Encapsulate equivalent code FL14,.3 DIP14,.3 FL14,.3 DIP14,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK IN-LINE FLATPACK IN-LINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V
Maximum supply current (ICC) 22 mA 22 mA 22 mA 22 mA
Prop。Delay @ Nom-Sup 22 ns 22 ns 22 ns 22 ns
Schmitt trigger NO NO NO NO
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount YES NO YES NO
technology TTL TTL TTL TTL
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form FLAT THROUGH-HOLE FLAT THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Base Number Matches 1 1 1 1
package instruction DFP, FL14,.3 - DFP, FL14,.3 DIP, DIP14,.3
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